Patents Examined by Barrry M.L. Standig
  • Patent number: 5813884
    Abstract: There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: September 29, 1998
    Assignee: Ford Global Technologies, Inc.
    Inventors: Yi-Hsin Pao, Dangrong Ronald Liu, Chan-Jiun Ed Jih, Xu Song