Patents Examined by Bryan P Gordon
  • Patent number: 10819251
    Abstract: A linear actuator has a base, a linear guide coupled to a flat, planar side of the base and extending in a travel length of an object to be moved, a contact plate extending along the flat, planar side of the base, and a carriage. The carriage includes an enclosure formed of an acoustically isolating material, a moving element configured to move along the guide and is coupled to the enclosure, a piezoelectric element including a contact site in physical contact with the contact plate, and a housing elastically holding the piezoelectric element, the housing coupled to the enclosure with no direct contact with the moving element. An electrical power source is in electrical communication with the piezoelectric element, wherein the power source energizes the piezoelectric element to effectuate movement of the carriage along the linear guide via the physical contact between the contact site and the contact plate.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: October 27, 2020
    Assignee: DTI Motion Corp.
    Inventors: Valentin Zhelyaskov, Serhiy Petrenko, Mark Broderick
  • Patent number: 10797617
    Abstract: An electromechanical transducer, including: one or more first mechanical resonator structures having respective first fundamental oscillation resonance frequencies; and a second mechanical resonator structure including one or more electromechanical transducer components, and having a second fundamental oscillation resonance frequency that is substantially greater than the first fundamental resonance frequencies of the first mechanical resonator structures; wherein oscillations of the first mechanical resonator structures driven by external mechanical vibrations cause the first mechanical resonator structures to intermittently couple with the second resonating structure to drive oscillations of the second resonating structure such that the electromechanical transducer components of the second mechanical resonator structure convert the oscillations of the second resonating structure to electrical energy or signals.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: October 6, 2020
    Assignee: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION
    Inventors: Andojo Ongkodjojo Ong, Paulo Antonio De Souza, Jr.
  • Patent number: 10778184
    Abstract: A symmetrical MEMS resonator is disclosed with a high quality factor. The MEMS resonator includes a silicon layer with a top surface and bottom surface opposite the top surface. A pair of first metal layers is provided above the top surface of the silicon layer and a corresponding pair of second metal layers is symmetrically provided below the second surface of the silicon layer relative to the pair of first metal layers. Furthermore, a first piezoelectric layer is disposed between the pair of first metal layers and a second piezoelectric layer is disposed between the pair of second metal layers.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: September 15, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Ville Kaajakari
  • Patent number: 10778182
    Abstract: A resonator including a vibrating portion with first and second electrodes and a piezoelectric film formed therebetween. Moreover, a frame surrounds the vibrating portion with a pair of holding units opposite to each other and connecting the vibrating portion with the frame. An extended electrode extends from the holder to the holding unit and either the first or second electrode extends to the holding unit, and is connected to the extended electrode. Furthermore, the resonator includes an electrical resistance value per unit area of the extended electrode that is smaller than an electrical resistance value per unit area of the first electrode or the second electrode that extends to the holding unit.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: September 15, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Daisuke Nakamura, Toshio Nishimura, Ville Kaajakari
  • Patent number: 10777730
    Abstract: Disclosed is a scalable piezoelectric linear actuator. The linear actuator includes a central rod and one or more bending modules connected to the central rod. Each of the one or more bending modules includes one or more bending actuators. Each of the one or more bending actuators includes at least two layers of bending elements. Further, each of the one or more bending actuators incudes a metallic layer disposed between each of the at least two layers of bending elements. Further, each of the one or more bending actuators includes an insulating layer disposed on at least one of the at least two layers of bending elements. Further, each of the one or more bending actuators includes a sensing element disposed on the insulating layer.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: September 15, 2020
    Inventor: Santosh Kumar Behera
  • Patent number: 10777729
    Abstract: An electronic device and control method thereof are provided. The electronic device includes a first layer disposed on a surface of the electronic device and configured to be touched or gripped by a user and to generate a signal corresponding to a touch or grip area of the user, a second layer disposed on the first layer and configured to have a surface of the second layer deformed, and a processor configured to detect a user's touch or grip based on the generated signal, and control the second layer to deform a surface of the second layer to have a protrusion pattern on the touch or grip area of the second layer based on the generated signal.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: September 15, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tomasz Robert Gdala, Bartosz Pawel Skorupski, Maciej Wladyslaw Jagiełło
