Abstract: There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside

Abstract: A terminal board including a cup-shaped body having a peripheral outer assembly flange substantially flush with an end wall of the cup-shaped body and in turn having click-on connecting means; a supporting base inserted inside the cup-shaped body and having, on a first face facing away from the end wall of the cup-shaped body, respective electrically conducting tracks, to which respective electronic components of a capacitive or capacitive-inductive noise filter are fixed, and respective, e.g.