Abstract: A method of manufacturing a thin-film field-emission electron source which is of a sandwich structure of a substrate - metallic film-insulating film - metallic film and which has at least one minute cavity and a field-emitter of, for example, a conical shape within the cavity, comprises the steps of (i) forming on a substrate a first layer of metallic film pattern for current supply, (ii) depositing a second layer film made of an electron emissive material onto the entire area of the substrate provided with the first layer, and thereafter subjecting the second layer film to a mesa etch by a photoetching process, to form a conical emitter on the first layer film, (iii) forming a third layer made of an insulating material, the third layer having a height substantially equal to the level of a tip portion of the emitter, (iv) forming a fourth layer of metallic film pattern as an accelerating electrode, and (v) etching the third layer, so as to expose the extremity of the emitter.
Abstract: A method of and apparatus for manufacturing stock material from which bags or other containers may be formed is disclosed. A folded plastic film is fed from a stock roll onto a plurality of carrier rollers which support the film in a horizontal position. Simultaneously, a separate closure strip is fed from a second stock roll through a guide block which aligns the strip with a sealing station, the two halves of the closure strip being pressed together to maintain proper alignment. The upper ply of the folded plastic film is fed into the heat sealing apparatus at the sealing station, the edge of the upper ply being aligned with one edge of the closure, and the film and the closure strip are fed continuously through the sealing station where they are welded together. The lower ply of the film web is folded downwardly so that it bypasses the sealing station.
Abstract: A slit film and method of making same, the slits forming apertures defined by a plurality of axially oriented spaced apart ribbons, the film is pre-slit to define a plurality of substantially parallel interconnected ribbons and stretched axially of said ribbons to orient the ribbons and neck same down to define the open areas therebetween. Preferably, the ribbons will be interconnected at spaced apart nodes.
Abstract: An SiO.sub.2 film doped with an impurity is formed on at least one portion of a surface of a semiconductor wafer. The wafer is selectively etched after a protective film for selective etching is disposed into a predetermined pattern on the SiO.sub.2 film. The impurity included in the SiO.sub.2 film can be diffused into the wafer to form a PN junction in the latter. Then the wafer is selectively etched until that surface of the wafer to which the PN junction is exposed is bevelled.
Abstract: A method for applying various coating liquids on the surface of a travelling web, such as plastic films, paper, metallic sheets, etc., with a discontinuity thereon, e.g., due to a connection of pieces of the web comprising preworking a web portion so that the web surface downstream of the discontinuity is coplanar to or higher than the maximum height of the discontinuity, whereby irregularities in coating of liquids are eliminated.
September 3, 1974
Date of Patent:
August 3, 1976
Fuji Photo Film Co., Ltd.
Sei Kawahara, Akira Takagi, Hirosi Nozawa
Abstract: A process is described for bonding or coating materials which comprises applying a molten olefin copolymer to a substrate. The copolymer is a terpolymer comprising about 70-90 parts by weight of ethylene, about 0.5-10 parts by weight of an ethylenically unsaturated carboxylic acid amide, and about 0.5 to 20 parts by weight of an ethylenically unsaturated carboxylic acid ester. The sum of the above parts by weight is equal to about 100.
Abstract: A metallic laminate of the type comprising sheet metal, such as galvanized sheet steel, and aluminium foil, with an interposed thermoplastic, such as polyethylene, which, under heat and pressure, adheres to the foil and sheet metal, has its bond strength substantially increased winding it as a coil under tension, the laminate being heated, before and/or after coiling. Subsequently the coil, while clamped radially to prevent relative movement of the coil convolutions, is cooled from the outside, the coiling under tension, the heating and the cooling all causing inter-layer pressures in the coil which, with the heat, bring about a useful increase in the bond strength.
October 10, 1974
Date of Patent:
July 20, 1976
Heatshield Research and Development Pty. Ltd.
Abstract: A protected container is formed by placing a protective coating of a foamed, heat shrinkable, styrenic resin sheet around at least a portion thereof. Slits are formed in the sheet prior to placing it around the container. After being placed around the container the sheet is heated so that it shrinks thereby making close contact with the container. The sheet is further heated such that the sides of the slits warp to form a rough surface to facilitate handling of the container.
Abstract: A method for making a high density magnetic bubble domain system including the functions of read, write, storage, transfer, and annihilation. Only three masking steps are required, of which only one requires critical alignment. The proces makes use of the fact that magnetic disks can be placed on non ion implanted regions without adversely affecting the propagation properties of the implanted regions. Thus, the magnetic disks can be used to define ion implantation masks as well as for providing functions such as generation, propagation, reading, and annihilation. Magnetic elements for generation, storage and propagation, reading and annihilation are deposited in the same non-critical masking step, while all condutors used for writing, reading, and transfer are deposited by a single masking step requiring critical alignment.
December 31, 1974
Date of Patent:
June 29, 1976
International Business Machines Corporation
George S. Almasi, Robert J. Hendel, George E. Keefe, Yeong S. Lin, Richard P. McGouey
Abstract: A process for electrically interconnecting a group of integrated-circuit chips embedded in plastic is described. Multilayer conductors are plated in grooves photoformed in successively applied plastic layers and connected to the chip pads and to conductors on other layers through vias also photoformed in the plastic. Photoformation of wiring grooves and layer-interconnecting vias is accomplished by ultraviolet irradiation of photosensitized liquid polyester resin.
