Abstract: This invention relates to a method of embedding electric components or optical components, such as sensors, in a high-temperature metal and the embedded products produced by the method. In the preferred embodiment the components are embedded on a substrate of the high-temperature metal by being placed on a first insulating layer. A second electrically insulating layer, a low thermal conductivity layer, a high thermal conductivity layer, and a primer layer are then deposited in order. The high thermal conductivity layer is in good thermal contact with the substrate. The high-temperature metal is deposited, preferably as molten drops, on the primer layer and the heat from the drops is conducted by high thermal conductivity layer to the substrate while the components are protected by the low thermal conductivity layer.