Abstract: A holder located on a casing using for loading a hard disk includes a bottom surface, at least a first elastic element and at least a second elastic element. The bottom surface is facing to a first surface of the casing. The first elastic element is located on the bottom surface having a first end connected to the bottom. At least a part of the first elastic element is configured through an opening and clipped on a second surface of the case. There is at least an opening configured through the first surface and the second surface. The second surface is in opposition to the first surface. A third end of the second elastic element is connected to the bottom surface, and at least a part of the second elastic element contacts against the first surface.

Abstract: The present application discloses a display unit in which a display unit is supported by a support. Particularly, in the configuration in which are provided a display section including a face plate and a rear plate arranged opposite to the face plate and a support supporting the display section, the display section is bonded to and supported by the support.

Abstract: A radiation shielded semiconductor package for use in any variety of industries and applications is disclosed. In one embodiment, a radiation shielded semiconductor package comprises a radiation shielding base, one or more non-shielding sidewalls coupled to the shielding base, one or more radiation shielding flanges coupled to the sidewall, and one or more non-shielding coupling flanges coupled to the shielding flange. The base, the non-shielding sidewall, the shielding flange, and the non-shielding coupling flange define a device cavity, and at least one semiconductor device is positioned within the device cavity. A radiation shielding lid is coupled to the coupling flange and hermetically seals the semiconductor device within the device cavity. The shielding lid comprises shielding lid body and a non-shielding lid flange coupled to the lid body and is configured to couple to the coupling flange.

Abstract: The present invention provides methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

Abstract: The present invention is directed to a method and apparatus for mitigating electromagnetic waves emanating from an electronic device. The apparatus comprises a cover member, a bight extending from one end of the cover member, and a retaining plate spaced from the cover member and connected to the bight to provide a biasing force away from the cover member and towards an electronic device. The cover member is configured to overlie an opening in the chassis of the electronic device and the retaining plate is configured to abut cabling extending out of the chassis. In this way, the apparatus attenuates electromagnetic waves radiating emanating from an opening in a chassis of an electronic device and conducted along cabling as a noise signal superimposed upon the intended signal.

Abstract: An apparatus for connecting an integrated circuit to a support has a circuit board having a first surface for attaching the integrated circuit and a second surface opposite to the first surface. Recesses are provided in the second surface for receiving at least portions of solder balls for electrically and mechanically connecting the circuit board to the support. Solder pads are formed within the recesses. An IC BGA package making use of such an integrated circuit can be implemented with a reduced height and improved electrical characteristics when compared to existing designs.

Abstract: A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

Abstract: Various aspects of the invention provide microelectronic component assemblies, memory modules, computer systems, and methods of assembling microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a non-leaded first package, a second package, and a plurality of electrical junctions. The first package has a confronting surface that includes an exposed back surface of a microelectronic component and exposed contact surfaces. The second package has a confronting surface that includes an exposed back surface of a microelectronic component and exposed contact surfaces of a number of leads. Each of the junctions couples one of the contacts to the contact surface of one of the leads. The electrical junctions may also physically support the packages with their respective confronting surfaces juxtaposed with but spaced from one another, defining a peripherally open fluid passage and enhancing thermal performance.

Abstract: A device for providing radio frequency shielding is disclosed. The device includes a frame and cover removably attached to the frame. The frame is configured to extend generally around the periphery of an electronic component. The frame has an upper wall, sidewalls depending therefrom, and a plurality of stiffening flanges extending from the upper wall towards an interior portion of the frame. The cover has an upper surface and a plurality of members extending therefrom for engagement with the sidewalls of the frame. The cover and the frame form an enclosure for radio frequency shielding the electronic component.

Abstract: A power electronics module includes a heat sink and an electronic package having a first layer in direct thermal communication with the heat sink. At least one electronic component is disposed between the first layer and a second layer. A thermally conductive element is in direct thermal communication with the second layer and carries heat from a first portion of the second layer to a second portion of the second layer such that the heat is transferred from the second portion of the second layer to the heat sink through the first layer.

Abstract: A computer having a main cabinet to which a hard disk drive can be mounted easily and quickly, comprises a hard disk casing having a support bracket with an opening and a movable bracket. The support bracket is installed on the main cabinet, and receives at least one hard disk drive through the opening. The movable bracket closes at least a part of the opening of the support bracket and comprises a hinge part movably supporting the movable bracket relative to the support bracket, and at least one first supporting projection projected from a plane of the movable bracket toward the opening and inserted into a first screw hole provided in a first side of the hard disk drive at a closing position of the movable bracket to support the hard disk drive.

