Abstract: An electronic-circuit assembly of the present invention comprises a plurality of film carriers which are stacked. Respective film carriers have a plurality of through-holes. One of through-holes is provided on corresponding position to another through-hole in the stacked direction of the substrate. Two of adjacent film carriers are connected by the corresponding through-holes. A connection member is provided in two of adjacent through-holes in the stacked direction of the substrates. A connection state between film carriers can be easily checked. Since it is visually checked that solder appears inside the topmost through-hole. Furthermore, wiring lengths for connection between substrates can be reduced. Since the plurality of substrates are three-dimensionally connected.

Abstract: An assembly of electrical equipment having devices, such as circuit breakers and contactors grouped in pairs, included on a supporting baseplate. Each pair of devices includes a circuit breaker 40 and a contactor 60 and a baseplate 20 having power pins and control pins that cooperate with respective power and control terminals of the devices. Auxiliary units 50,70 are fixed to one of the devices 40,60 while being connected to control terminals 45,65,66 of the one device. The units 50,70 are connected to a linkage with a bus or a control and command system by plugging units 50,70 into control pins 81,82 of the baseplate 20.

Abstract: An assembly of a circuit pack and an environmental protection in which the protection is a heat conductive and fluid-tight cover surrounding the pack and sealed to an electrical cover at one end of the pack. The cover is heat conductively connected with the circuit pack and has guide surfaces to enable the assembly to be guided in an electronic shelf. The cover is also provided with handling regions to enable its removal from the shelf and is resistant to buckling. There may be a resilient clip provided at each side edge of the cover. The clip holds the cover in heat conductive engagement with the circuit pack and has an outer surface which acts as a guide surface.