Patents Examined by Boris L. Cherwinsky
  • Apparatus for dissipating heat from a conductive layer in a circuit board
    Patent number: 5933324
    Abstract: An apparatus for dissipating heat transferred to a circuit board. A board on which to mount an electronic device includes a conductive layer. A first board heat dissipation element is thermally coupled to the conductive layer and extends away from a surface of the board to dissipate heat from the conductive layer to the ambient.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: August 3, 1999
    Assignee: Intel Corporation
    Inventor: Joseph C. Barrett