Patents Examined by Barry Standig
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Patent number: 6099357Abstract: The contact set of a plug connector part such as a contact plug or a contact jack for high frequency data transmission over electric conductors comprises a row of contact points for connecting to corresponding contact points of the mating component of the plug or jack which are connected over conductors with insulation piercing connecting devices. At least adjacent conductors (1, 2) are arranged so they wrap around one another at a predetermined distance in their common plane between the insulation piercing connecting devices (11, 12) and the contact springs (21, 22) forming the contact points for compensation of the capacitive and inductive coupling.This avoids crossover and recrossing in different planes, but now a type of crossing is achieved in a plane common to all conductors. In addition, both the capacitive and the inductive coupling can be compensated effectively and equally beyond the 300 MHz range.Type: GrantFiled: May 28, 1998Date of Patent: August 8, 2000Assignee: Reichle +De-Massari AGInventor: Hans Reichle
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Patent number: 6053753Abstract: A sealed electrical connector employs electrical contacts located in a housing with multiple contact receiving apertures, deflectable latches, and a seal section. A wire seal is mounted on the seal section, and a seal retainer is latched to the housing to retain the wire seal within the seal retainer and on the seal section. Wire seal sections are positioned within a seal retainer chamber with sufficient annular and radial clearance to permit deflection of the seal section due to transverse forces on the wires, without affecting the seal integrity around the wires. A lock plate is attachable to a housing mating face initially in a pre-staged position and shiftable to a locked position to prevent undesired deflection of the contact latch. The lock plate includes a tab forming an interference fit in a housing slot to hold the lock plate in either the pre-staged position or the locked position.Type: GrantFiled: January 30, 1998Date of Patent: April 25, 2000Assignee: The Whitaker CorporationInventor: John Philip Kunkle
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Patent number: 5967856Abstract: Connector block (3) comprising at least one contact member (22) provided with a first contact terminal (10) for electrical contact to a contact terminal (60) of a mating connector (2), a second contact terminal (9) and a spring subdivision (13) giving the contact member a resilient capacity in its axial direction, the first contact terminal (10), the second contact terminal (9) and the spring subdivision (13) being integrally made and the spring subdivision (13) having a corrugated compression spring with equally spaced sinusoidal subdivisions, each of the first contact terminals (10) being provided with bent extremity (16).Type: GrantFiled: May 7, 1997Date of Patent: October 19, 1999Assignee: Berg Technology, Inc.Inventor: Andrew G. Meller
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Patent number: 5911586Abstract: This disclosure describes an electrical power cord or adapter which, by using a lock and key mechanism, will enable or disable power from flowing through said power cord or adapter. It also describes various methods for locking and unlocking a plug to and from the female receptacle of said power cord or adapter. The purpose of such a power cord or adapter is to prevent unauthorized use of any electrical device that may be plugged in to said power cord or adapter, by disabling a flow of current to that device and by locking the plug of that device to the female receptacle of said power cord or adapter. When the appropriate key is used, power flow may be resumed, or the plug may be removed.Type: GrantFiled: May 30, 1997Date of Patent: June 15, 1999Inventor: H. Peter Wintergerst
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Patent number: 5906497Abstract: A processor retention frame and incorporated processor extraction handle is described herein. The frame is fabricated from a single piece of sheet metal, holds two processor cards securely, and is easily mounted on the main system board. The extractor handle allows the easy removal of processor cards from the main system board and frame without exerting excessive force on the main system board or the processor board.Type: GrantFiled: December 12, 1997Date of Patent: May 25, 1999Assignee: Hewlett Packard CompanyInventors: Hoa Pham, Gwen Bertolami
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Patent number: 5897406Abstract: An electrical terminal is provided for an electrically heated glass sheet. The terminal includes a base plate defining a central axis generally perpendicular thereto. The base plate is concentric about the axis to facilitate spin-soldering the terminal to a conductive pad on the glass sheet. A terminal post projects upwardly from the base plate for connection to an appropriate mating terminal. The terminal is a drawn, one-piece laminated structure including a base conductor layer and a solder layer.Type: GrantFiled: August 15, 1997Date of Patent: April 27, 1999Assignee: Molex IncorporatedInventors: Kevin C. Benes, Yves Le Pottier, Bruce F. Smith
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Patent number: 5885111Abstract: An improved modular jack, and more particularly to a keystone jack for use on digital communication networks intends to effectively avoid short circuits and the production of noise and crosstalk in signal transmission. The jack is equipped with a wire mounting plate having four receiving grooves on the top face and four on the bottom face thereof some of which are crossly oriented at their ends so as to permit 8 or more wire contact pieces to be mounted separately thereto and crossly placed without contact at all. A retaining board is integrally engaged with the top face of the wire mounting plate and the combination is forced into a receiving recess of a jack housing having a horizontal extension to support the bottom face of the wire mounting plate so as to fix the 8 wire contact pieces respectively in place.Type: GrantFiled: January 13, 1998Date of Patent: March 23, 1999Assignee: Shiunn Yang Enterprise Co., Ltd.Inventor: Chin-Chun Yu
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Patent number: 5775923Abstract: A plurality of contact elements (5) extend through a support member (4) and having a connection portion (5A) on the PC card side and a wiring portion on the side opposite to the PC card side. The wiring portions (5B) are connected to corresponding signal circuits of a connection board (7). The ground member (6) has on the non-PC card side a connection leg (6A) connected to a ground circuit of the connection board 7, which is designed to be fitted into an intermediate connector 9 for connection with a circuit of the equipment.Type: GrantFiled: June 25, 1996Date of Patent: July 7, 1998Assignee: Hirose Electric Co., Ltd.Inventor: Shoichi Tomioka
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Patent number: 5722839Abstract: An electrical connector for horizontal insertion of a CPU module therein includes a connector body and a terminal positioning plate. The connector body has a longitudinal insert slot for receiving a CPU module. An insert post is disposed at either end of an outer side opposite to the insert slot for securing each end of the terminal positioning plate. The terminal positioning plate is vertically secured at one lateral side of the outer side of the connector body and provided with a multiplicity of through holes corresponding to a multiplicity of terminals. The insert ends of the terminals extending from the connector body bend through 90 degrees and then pass through the through holes, securing the connector body on a circuit board in a horizontal position, thus the connector body may have its insert slot orient towards the side to allow the CPU module to be horizontally inserted therein.Type: GrantFiled: December 12, 1996Date of Patent: March 3, 1998Inventor: Te-Hsin Yeh
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Patent number: 5716222Abstract: A plurality of rigid, generally spherical contact elements are attached to the solder balls of a ball grid array (BGA) package to provide rigid contact points that are suitable for engagement with the contacts of a direct BGA socket assembly. The contact elements include a flattened circumferential surface and a circumferential groove formed in the flattened surface. The circumferential groove divides the contact element into opposing hemispheres. An alignment assembly for aligning the contact elements with the BGA solder ball footprint includes a carrier sheet of electrically insulative, flexible material having a plurality of holes arranged in a predetermined array corresponding to the footprint of solder balls. The contact elements are snap received within the holes of the carrier sheet such that one hemisphere of the contact element is disposed on each side of the carrier sheet.Type: GrantFiled: August 8, 1996Date of Patent: February 10, 1998Assignee: Advanced Interconnections CorporationInventor: James V. Murphy