Abstract: A heat pipe comprising a wick, working fluid, a chamber housing the wick and working fluid, and a plurality of wraps of a graphite composite fiber, preferably THORNEL graphite fiber, number P-120 2K. For maximum strength, the wraps are in different directions. The heat pipe can be integrally incorporated and bound to a printed wiring board, thereby eliminating the need for additional inefficient thermal interfaces.

Abstract: A wiring connection structure for a semiconductor integrated circuit device interconnects a plurality of wiring layers isolated by an insulating layer, via a through hole defined in the insulating layer. The wiring connection structure comprises a semiconductor substrate, a first insulating layer, a first wiring layer, a second insulating layer and a second wiring layer. The first insulating layer is formed on a main surface of the semiconductor substrate. The first wiring layer is formed on the first insulating layer. The second insulating layer is formed on the first wiring layer. The through hole is formed in the second insulating layer so as to extend to a surface of the first wiring layer. The second wiring layer is formed on the second insulating layer and connected to the first wiring layer via the through hole. The through hole is a single through hole formed in a region where the second wiring layer overlaps with the first wiring layer.

Abstract: An antifuse may be fabricated as a part of an integrated circuit in a layer located above and insulated from the semiconductor substrate. The antifuse includes a lower first electrode, a first dielectric layer disposed over the lower first electrode, a layer of amorphous silicon disposed above the first dielectric layer, a second dielectric layer disposed above the amorphous silicon layer, and an upper second electrode disposed above the second dielectric layer.

Abstract: A plastic encapsulated integrated circuit package is disclosed which comprises a multilayer ground plane assembly bonded to a lead frame with an integrated circuit die bonded to the composite assembly. The multilayer ground plane assembly is first formed by bonding together a copper sheet and a thermally conductive polyimide material insulating layer to which is also bonded a layer of a b-stage epoxy resin. The ground plane assembly is then bonded to the lead frame by placing the b-stage epoxy layer of the ground plane assembly against the lead frame and heating the ground plane assembly and lead frame to a temperature of from about 120.degree. C. to just under 200.degree. C. for a time period not exceeding about 10 seconds to bond the b-stage epoxy resin to the lead frame without oxidizing it. An integrated circuit die is then attached to the composite assembly with an epoxy adhesive and the die attached assembly is then cured in a non-oxidizing atmosphere in an oven at approximately 150.degree. C.

Abstract: A device that contains a copper substrate; a rigidizing layer and/or a metal layer, and a non-graphitic hard carbon layer deposited on the rigidizing layer; and use as a heat sink or piston for electronic components.