Abstract: A Thin Film Bulk Acoustic Wave Resonator (FBAR), comprising a top electrode layer, a substrate, an acoustic mirror that is formed atop the substrate, and a piezoelectric layer that is formed between the top electrode layer and the acoustic mirror. The acoustic mirror is comprised of a plurality of stacked layers. One of the stacked layers forms a bottom electrode layer. At least another one of the stacked layers comprises a polymer material. The piezoelectric produces vibrations in response to a voltage being applied between the top electrode and the bottom electrode. The acoustic mirror acoustically isolates these vibrations from the substrate. The polymer material is preferably an electronic grade polymer and has a capability of withstanding a deposition of the piezoelectric layer at an elevated temperature. The layers forming the acoustic mirror which do not comprise the polymer material comprise a high acoustic impedance material such as, by example, tungsten (W).

Abstract: An acoustical resonator comprising top and bottom electrodes that sandwich a PZ layer. The resonance frequency of the acoustical resonator may be adjusted after fabrication by utilizing heating elements included in the acoustical resonator and/or by adjusting the thickness of a tuning layer. In the preferred embodiment of the present invention, the electrodes comprise Mo layers. One embodiment of the present invention is constructed on a Si.sub.3 N.sub.4 membrane. A second embodiment of the present invention is constructed such that it is suspended over a substrate on metallic columns. In the preferred embodiment of the present invention, the electrodes are deposited by a method that minimizes the stress in the electrodes.

Abstract: A pole piece for use in an electromagnetic friction clutch is formed by initially providing a preform formed from a magnetically permeable material, such as a ferromagnetic powdered material. The preform includes a face having one or more concentric annular channels or other recessed areas formed therein. The preform is oriented such that the face thereof faces upwardly. Then, a body of a non-magnetically permeable material, such as a non-ferromagnetic material, is laid upon the face of the preform so as to cover at least a portion of the annular channels or other recessed area. The preform and the solid body are next inserted within a sintering oven which heats them to a predetermined temperature. The elevated temperature of the oven causes the solid body of the non-magnetically permeable material to melt and flow into the annular channels or other recessed areas. Some of the melted non-magnetically permeable material also infiltrates into the relatively porous preform of the magnetically permeable material.

Abstract: Electrical connection of an annular corrugated tube having an outer surface shape wherein grooves and ridges are alternately repeated in the axial direction of the tube in a wave form is carried out by cutting the tube at a groove, disposing a clamping member on each side of a ridge at the cut end of the tube and electrically connecting the tube to the clamping member positioned on the cut end of the tube side of the ridge by squashing the ridge with the clamping members.

Abstract: An electronic component mounting method for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.

Abstract: An armature shaft having an eccentric cam body extending from one end thereof is gripped by an adjustable collet mechanism and rotated by a drive motor, preferably a stepping motor, having an output shaft movable in discrete increments. This rotation continues until an imaginary reference point on the periphery of the cam body reaches first and second angular positions. The preferred reference point is the point on the periphery of the end face of the cam body that is farthest from the axis of rotation of the armature shaft. The number of steps necessary to rotate the armature shaft so that the reference point is moved from the first angular position to the second angular position is determined as the armature shaft is rotated and used to determine the position of the reference point relative to a centerline between the first and second angular positions.

Abstract: A pivot assembly formed by driving an oversized pivot shaft through first and second self-lubricating flanged bushings. The bushing in the static part of the assembly has a smaller inside diameter than the bushing in the rotating part. Installation of the shaft removes a substantial portion of the wear layer on the first bushing so as to form a tight, non-rotating fit therewith, and a lesser portion of the wear layer on the second bushing so as to form a tight, rotating fit therewith.

Abstract: A method of manufacturing a magnetic head by bonding a pair of magnetic cores to each other, wherein a residual stress in the magnetic cores upon bonding them together is controlled so that a permeability of the magnetic cores in the vicinity of a magnetic recording medium sliding surface of the magnetic cores may become maximum. Accordingly, the residual stress in the magnetic cores is controlled so that the permeability of the magnetic cores may surely become maximum after forming the magnetic head, thereby ensuring a superior reproduction efficiency of the magnetic head.

Abstract: A method is described for making a merged thin film read/write head where a common layer serves as both a magnetic shield for the magentoresistive read element and the first pole piece for the inductive write element, and where the first pole piece thus includes a pedestal pole tip portion that extends up from the first pole piece layer. During fabrication a nonmagnetic spacer layer is deposited over the second pole tip and the gap layer, and then reactive ion etching (RIE) removes the spacer layer from the top of the second pole tip and the gap layer not beneath the second pole piece, but leaves the spacer layer on the sidewalls of the second pole tip. The ion bombardment of the RIE process is perpendicular to the gap layer and is continued after removal of the spacer layer to also remove the gap layer in the region not beneath the second pole piece so that the first pole piece layer is exposed.

Abstract: A stator coil winding is produced by supplying a wire to a winding frame with a nozzle, holding a terminal end of the wire by a holding device, rotating the winding frame with a driving device to wind the wire around the winding frame while the nozzle is moved by a nozzle-moving device parallel to a rotary shaft of the winding frame, holding a terminal end of the wire wound around the winding frame with the holding device after the wire is completely wound around the winding frame, and carrying the completely wound winding frame to a coil insertion jig with a transferring device, separating the winding frame into winding frame elements at a face orthogonal to the rotary shaft of the winding frame, and the winding frame elements are rotated about a fulcrum in a vicinity of the face to thereby hold the separated winding frame elements so that rotary shafts of the separated winding frame elements are parallel to each other, by a handling mechanism.

