Patents Examined by Callie E. Shosho
  • Patent number: 11833781
    Abstract: A power storage device packaging material includes at least a substrate layer, a metal foil layer having an anticorrosion treatment layer on one or both sides thereof, and a sealant layer in this order. In the packaging material, the sealant layer includes a propylene-based branched polymer-containing layer that contains a propylene-based branched polymer having branched chains.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: December 5, 2023
    Assignee: TOPPAN PRINTING CO., LTD.
    Inventors: Yu Ogiwara, Junya Imamoto, Masayoshi Suzuta
  • Patent number: 11834390
    Abstract: An adhesive composition having excellent adhesive properties and adhesiveness to a variety of plastics such as polypropylene, polyethylene, or a cycloolefin resin. The adhesive composition includes a polymer having a repeating unit derived from a polymerizable compound of the following formula (I): in which X1 and X2 each independently represent a C7 to C20 alkyl group or a C7 to C20 alkoxy group; n represents 0 or 1; Z1 and Z2 each independently represent a single bond or a C1 to C3 alkylene group; R each independently represents an organic group or a halogeno group; m1 and m2 each independently represent any integer of 0 to 4; and Y represents a polymerizable functional group.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: December 5, 2023
    Assignee: NIPPON SODA CO., LTD.
    Inventor: Taiki Yamate
  • Patent number: 11820854
    Abstract: A molecularly resilient and high-energy transferable material and method of reinforcing and strengthening substrates with the same. The material includes aliphatic polyurea moieties coated on the surface of a pre-curing or curing epoxy, that may or may not compose a fiber reinforced epoxy (F/E) layer, constituting an isophorone diisocyanate amine (IDA) epoxy-surface modification (reaction) to form an interfacial epoxy-polyurea hybridized-matrix (IEPM) material between the epoxy (that may reside on an F/E layer) and a cured polyurea layer. Through its unique set of molecular vibrational properties, which are designed into the IEPM by controlling the thermodynamic IPA reaction, the chemically bonded and molecularly resilient (regenerative) IEPM material incorporates significant fracture toughness, loss modulus (material damping), and reduced elastic modulus into structural substrates and high-tenacity fibers to which it is adhered.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: November 21, 2023
    Inventor: Thomas Attard
  • Patent number: 11820105
    Abstract: One aspect of the present invention is a prepreg including a resin composition or a semi-cured product of the resin composition and a fibrous base material, in which the resin composition contains a modified polyphenylene ether compound terminally modified with a substituent having an unsaturated carbon-carbon double bond, and a crosslinkable curing agent having an unsaturated carbon-carbon double bond in a molecule, the fibrous base material is quartz glass cloth, the prepreg contains a silane coupling agent having an unsaturated carbon-carbon double bond in a molecule, in an amount of 0.01% by mass or more and less than 3% by mass with respect to the prepreg, and a cured product of the prepreg has a dielectric loss tangent of 0.002 or less at 10 GHz.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: November 21, 2023
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Mikio Sato, Hiroaki Fujiwara, Yuki Kitai, Masashi Koda, Yasunori Hoshino
  • Patent number: 11814795
    Abstract: The present disclosure relates to weatherproof or moisture-resistant writable or printable paper or paper-containing substrates, which includes recyclable cellulosic sheets coated with a coating layer. Sheets are suitable for writing and printing and are prepared by impregnantly coating a cellulosic substrate. In addition, a composition used for coating paper sheets and related substrates to obtain general-purpose weatherproof sheets comprising a substrate, a polymer, a cross-linking agent and methods for producing and using the same are disclosed. The sheets resist degradation, remain legible, can be written upon when wet, and are recyclable.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: November 14, 2023
    Assignee: JL Darling LLC
    Inventors: John T. Mattingly, Paul Snowwhite
  • Patent number: 11807795
    Abstract: Optical devices comprising at least one optical layer and at least one antistatic layer disposed on at least one surface of the optical layer wherein the antistatic layer comprises the reaction product of: (a) at least one polymerizable onium salt; and (b) at least one polymerizable, non-onium, silicone or perfluoropolyether moiety-containing monomer, oligomer, or polymer.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: November 7, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Bryan V. Hunt, Brandt K. Carter, Maureen C. Nelson, Thomas P. Klun, Jason S. Petaja, Yizhong Wang, Joel D. Oxman
  • Patent number: 11795293
    Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: October 24, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Kazuya Kiguchi, Tomoo Nishiyama, Daisuke Fujimoto, Norihiko Sakamoto
  • Patent number: 11794452
    Abstract: A thermoplastic polymer film comprising a multilayer film having an interpenetrating polymer network (IPN) layer and a polymer layer is provided. The multilayer thermoplastic polymer film may possess beneficial and desirable properties useful in protecting surfaces from harmful environmental conditions or elements, such as for example, stain and scratch resistance as well as high gloss. Methods of making the multilayer film with interpenetrating polymer network are also provided.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: October 24, 2023
    Inventors: David Collette, Ray Stewart, Nathaniel Williams, James Galica
  • Patent number: 11788827
    Abstract: The present strain gauge includes a substrate having flexibility; and a resistor formed from a material containing at least one of chromium and nickel, on the substrate, wherein a first substance having a function of preventing crystal grains as the main component of the resistor from cohering, is added to the resistor.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: October 17, 2023
    Assignee: MINEBEA MITSUMI Inc.
