Abstract: Method of patterning a substrate are described including a method of providing a substrate comprising a metalized surface having a self-assembled monolayer patterned region and unpatterned region; and wet etching the metalized surface in a liquid etchant agitated with bubbling gas to remove metal from the unpatterned regions to form a metal pattern. Also described are metal patterned article including an article comprising a substrate and an etched microcontact printed metal pattern disposed on the substrate wherein the pattern has a thickness of at least 100 nanometers and a pattern feature uniformity of at least 50% for an area of at least 25 cm2.
Type:
Grant
Filed:
June 17, 2010
Date of Patent:
February 11, 2014
Assignee:
3M Innovative Properties Company
Inventors:
Lijun Zu, Matthew H. Frey, Myungchan Kang, Jeffrey H. Tokie