Abstract: This invention relates to the fabrication and assembly of semiconductor chips, substrates, and modules, and more particularly to methods and apparatus for achieving flexible, low-cost manufacturing. Commercial and military systems today are placing increasing demands on flexible application and reliable operation, as well as on simplified manufacturing.
Type:
Grant
Filed:
August 18, 1997
Date of Patent:
May 30, 2000
Assignee:
Texas Instruments Incorporated
Inventors:
Robert E. Terrill, Judith Sultenfuss Archer