Patents Examined by Benjamin Sanvik
  • Leadframe package for light emitting diode device
    Patent number: 8058667
    Abstract: An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the invention is a PPA supported package house for LED packaging with metal base, four identical metal electrodes, and PPA plastic to fix the metal electrodes and the heat dissipation base together, four ring-alike structures with a sharp edge and with a tilted inner surface, and three ring-alike grooves formed between sharp edge ring-alike structures.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: November 15, 2011
    Assignee: Nepes LED Corporation
    Inventors: Nguyen The Tran, Yongzhi He, Frank Shi