Patents Examined by Cardid Everhart
  • Wafer table and semiconductor package manufacturing apparatus using the same
    Patent number: 6780734
    Abstract: A wafer table for supporting a wafer during the sawing process without the use of wafer backing tape and providing for the support and independent elevation of individual chips separated by the sawing process is disclosed. Also disclosed are a series of semiconductor manufacturing assemblies utilizing such a wafer table and methods of using such wafer tables.
    Type: Grant
    Filed: August 12, 2003
    Date of Patent: August 24, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Hong Kim, Heui-Seog Kim