Patents Examined by C. Melissa Bunner
  • Patent number: 5154759
    Abstract: A polish formulation containing as components thereof at least one member selected from the group consisting of waxes, solvents, surfactants, thickening agents, abrasives, dyes, odorants and other ingredients normally used in making polishes. The improvement resides in incorporating into the polish formulation a novel reactive amine functional silicone polymer.
    Type: Grant
    Filed: September 19, 1991
    Date of Patent: October 13, 1992
    Assignee: Dow Corning Corporation
    Inventors: Martin E. Cifuentes, David B. Selley