Abstract: A drive arrangement pressurizing system and method for a veneer edge gluer apparatus having a low pressure, constant-drive infeed crowder section and a high pressure intermittent-drive outfeed crowder section for producing a continuous veneer ribbon which is moved in a straight line path of travel as it issues from the edge gluer.
Abstract: Improved process for laminating two sheets, the surface of the primary sheet being sensitive to distortion by pressure or friction, by applying an adhesive to the back side of the primary sheet or to the mating side of the secondary sheet, or to both, contacting the mating side of the secondary sheet with the back side of the primary sheet and firmly pressing together the two sheets while avoiding the application of any pressure to the pressure-sensitive face side of the primary sheet until at least 50 percent of the terminal bond strength is developed, by maintaining the primary and secondary sheets taut and applying pressure from the back side of the secondary sheet. Laminates prepared according to the above process, such as tufted carpets comprising a primary backing material stitched with closely spaced tufts of yarn and a secondary backing material adhered thereto with an adhesive, have improved pile lay characteristics.
Abstract: A process for joining abutting thermoplastic synthetic resin foam structures by a strip which covers a junction zone formed between the foam structures including the steps of pressing a metal strip heated to above the softening point and or the melting temperature of the synthetic resin foam under slight pressure onto the junction zone and then allowing the metal strip to cool. In this manner, a bond is formed between the foam structures and the metal strip.
September 16, 1974
Date of Patent:
June 8, 1976
Dynamit Nobel Aktiengesellschaft
Franz Werner Alfter, Hans-Ulrich Breitscheidel
Abstract: A method is disclosed for accurately and readily forming a continuous band of rubberized fabric having transversal reinforcing metal elements by butt-splicing wherein a first and second piece of rubberized fabric having transversal reinforcing metal elements are positioned such that the initial end of the second piece is a predetermined distance from the terminal end of the first piece on a common plane with the reinforcing metal cords running parallel to the ends of the pieces, butt-splicing the pieces, without overlapping, by mutually approaching the pieces, obtaining a uniform accumulation of the rubber of the rubberized fabric about the reinforcing cords as well as a local thickening of the latter at a zone symmetrically situated with respect to the contact surface of the ends and whose width is proportional to the pre-established distance wherein the pieces are bound by the operating parts of the splicing apparatus, releasing the pieces from the operating parts of the splicing apparatus and winding up th
Abstract: An improved method of defining a pattern in a layer of organic material includes depositing a relatively thin layer of silicon dioxide on the layer of organic material, applying to the silicon dioxide layer a film of primer solution comprising a silane derivative, and then forming a photoresist etch mask on the film. By utilizing an ultrasonic etch bath, a uniform and well-defined pattern is etched in the layer of organic material.
Abstract: This disclosure depicts a novel method of etching a shadow mask for a color television picture tube and in particular to a method of etching the steel substrate layer of a two layer shadow mask, wherein the first layer has been previously etched, and of reclaiming the used etchant. Ferric sulphate is used to etch the steel substrate layer, resulting in the generation of ferrous sulphate, a by-product of the chemical reaction of the ferric sulphate etchant and the steel substrate. The used etchant is reclaimed by reacting and mixing in a particular manner the used etchant with sulfuric acid and hydrogen peroxide.
Abstract: A message tape for instrument display systems includes laminations of metallic and plastic materials. Messages are etched through a metallic lamination and dyes are applied through the etchings to provide color coding without introducing dimensional buildups. The dyes are retained by a plastic backing lamination. The tape has the main advantage of being useful at elevated operating temperatures and ancillary advantages of improved image quality and lighting efficiency.
Abstract: Charging and imaging methods including providing an imaging member having a dielectric substrate, an overlayer of softenable material and a fracturable layer of particulate material, charging said member either by placing said member with the dielectric substrate contacting an electrical ground and electrically charging the opposite side thereof, or by charging each side of said member to a different polarity. Such an imaging member is imaged by forming an electrostatic latent image on said member, and developing said member whereby selective portions of the particulate material migrate in imagewise configuration toward the dielectric substrate.
Abstract: A method and apparatus for the production of improved heat seals in thermoplastic materials which includes causing displacement of thermoplastic material in the area being sealed during the sealing operation. The displaced thermoplastic serves to reinforce that area of the seal which is normally weakened as a result of the heat sealing step.
Abstract: Costume jewelry is manufactured through photofabrication processes from flat metal sheets to form items such as earrings and small pendants. A standard photo-fabrication operation includes covering a metal sheet with a layer of photosensitive, chemically resistive material commonly referred to as a photoresist. Portions of the covered sheet are exposed to light to outline the earrings and pendants on the sheet. The sheet is then developed and the exosed metal surface portions are chemically etched to remove excess metal and form the earrings and pendants. Thereafter, surface treatments involve supplementary photofabrication operations to provide different colors and finishes on the earrings and pendants by etching, plating and staining the exposed metal surfaces, all of which are supplemented by the retention of portons of photoresist layers of selected colors.