  • Patent number: 10770642
    Abstract: A piezoelectric two-dimensional mode resonator suited for high frequency filtering applications, with the ability to simultaneously excite lateral and vertical acoustic waves.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: September 8, 2020
    Assignee: CARNEGIE MELLON UNIVERSITY
    Inventors: Gianluca Piazza, Cristian Cassella
  • Patent number: 10771037
    Abstract: A piezoelectric resonator device having a sandwich structure is provided, which is stably bonded to an external element. In the piezoelectric resonator device 1, at least a vibrating part 21 of a piezoelectric substrate 2 is sealed by a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 includes: the vibrating part 21; and an external frame part 23 that is thicker than the vibrating part 21 and that surrounds the outer periphery of the vibrating part 21. External electrodes 31 to be connected to an external element 5 are provided on at least one of the first sealing member 3 and the second sealing member 4. The external element 5 is connected to the external electrodes 31 at least on the external frame part 23 of the piezoelectric substrate 2.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: September 8, 2020
    Assignee: Daishinku Corporation
    Inventors: Takuya Kojo, Satoru Ishino
  • Patent number: 10756250
    Abstract: A piezoelectric element includes a first electrode; a second electrode; and a piezoelectric layer arranged between the first electrode and the second electrode, in which the piezoelectric layer is a thin film that includes a perovskite-type composite oxide which includes potassium, sodium, and niobium and which is preferentially oriented in the (100) plane, and a crystal structure of the perovskite-type composite oxide includes a basic lattice structure having an oxygen octahedron and a super lattice structure in which the oxygen octahedron is tilted.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: August 25, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Tetsuya Isshiki, Koichi Morozumi
  • Patent number: 10736649
    Abstract: Disclosed is an ultrasonic surgical instrument comprising a transducer base plate, first and second piezoelectric elements positioned on opposite faces of the transducer base plate. The transducer base plate is coupled to a waveguide. The waveguide is electrically coupled to the first and second piezoelectric elements by a conductive adhesive. The first and second piezoelectric elements are electrically coupled to an ultrasonic signal generator through an electrode. A thermal conductor conducts thermal energy away from the first and second piezoelectric elements. Also disclosed is a method of fabricating such an ultrasonic surgical instrument.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: August 11, 2020
    Assignee: Ethicon LLC
    Inventors: Jeffrey D. Messerly, Craig T. Davis, Mark E. Tebbe, Brian D. Black, Stephen M. Leuck, Eric M. Roberson, John E. Brady, Amrita S. Sawhney, Shan Wan, Ion V Nicolaescu, James M. Wilson, Amelia A. Pierce
  • Patent number: 10735865
    Abstract: This disclosure provides systems, methods and apparatus for microspeaker devices. In one aspect, a microspeaker element may include a deformable dielectric membrane that spans a speaker cavity. The deformable dielectric membrane can include a piezoactuator and a dielectric layer. Upon application of a driving signal to the piezoactuator, the dielectric layer can deflect, producing sound. In some implementations, an array of microspeaker elements can be encapsulated between a glass substrate and a cover glass. Sound generated by the microspeaker elements can be emitted through a speaker grill formed in the cover glass.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: August 4, 2020
    Assignee: SnapTrack, Inc.
    Inventors: Philip Jason Stephanou, David William Burns, Ravindra V. Shenoy
  • Patent number: 10727804
    Abstract: An integrated circuit is a layered device, on a semiconductor substrate, which contains metal electrodes that sandwich a piezoelectric layer, followed by a magnetostrictive layer and a metal coil. The metal electrodes define an electrical port across which to receive an alternating current (AC) voltage, which is applied across the piezoelectric layer to cause a time-varying strain in the piezoelectric layer. The magnetostrictive layer is to translate the time-varying strain, received by way of a vibration mode from interaction with the piezoelectric layer, into a time-varying electromagnetic field. The metal coil, disposed on the magnetostrictive layer, includes a magnetic port at which to induce a current based on exposure to the time-varying electromagnetic field generated by the magnetostrictive layer.
    Type: Grant
    Filed: October 23, 2017
    Date of Patent: July 28, 2020
    Assignee: Board of Trustees of the University of Illinois
    Inventors: Songbin Gong, Ruochen Lu, Tomas Manzaneque Garcia, Cheng Tu, Daniel Shoemaker, Chengxi Zhao
  • Patent number: 10718672
    Abstract: A piezoelectric device package includes a board having a lower surface and an upper surface, a plurality of terminals disposed on the lower surface, a piezoelectric device disposed on the upper surface, a thermistor layer and a resistance layer disposed on the lower surface, and a cap lead covering an upper portion of the board.
