Patents Examined by Bridget L. Eland
  • Patent number: D1012863
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: January 30, 2024
    Inventors: Dianwei Zhang, Yingchuang Zhou
  • Patent number: D1012911
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: January 30, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1013641
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: February 6, 2024
    Assignee: Yueqing Daier Electron Co., Ltd.
    Inventor: Xuyu Li
  • Patent number: D1013652
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 6, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1013653
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 6, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1013654
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 6, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1013655
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 6, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinie Ryu, Haesung Park, Jiseung Song, Hyoksu Choi, Inshik Kim, Seungho Jang
  • Patent number: D1013656
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: February 6, 2024
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Luxi Zhou, Shengyu Gong, Xu Wei, Yin Zhu
  • Patent number: D1013668
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 6, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1013669
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: February 6, 2024
    Assignee: Lenovo (Beijing) Limited
    Inventors: Yunchao Zhang, Jun Liang
  • Patent number: D1013670
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: February 6, 2024
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventor: Zihao Zhang
  • Patent number: D1013671
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: February 6, 2024
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventor: Senpeidi Luo
  • Patent number: D1014447
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinie Ryu, Haesung Park, Jiseung Song, Hyoksu Choi, Inshik Kim, Seungho Jang
  • Patent number: D1014448
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 13, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1014476
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: February 13, 2024
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventor: Jonathan Howard Biddle
  • Patent number: D1014477
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 13, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1014478
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 13, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1014479
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: February 13, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Jian Xu, Guoping Wu
  • Patent number: D1014480
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinie Ryu, Haesung Park, Jiseung Song, Hyoksu Choi, Inshik Kim, Seungho Jang
  • Patent number: D1014481
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: February 13, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyoksu Choi, Heesun Kim, Inshik Kim