Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.

Abstract: A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.