Abstract: A system for cooling an electronic device comprising a heat sink including a channel having an inlet and an outlet, with the channel coupled to an airflow generation system that generates airflow between the inlet and outlet. Heat is removed from an electronic device by decreasing the cross-sectional area of the channel to provide a throttle at a location adjacent to where the channel traverses the electronic device. A plurality of throttles may be formed in the channel, each for cooling a separate electronic device. An airflow control valve is operably connected to the heat sink for controlling the amount of airflow through the heat sink. A device controller connected to the airflow control valve and the air generation system adjusts the airflow control valve according to temperature measurements collected from the electronic device and controls the operation of the air generation system.

Abstract: The HT power supply unit modular support according to the invention comprises functional housings intended to accommodate the functional elements of the power supply unit, the insulating walls of which are formed by two protruding walls (2, 3) having overlapping complementary inclined surfaces (5, 6). Application to HT power supply units for X-ray sources.

Abstract: An EMI shielding fluid control shroud is adapted for use in spray cooling EMI producing or EMI sensitive components. The EMI shielding shroud, carried between a printed circuit board and a spray plate, defines an interior spray cavity which prevents interference with coolant spray directed at one or more heat-generating, EMI producing or sensitive components, such as integrated circuits. The size and shape of the shroud provide control over the flow and direction of the coolant spray and result in better cooling of the components carried on the printed circuit board and partially enclosed by the shroud. The shroud provides an EMI shield which prevents passage by EMI in either direction, while allowing coolant fluid to exit through the EMI shielding material.

Abstract: A heat dissipating element, positioned inside a protective cover, removes heat from the vicinity of a multi-chip module comprising active semiconductor devices attached to a printed circuit board. Attachment of the protective cover to the printed circuit board uses a latching mechanism with minimum board space requirements.

Abstract: An electronic structure includes an electronic device, and a heat sink assembly in thermal contact with the electronic device. The heat sink assembly is formed of a piece of pyrolytic graphite embedded within a metallic casing and intimately contacting an interior wall of the metallic casing. The heat sink assembly is substantially fully dense. The heat sink assembly is fabricated by assembling the piece of pyrolytic graphite within the disassembled elements of the metallic casing, and then simultaneously heating and pressing the initial assembly until it is substantially fully dense.