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: July 21, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Man Han, Yong Sung Kim, Sang Yeob Cha, Young Key Kim
  • Patent number: 10710116
    Abstract: Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: July 14, 2020
    Assignee: General Electric Company
    Inventors: David A. Chartrand, Reinhold Bruestle
  • Patent number: 10715099
    Abstract: A bulk acoustic wave resonator includes a substrate protective layer disposed on a top surface of a substrate, a cavity defined by a membrane layer and the substrate, and a resonating part disposed on the membrane layer. The membrane layer includes a first layer and a second layer, the second layer having the same material as the first layer and having a density greater than that of the first layer.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: July 14, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Je Hong Kyoung, Jin Suk Son, Hwa Sun Lee, Sang Hyun Yi
  • Patent number: 10710176
    Abstract: An elliptical ultrasonic machining device powered by non-contact induction mainly includes an induction power supply device and an elliptical ultrasonic spindle shank, wherein: induction power supply secondary units of the induction power supply device encircle a spindle shank shell of the elliptical ultrasonic spindle shank; induction power supply primary units are arranged at a primary magnetic core seat outside the elliptical ultrasonic spindle shank; the primary magnetic core seat and the elliptical ultrasonic spindle shank have a same circle center, and a small gap exists between the primary magnetic core seat and the elliptical ultrasonic spindle shank; the primary magnetic core seat is fastened on a machine tool spindle seat of a machine tool through a support and keeps still; the elliptical ultrasonic spindle shank is mounted on a machine tool spindle through a taper shank and rotates with the spindle in a high speed.
    Type: Grant
    Filed: May 5, 2018
    Date of Patent: July 14, 2020
    Assignee: BEIHANG UNIVERSITY
    Inventors: Xinggang Jiang, Deyuan Zhang
  • Patent number: 10714675
    Abstract: Provided are a piezoelectric device and a method of fabricating the same and the piezoelectric device may include a substrate including a 3-dimensional pattern surface layer; and a piezoelectric material layer, which is formed on the pattern surface layer and forms a 3-dimensional interface with the pattern surface layer.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: July 14, 2020
    Assignee: UNIVERSITY-INDUSTRY FOUNDATION (UIF), YONSEI UNIVERSITY
    Inventors: Yong Soo Cho, Chan Su Han
  • Patent number: 10702888
    Abstract: There is disclosed an acoustic transducer for communications within an operational bandwidth, the transducer comprising: A signal generator for generating a signal at a centre-frequency within the operational bandwidth; A piezoelectric element having a dielectric constant that varies with temperature; A driving electrode at the surface of the piezoelectric element; A matching network, having a natural frequency at a given temperature, and operable to transfer the signal from the signal generator to the piezoelectric element whilst mitigating electrical loss, the matching network being connected to the driving electrode; Wherein the matching network comprises a temperature compensating capacitor connected in parallel with the piezoelectric element, the temperature compensating capacitor being for counteracting temperature-induced changes to the dielectric constant of the piezoelectric element such that the electrical natural frequency of the transducer is substantially constant over a range of temperatures.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: July 7, 2020
    Assignee: BAE SYSTEMS PLC
    Inventors: Lionel William John Kent, Colin James Harper
  • Patent number: 10707403
    Abstract: An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: July 7, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoshiharu Suemori
  • Patent number: 10707830
    Abstract: An elastic wave device includes a piezoelectric substrate, functional electrodes on the piezoelectric substrate, a support layer on the piezoelectric substrate with a frame shape surrounding the functional electrodes, a cover member on the support layer to seal an opening of the support layer, the cover member including a first main surface facing the support layer, and a second main surface opposite to the first main surface. Recesses are located in the cover member and are open to the second main surface. Via holes extend through the support layer and to bottom surfaces of the recesses of the cover member, the via holes each including an opening that is open to the bottom surface. The area of the opening of each of the via holes is not more than the area of the bottom surface of the corresponding recess of the cover member. First via conductor portions are provided in the via holes and second via conductor portions are provided in the recesses of the cover member.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: July 7, 2020
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Taku Kikuchi, Seiji Kai, Motoji Tsuda, Mitsuyoshi Hira