Abstract: In a chained terminal, plural male terminals each of which is provided with an electric contact part and an electric wire connecting part, are arranged at a predetermined interval on both sides of a feed plate in a staggered layout. A pair of terminal crimping machines are arranged in positions in which they are separated by a pitch between adjacent male terminals on both sides of the feed plate, and an electric wire is alternately crimped and fixed to each male terminal on both sides of the feed plate by each terminal crimping machine, while feeding the chained terminal by the half of the pitch between adjacent male terminals.

Abstract: An adaptor tool for mounting components on printed circuit boards. The adaptor tool has two capture members that define an opening sized to receive the component. The capture members are linked together such that the application of torque to the adaptor tool by a torque tool via a connector results in the two capture members frictionally engaging the component and transferring the torque to the component. This allows the component to be mounted to the printed circuit board to a desired degree of torque. The adaptor tool can be sized so as to be able to mount a cylindrical heat sink to a bracket on a printed circuit board to a desired degree of torque.

Abstract: A power supply includes a power cable interface. The power supply also includes an interface guard. The interface guard has an unlocked position and a locked position. When the interface guard is in the unlocked position, the power supply can be attached and detached from a chassis of an electrical system. When the interface guard is in the locked position, the power supply cannot be attached or detached from the chassis of the electrical system. The power cord can only be attached to the power supply while the interface guard is in the locked position.

Abstract: In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.

Abstract: An apparatus for the dimensionally accurate cutting of a product carrier (1) which is in the form of a strip, is transported further in a cyclic or continuous manner in the longitudinal direction and has cells which are arranged one behind the other and are sealed in an airtight manner comprises a rotating cutter roller (15), which severs the product carrier (1) in each case in the region of a sealing web (4) which is situated between two cells (2), is arranged transversely with respect to the longitudinal direction and is provided with a lattice-like embossing (19). In order to identify and localise the sealing web (4), an optical reflection sensor (6) is arranged above and/or below the product carrier (1) and generates an AC voltage signal which corresponds to the lattice structure when the sealing web (4) is located in the region of the reflection sensor (6), the number of periods being a measure of the width b of the sealing web (4).