Abstract: An electronic control device enabling heat generated by a power module to be favorably radiated even in a high-temperature condition in an engine compartment. The unit includes a casing accommodating a control circuit substrate; a die-cast mounting plate forming a control circuit substrate support portion, a frame-like fitting member and an external mounting portion integrally together; and a metal substrate on which a power module is adhered. When the mounting plate is mounted on the wall of a transmission and the metal substrate is fitted in the opening in the bottom surface of the frame-like fitting member, a mounting surface in nearly the same plane is formed by the lower surface of the mounting plate and by the lower surface of the metal substrate permitting heat from the power module to be radiated to the wall.

Abstract: The aim of the invention is to prevent an unwanted conduction of a flow of gas inside a channel that connects an inner space of an enclosed switchgear (1) to another space. To this end, the channel is closed by means of a closing mechanism according to an increase in pressure in the inner space.

Abstract: The present invention is to provide a heat-dissipating device comprising a sheet formed thereon with a plurality of first parts and a plurality of second parts, wherein any one of said second part is disposed between any two of said first parts, and the junction therebetween is bent with an angle enabling the ends of two adjacent first parts distal to the second part to be connected with each other. As a result, the second parts form corresponding parallel plates respectively on each side of a heat-dissipating device for being placed on a heat-source to dissipate heat transmitted therefrom, and the first parts act as the supporting plates for supporting the parallel plates.

Abstract: A heat dissipating device includes a heat receiving unit having a heat receiving surface thermally connected to a heat generating object and a heat dissipating surface in an opposite to the receiving surface, a heat transferring unit mounted on the dissipating surface, transferring the heat received in the heat receiving surface, and diffusing the transferred heat to the dissipating surface, and a heat dissipating unit mounted on the dissipating surface and dissipating the diffused heat. An electronic apparatus includes a circuit board having an electronic part generating heat, a main body installing the circuit board, and the heat dissipating device described above.

Abstract: A memory module has a two-plate heat sink attached by rivets. A front plate contacts the flat surfaces of memory chips on a front surface of the module printed-circuit board (PCB) substrate, while another back plate contacts chips on the back surface of the substrate. The plates contact the substrate along the top edge opposite the connector edge, and along the upper half of the substrate's side edges. Holes in the substrate allow for rivets or other fasteners to pass through to firmly attach the plates to the substrate, prevent wobble. Four top-edge slots are cut in the plates near the top edge, between the rivets along the top edge. The top-edge slots allow air to flow underneath the plates, in small gaps between memory chips, and between the plate and the substrate. The added air flow underneath the plates helps cool the heat-sink plates, reduce hot spots and failures.