Abstract: There is disclosed herein a leadless electronic component (LEC) which avoids solder joint crack initiation. A preferred embodiment of the LEC 110 comprises a body portion 112 having terminations 114 arranged thereabout, each termination having a bottom portion 124 with an interior edge 126, wherein the interior edge has a substantially meniscus-like shape oriented so as to be concave with respect to a centroid of the LEC.
Type:
Grant
Filed:
April 7, 1997
Date of Patent:
September 29, 1998
Assignee:
Ford Global Technologies, Inc.
Inventors:
Yi-Hsin Pao, Dangrong Ronald Liu, Chan-Jiun Ed Jih, Xu Song