    Inventors: Shintaro Takata, Shinya Toda, Toshiaki Asakawa, Keiki Maeno
  • Patent number: 11780212
    Abstract: The present invention aims to provide a laminate in which a fluororesin layer and a fluororubber layer are firmly bonded. The present invention relates to a laminate including: a fluororubber layer (A); and a fluororesin layer (B) stacked on the fluororubber layer (A), the fluororubber layer (A) being formed from a fluororubber composition, the fluororubber composition containing a fluororubber, a low molecular weight polytetrafluoroethylene, and a multifunctional compound, the amount of the multifunctional compound being 5 parts by mass or more relative to 100 parts by mass of the fluororubber.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: October 10, 2023
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Yuuki Kuwajima, Eisaku Sumino, Takeshi Inaba, Tsuyoshi Noguchi
  • Patent number: 11784153
    Abstract: There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductor element and a light emitting element to a substrate. A thermosetting resin composition comprising: (A) silver fine particles ranging from 1 nm to 200 nm in thickness or in minor axis; (B) a silver powder having an average particle size of more than 0.2 ?m and 30 ?m or less; (C) resin particles; and (D) a thermosetting resin, wherein an amount of the resin particles (C) is 0.01 to 1 part by mass and an amount of the thermosetting resin (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B).
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: October 10, 2023
    Assignee: Kyocera Corporation
    Inventors: Masakazu Fujiwara, Yu Satake, Yuya Nitanai
  • Patent number: 11773286
    Abstract: To provide a composite laminate having excellent adhesiveness to a resin material imparted to a metal base material, such as an aluminum, and a method for producing the same, and a metal-resin bonded article using the composite laminate and a method for producing the same. A composite laminate 1 includes a metal base material 2 and one layer or plural layers of a resin coating layer 4 laminated on the metal base material 2, the resin coating layer 4 is laminated on a surface-treated surface of the metal base material 2, and at least one layer of the resin coating layer 4 is formed of a resin composition containing an in situ polymerizable phenoxy resin.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: October 3, 2023
    Assignee: Resonac Corporation
    Inventors: Kazuo Otani, Shinji Numao
  • Patent number: 11772357
    Abstract: A ready to use surface veil and surface film integrated prepreg layer which is suitable to use in the production of lightweight structural parts/panels with class A surfaces includes a curable bottom base resin formulation including a curable bottom base resin, at least one first toughening agent, at least one accelerator, at least one curing agent and at least one hardener. The prepreg layer further includes a release paper that is coated with the curable bottom base resin formulation to obtained curable bottom base resin formulation coated release paper as a first resin film; a reinforcement fabric; an outer resin formulation including the outer resin which is the curable bottom base resin being 10% more viscous than the resin, at least one thermoplastic toughening agent, at least one accelerator, at least one curing agent and at least one hardener agent.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: October 3, 2023
    Assignee: KORDSA TEKNIK TEKSTIL A.S.
