Abstract: A method for mounting an integrated circuit having a plurality of leads on a PCB. In order to mount the integrated circuit having a plurality of leads on the PCB, foreign substance on the PCB is first removed and a flux is simultaneously spread over the lead patterns formed on the PCB. After that, by aligning the leads of the integrated circuit with lead patterns on the PCB on which the flux is spread, some leads of the integrated circuit is temporarily fixed to the corresponding lead patterns of the PCB. After soldering the leads of the integrated circuit to the lead patterns of the PCB by radiating an optical beam on the entire whole surface, the soldered PCB is cooled, thereby mounting the integrated circuit on the PCB.

Abstract: A reflow soldering furnace in which a printed board and a plurality of electronic parts mounted thereon are subjected to reflow soldering. The furnace comprises a reflow soldering furnace body including a plurality of heating zones defined by furnace walls, a hot-gas applier, and a radiant-heat applier. The hot-gas applier includes a heat source and a fan for blowing a hot gas of a temperature lower than a target temperature for each zone against a printed board. The radiant-heat applier includes a heater for applying radiant heat of a temperature higher than the target temperature to the printed board. The printed board and electronic parts thereon are heated to the target temperature, the melting point of solder, by means of the radiant heat from the heater. Among these electronic parts, small-sized ones with a relatively small heat capacity are restrained from overheating by the low-temperature hot gas from the hot-gas applier.

Abstract: A soldering device adaptable to dipping method for preventing neighboring leads (L) from being mixed in molten lead (Pb) even though spaces between leads (L) of parts mounted to a PCB substrate (P) are relatively narrow, the device having a lead tub where molten lead is filled up to an upper end thereof and maintained at a predetermined temperature, the device comprising a receiving plate disposed at an upper surface of the lead tub and formed with a receiving unit for soldered parts of PCB substrate to contact the molten lead, a fixing unit mounted at the receiving plate for the PCB substrate to be accommodated with, detached from and fixed to the receiving unit, and an elevation arranged to elevate the receiving plate horizontally and slantingly.

Abstract: So that the brazing of aluminum parts with the use of a flux can be made effectively without employment of a corrodible metallic muffle, furnace inner walls made of carbonaceous refractory sheets are utilized as a brazing space, and an inert atmosphere supplied into this space is protected from the air by furnace outer walls which are made of steel sheets to form a furnace shell and which are made hermetical against the air.

Abstract: A method of diffusion brazing parts made of a superalloy A uses a single-component brazing powder prepared by measuring a quantity of a superalloy powder having a composition identical to the superalloy A and a quantity of a boron and/or silicon flux powder in a proportion of between 0.1% and 40% by weight of the superalloy powder, mixing the powders and placing them with balls made of superalloy A in a container also made of superalloy A, closing the container and keeping its contents in a controlled atmosphere, placing the container in a grinder and operating the grinder to keep the container moving for a period ranging from 30 seconds to 500 hours in order to encrust the flux onto the surface of the grains of the superalloy powder.

Abstract: I/O columns are cast on the I/O pads of an electronic component via a process which uses a template that has a set of alignment holes, and a set of casting holes, and an additional set of pin holes that are interspersed with the casting holes. Initially, the template is placed in a fixture such that the casting holes align with the I/O pads of the electronic component. Next, the template is covered with a mask that exposes all of the casting holes but blocks all of the pin holes. Then the exposed casting holes in the template are filled with a solid metallic material. Next the mask is removed, and the metallic material in the casting holes is melted and re-solidified to thereby form the I/O columns on the I/O pads. Then the electronic component with its I/o columns is separated from the template by pushing on the component with pins that are passed through the pin holes in the template.

Abstract: In a die bonding apparatus, above a work placing table shrouded in the atmosphere of an inert gas, there are provided a pair of gas injecting heads which can be separated from each other to enlarge the opening to the degree that the largest semiconductor package can be inserted through the opening and which can reduce the opening to the degree that a bonding head can be inserted through the opening. The pair of gas injecting heads form at least two layers of gas curtain by injecting an inert gas from the inner wall of the opening, so that the inert gas atmosphere is ensured within a space, so as to maintain the oxygen concentration at a low level thereby to prevent generation of an oxide film. Thus, the oxide film is prevented from generating at a surface of a bonding agent when the bonding agent is molten at the time of a die bonding.