Abstract: An Adaptable Planar Module (APM) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is formed in an opening in a support base and extends at or below a bottom surface of a base to allow for thermal contact with a heatsink. A circuit board for supporting and interconnecting lower power devices is mounted above and spaced from the support base and has an opening therein which is located above the IMS. The circuit board has bonding pads which are electrically connected to the low power devices. Bonding wires provide an electrical connection between the bonding pad of the printed circuit board and the power devices on the IMS substrate. Integral or procured terminals are also provided for external connections. Additional circuit boards may also be provided in the module and arranged co-planar with or above the first circuit board.

Abstract: A cooling unit comprising a heat radiating plate and an electric fan device. The heat radiating plate has thermal conductivity and comprises a heat receiving portion and a heat exchanging portion, which are arranged side by side. The heat receiving portion is thermally connected to a heat-generating component. The heat exchanging portion is made integral with the heat receiving portion. The fan device having a fan and a flat fan casing. The fan casing has an air inlet port for drawing cooling air when the fan is driven, an air outlet port for guiding the cooling air, and an opening opposing the inlet port. The opening closed by the heat radiating plate.