Abstract: A method for reducing deposition thickness variation in a processing tool comprises storing a post-clean performance model of the processing tool; receiving at least one of a showerhead age and a tool idle time associated with the processing tool as an input parameter; determining temperature control parameters based on the input parameter and the post-clean performance model; and modifying an operating recipe of the processing tool based on the temperature control parameters. A processing system includes a processing tool and an automatic process controller. The processing tool is adapted to process wafers in accordance with an operating recipe.
Type:
Grant
Filed:
July 12, 2000
Date of Patent:
January 28, 2003
Assignee:
Advanced Micro Devices, Inc.
Inventors:
Bradley M. Davis, Allen L. Evans, Craig W. Christian
Abstract: A method, apparatus, and article of manufacture for analyzing measurements. The invention provides a method for separating and analyzing the components of a distribution, such as deterministic and random components. The method performs the steps of collecting data from a measurement apparatus, constructing a histogram based on the data such that the histogram defines a distribution, fitting tails regions wherein deterministic and random components and associated statistical confidence levels are estimated.
Type:
Grant
Filed:
December 11, 1998
Date of Patent:
October 2, 2001
Assignee:
Wavecrest Corporation
Inventors:
Peng Li, Ross Adam Jessen, Jan Brian Wilstrup, Dennis Petrich
Abstract: A system and method for improving the ability of an electronic meter to make measurements on signals to determine content of different frequencies, and harmonics of the fundamental frequency, of AC signals (voltages and currents). The line frequency is determined and compensated for prior to performing frequency-dependent parameter measurements or determining frequency-dependent parameters.
Type:
Grant
Filed:
November 30, 1998
Date of Patent:
October 3, 2000
Assignee:
ABB Power T&D Company Inc.
Inventors:
Rodney C. Hemminger, Scott T. Holdsclaw, Vick A. Hubbard
Abstract: A surface replicating and contour measuring device substantially comprises a mechanical pin array having calibration pins mounted on a frame, an imaging system for recording contour and a data processor for storing and manipulating the recorded information.
Abstract: A work cell containing robot(s), video camera(s), and structured lighting source(s) is calibrated by observing targets with the camera(s) as a robot is displaced through a set of offsets. Complete information is recovered about the camera(s) calibration data and the structure of illumination from the light source(s). The robot is utilized to create known relative movements between the targets and the camera(s) and light source(s). Therefore, this technique is applicable to both the fixed and moving camera cases. Except for the target surface profile, there is no requirement to externally determine any absolute or relative positions, or any relationships either within or between the camera(s), targets, light source(s), and robot(s). Either single or multiple cameras (acting independently or in stereo) are calibrated to the robot's coordinate frame, and then optionally used as measuring devices to determine the position and form of the structured light.
Abstract: A device in the process control system includes a sensor input receiving a sensor signal. The sensor signal comprises a process variable signal and a residual sensor signal related to sensor operation. Diagnostic circuitry receives a separated sensor signal and responsively provides a diagnostic output related to the sensor. Sensor signal processing circuitry separates the sensor signal into signal components which are provided to the diagnostic circuitry.
Abstract: A position detection system is provided which, without physical contact, by the use of detected infrared energy emissions determines whether there is correct placement of one or more small objects, e.g., lead frames, on the lower half of a two-part die mold in a semiconductor component manufacturing process. This takes place prior to injection of an initially molten material that solidifies and encapsulates the small objects upon curing and cooling.
Type:
Grant
Filed:
August 27, 1997
Date of Patent:
January 26, 1999
Assignee:
Mitsubishi Electric America, Inc.
Inventors:
Waite R. Warren, Jr., John T. Cox, Louis W. Nicholls
Abstract: A system and a method for detecting vehicle types utilizing height information and a debiting system using such a system or a method. A plurality of distance sensors (heads) are provided laterally on a road, and 0/1 linked existence data and linked height data are generated by a link generator. The former data represent the existence of a vehicle on a detection line drawn along the road width direction on the basis of the distance data obtained by the heads and the latter data represent height profiles of a vehicle on the detection line. Height data such as maximum, minimum and average height in every height block are calculated by a scan-by-scan height evaluator 38 on the basis of the linked height data and vehicle position information, and a vehicle type detector 40 detects the type of the vehicle.