Abstract: A phosphor layer attaching kit includes a phosphor layer and a silicone pressure-sensitive adhesion composition for attaching the phosphor layer to an optical semiconductor element or an optical semiconductor element package. A percentage of the peel strength of the silicone pressure-sensitive adhesion composition is 30% or more.
Type:
Grant
Filed:
September 18, 2013
Date of Patent:
July 14, 2015
Assignee:
NITTO DENKO CORPORATION
Inventors:
Masahiro Shirakawa, Hironaka Fujii, Hisataka Ito