Patents Examined by Beverly A. Pawlikawski
  • Method of packaging a non-contact I/O signal transmission integrated circuit
    Patent number: 4845052
    Abstract: The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes using optical transmitters on the die to align the top of the package and the optical conduits to the die which was previously mounted in the base of the package.
    Type: Grant
    Filed: January 13, 1988
    Date of Patent: July 4, 1989
    Assignee: Harris Corporation
    Inventor: Robert J. Abend