Patents Examined by C Melissa Kowlow
  • Silica molded bodies having low thermal conductivity
    Patent number: 10843965
    Abstract: Hydrophobic shaped silica bodies having low density and low thermal conductivity are produced by forming a dispersion of silica in a solution of binder and organic solvent, and removing the solvent and shaping to form a shaped body. The shaped bodies retain their hydrophobicity, are stable with regards to shape, and are useful in acoustic and thermal insulation.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: November 24, 2020
    Assignee: WACKER CHEMIE AG
    Inventors: Dominik Jantke, Richard Weidner, Konrad Hindelang