Patents Examined by Carl Whitehad, Jr.
  • Patent number: 6069026
    Abstract: This invention relates to the fabrication and assembly of semiconductor chips, substrates, and modules, and more particularly to methods and apparatus for achieving flexible, low-cost manufacturing. Commercial and military systems today are placing increasing demands on flexible application and reliable operation, as well as on simplified manufacturing.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: May 30, 2000
    Assignee: Texas Instruments Incorporated
    Inventors: Robert E. Terrill, Judith Sultenfuss Archer