    Inventor: Elif Erdogan
  • Patent number: 11760053
    Abstract: A prepreg which is suitable for producing a fiber-reinforced composite material in a short period of time without using an autoclave, can produce a fiber-reinforced composite material in which the occurrence of voids is suppressed and excellent impact resistance is achieved, and has excellent handling properties; and a fiber-reinforced composite material using the prepreg. This prepreg is a prepreg in which a reinforcing fiber [A] arranged in layers is partially impregnated with an epoxy resin composition containing an epoxy resin [B] and a curing agent [C], wherein the impregnation rate ? is 30-95%, and a thermoplastic resin [D] insoluble in the epoxy resin [B] is unevenly distributed on both surfaces of the prepreg. In addition, in the layers of the reinforcing fiber [A], epoxy resin composition-unimpregnated portions are localized on one surface of the prepreg, and the localization parameter a, which defines the degree of localization, is in the range of 0.10<?<0.45.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: September 19, 2023
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Takuya Yamane, Narumichi Sato, Shiori Kawamoto, Miyuki Tabayashi
  • Patent number: 11745485
    Abstract: An epoxy resin composition for carbon-fiber-reinforced composite material includes (A) a bisphenol F-type epoxy resin that is liquid at 25° C., (B) a polyfunctional amine-type epoxy resin, and (C) 3,3?-Diaminodiphenyl sulfone. With respect to 100 parts by mass of the entire epoxy resin in the epoxy resin composition, the content of component (A) is 40 to 60 parts by mass, the content of component (B) is 30 to 45 parts by mass, and the total content of components (A) and (B) is 85 to 100 parts by mass. The content of component (C) satisfies 1.04?x/y?1.35, where x is a molar number of active hydrogen atoms in the amine of component (C) and y is a molar number of all epoxy groups in the epoxy resin composition.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: September 5, 2023
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Yukihiro Harada, Atsushi Nohara
  • Patent number: 11746241
    Abstract: Disclosed herein is a hydrophilic coating that includes an adhesive agent; an insolubilizer for insolubilizing the adhesive agent; titanium dioxide; and a metal oxide selected from the group consisting of silver oxide, copper oxide, iron oxide, magnesium oxide, and combinations thereof. The hydrophilic coating is useful on the heat transfer surfaces of a condensing heat exchanger.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: September 5, 2023
    Assignee: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Barbara M. Peyton, Carol L. Metselaar, John W. Steele
  • Patent number: 11731411
    Abstract: The present invention relates to a layered structure containing at least one layer (i) comprising a thermoplastic material and at least one further layer (ii) comprising a thermoplastic material bearing at least one embossed hologram, to a process for producing such layer composites and to security documents, in particular identification documents, having the layered structure according to the invention.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: August 22, 2023
    Assignee: Covestro Deutschland AG
    Inventors: Georgios Tziovaras, Heinz Pudleiner, Kira Planken, Stefan Janke, Christoph Koehler
  • Patent number: 11725104
    Abstract: A resin composition includes (A) an epoxy resin, (B) an inorganic filler, and (C) a particulate or a non-particulate elastomer, in which a specific surface area of the (B) component is 10 m2/g or more, a content of the (C) component is 35% by mass or less, and an average particle diameter of the (C) component is 0.8 ?m or less.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: August 15, 2023
    Assignee: AJINOMOTO CO., INC.
    Inventors: Nana Namekata, Yoshio Nishimura
  • Patent number: 11718762
    Abstract: A curable coating composition includes: (a) a binder having a film-forming resin with at least two functional groups, and (ii) a curing agent reactive with the functional groups of the film-forming resin; and (b) solid vulcanized rubber particles that are unreactive with the binder. The curable coating composition is a solid particulate powder coating composition. Multi-layer coating systems and methods of preparing the curable coating composition are also included.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: August 8, 2023
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Troy James Larimer, John Robert Schneider, Amy Liane Toolis, Anthony Michael Chasser
  • Patent number: 11718074
    Abstract: A film with a gas barrier resin having a glass transition temperature of 70° C. or below and an elastomer, and having an oxygen permeability coefficient of 200 mL/(m2·day·atm) or less. In a case where tension is applied to stretch the film in a machine direction (MD) at 20° C. such that a twofold increase in length of the film is kept for 30 seconds, and then the tension is released, a ratio L2/L1 is 1.5 or less, where L1 denotes the length of the film prior to application of the tension and L2 denotes the length of the film subsequent to release of the tension. An elongation ratio at break ETD/EMD of the film is preferably 0.9 or more and 1.7 or less, there EMD denotes the elongation at break in MD and ETD denotes the elongation at break in the transverse direction (TD).
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: August 8, 2023
    Assignee: KURARAY CO., LTD.
    Inventors: Yasuhiro Nonaka, Makoto Suzuki