Abstract: A method of fixing a suspension to an actuator arm having a mounting portion. The mounting portion has a first hole and a second hole formed in proximity to the first hole. The suspension has a cylindrical projection having an outer diameter slightly smaller than the diameter of the first hole. The cylindrical projection is first inserted into the first hole of the mounting portion of the actuator arm, and a ball having a diameter slightly larger than the diameter of the second hole of the mounting portion of the actuator arm is next forcibly passed through the second hole. Accordingly, the second hole is radially expanded to deform a wall portion defining the first hole, thereby forcibly pressing the cylindrical projection on the mounting portion of the actuator arm to fix the suspension to the actuator arm.

Abstract: A method of manufacturing a magnetic head suspension having a circuit wiring pattern member such that a circuit wiring pattern is formed integral with a suspension via a flexible insulating base member, comprising the steps of: preparing a laminated plate composed of a flexible insulating base member (2), a conductive layer (6 or 3) formed on one surface thereof, and an elastic metal layer (5 or 1) formed on the other surface thereof; forming a desired circuit wiring pattern (3) in the conductive layer (6) of the laminated plate and an elastic suspension (1) in the elastic metal layer (5) thereof simultaneously, in accordance with photo-fabrication method including both-side simultaneous exposure method; forming a bonding metal layer (10) on the circuit wiring pattern (3) by plating; forming a cover coat layer (11) so as to cover the bonding metal layer; further forming a metal mask (13 or 13A) by forming a surface metal layer (12) on the cover coat layer and by etching the surface metal layer (12) or else by

Abstract: An improved ultrasound transceiver array for permitting improved imaging is taught. The array may be either a two dimensional array for volumetric imaging or a one dimensional array of elements shaped to permit a more precise beam focus for finer resolution imaging. An Nd:YAG laser is used to machine a workpiece from both ends to produce kerfs which taper inwardly from the transceiving side of the array thereby permitting a stronger ultrasound signal and clearer imaging.

Abstract: An improved method for forming a magnetic head which efficiently allows multiple head elements of varying gap length to be located on a common wafer. A multiple gap magnetic head is formed by depositing a first magnetic layer on a wafer such that the first layer extends across all the head element segments Two separate insulating layers are individually deposited over the first layer, with a thin etch stop barrier layer being deposited between the insulation layers over heads which are to have a narrower gap length. The top insulation layer covering the etch stop barrier layer is then removed, and a second magnetic layer deposited over all the head element segments on the wafer. In addition to simplifying the fabrication process, the etch stop layer allows tight processing control to be maintained when creating the different gap lengths.

Abstract: Armature start and finish wires are trimmed after connection to their associated commutator tang by use of a knife edge carried by an otherwise conventional lead guide mechanism. The lead guide mechanism moves the knife edge into position against the coil lead, and the coil lead is drawn across the knife edge by pivotal movement of a wire gripper holding the lead. The knife edge preferably comprise a blade removably secured to a portion of the lead guide mechanism, but the knife edge may alternatively be formed, by machining for example, on a part of the lead guide mechanism itself.

Abstract: A process for producing single-layer or multi-layer microcoils or microcoil arrays that optionally have a magnetic core area to increase the coil inductance and to guide the magnetic flux. In this process, plastic films (e.g., made of polyimide or polyester), are applied using pressure and heat to serve as the insulation layers. This eliminates the need for curing the insulation and expensive leveling operations.

Abstract: In a chip type common mode choke coil, a plurality of non-magnetic sheets on which conductor lines are formed are laminated one on another to form a non-magnetic member, and the conductor lines are connected to form primary and secondary coils inside the non-magnetic member, and a pair of magnetic layers are formed on the upper and lower surface of the non-magnetic member, and magnetic cores are arranged substantially at the centers of the loops of the coils in such a manner that they penetrate the non-magnetic member and are connected to the pair of magnetic layers, whereby a closed magnetic path crossing the primary and secondary coils is formed.

Abstract: An electronic socket adapter includes an insulative carrier and an array of a plurality of surface mount contacts carried on the base. The pins may be floatably mounted on the carrier. A plurality of relatively large openings are formed in the carrier between adjacent contacts in the array. The openings provide improved heat flow in the region of the surface mount portions of the contacts and also provide for visualization of the surface mount portions of the contacts during and after soldering.

Abstract: An opening is formed in a region of a circuit board opposite a vibration region E of a piezoelectric element. The piezoelectric element is mounted to the circuit board, and electrical connections extend between and support the piezoelectric element from the circuit board by a solder. The soldered connection portions are surrounded by a bonding agent. An opening in the circuit board prevents any excess bonding agent from invading the vibration region E of the piezoelectric element, and the bonding agent assists in dispersing stresses exerted on the circuit board thereby minimizing the stresses transferred to the piezoelectric element.

Abstract: A method for fabrication of a probe includes the steps of: (1) forming a structure wherein a contact part formed on one side of an insulating flexible substrate and a conductor formed on either side or the inside of the flexible substrate are electrically continued, and (2) joining the flexible substrate and a rigid frame substrate capable of supporting the tension in the planar direction of the flexible substrate at the outer periphery thereof, by bonding them by lamination pressing after heating, or by heating after lamination pressing, thereby applying a planar tension to the flexible substrate enclosed by the rigid substrate.