Patents Examined by C. B.
  • Patent number: 7692148
    Abstract: The invention provides a sensor element formed in a first substrate and having a thermal barrier disposed between the sensor element and a heat source provided elsewhere on the first substrate. The thermal barrier includes at least one pair of trenches formed within the first substrate, individual trenches of the pair being separated by a cavity.
    Type: Grant
    Filed: October 20, 2006
    Date of Patent: April 6, 2010
    Assignee: Analog Devices, Inc.
    Inventors: William A. Lane, Eamon Hynes, Edward John Coyne