Abstract: An EMI shield for blocking and dissipating electromagnetic interference. The EMI shield includes a primary conductive member having a plurality of catches extending into a plurality of receptacles defined in an absorptive member so as to firmly connect the members. Advantageously, the absorptive member is sufficiently solid to be retained against the primary conductive member during normal use. In addition, the absorptive member is constructed of materials capable of withstanding a temperature range of 139° C. to 260° C. associated with most soldering operations. In this manner, the conductive and absorptive members can be attached prior to soldering of the EMI shield to electronic circuitry of a mobile station. The catches may have sharp edges allowing the absorptive member to be pressed onto the catches.

Abstract: A support hole, screw holes, and eleven orientating holes are formed in a plate. The orientating holes are each positioned asymmetric to any other thereof about a center of the plate.

Abstract: A shielding apparatus for an electric device comprises a first lead, a second lead and an inverted U-shaped cover, constituting a metallic inserting component. The first and second leads insert into two sides of the electric device, respectively, and electrically connect with a ground terminal of a circuit board. The inverted U-shaped cover contacts with the top of a metallic shell of the electric device and clips on the two sides of the metallic shell. Functionally, the metallic inserting component can reduce noises from electromagnetic interference, and tightly fix on the metallic shell without electrical welding so that the reliability of assembly will be improved.

Abstract: An actuating element for inserting and removing a flat module by leverage, the element having an end piece designed to be connected to a flat module. An actuating lever, which is pivotally mounted on the end piece, has at least one grip section and a locking element, which can be displaced, particularly slid between two connection positions. In a first connection position, the actuating lever retains the flat module in its inserted state and in a second connection position, the actuating lever is released to remove the module by leverage. The actuating element has a connecting element, which is activated in the first connection position of the locking element, which can be displaced into a third connection position, in which the actuating lever is retained in the first position, corresponding to the inserted state of the flat module and in which the connecting element is disconnected.

Abstract: The present invention provides an electromagnetic wave shielding method and window capable of bringing a conductive shielding layer into conduction to the outside without a connecting structure, and a manufacturing apparatus, a transport system, and a building construction each having the electromagnetic wave shielding window. In the invention, a conductive shielding layer having a visible light transmitting property is provided on a surface of window face members having an electrical insulating property and a visible light transmitting property, and the window face members provided with the conductive shielding layer are brought into close adhesion and thereby fixed to a conductive window frame member through an insulation layer provided to a rim portion, whereby electrostatic-capacitance coupling is induced between the conductive shielding layer and the window frame member.

Abstract: An improved radiation resistant door seal which is comprised of a door member and frame member. The door member comprises a plurality of flange members and a conductive blade which extends lengthwise and is insertable within a channel formed within the frame member. The channel within the frame member further comprises side walls with bowed contact members on each side of the walls to engagingly capture the blade when inserted therein. A plurality of finger-like contact members is positioned within the door member such to provide enhanced shielding and electrical contact areas to thwart radiation penetration.

Abstract: A monitor includes a monitor main body, a base member supporting the monitor main body, a monitor hinge supporting the monitor main body to be tilted against the base member within a predetermined angle, and a shield rotatably combined to the monitor main body to shield a gap between the monitor main body and the base member rotating downwardly when the monitor main body is tilted up. With this configuration, a tilting angle range of the monitor main body can be easily widened. Further, the shield can shield the gap shown between a base member and a monitor main body due to the tilt of the monitor main body.

Abstract: The invention relates to a cover (200,300,400,500,600) for an electronic device (100), which electronic device comprises a substrate (110) and at least two electronic components (120,130), one of which generates an electromagnetic field around itself, where the cover has a first main surface (210) that faces towards the electronic device, comprises a material that conducts current, and is designed and arranged in such a way in relation to the electronic components that a cooling medium can pass from the first (120) to the second (130) electronic component. The invention is characterized in that, by virtue of its shape and its material content, the cover has been given an increased ability to absorb at least part of the electromagnetic field that is generated by at least one of the electronic components.

Abstract: A personal digital assistant with static electricity preventing function, comprising: a metallic or electroplated chassis installed in the personal digital assistant serving as the grounding for the personal digital assistant; a touch panel module installed on the chassis; and a metallic shielding piece installed on the touch panel module and is equipped with a grounding section on the side, of which, the grounding section is connected to the chassis dispersing electrostatic charges, meanwhile, fixes the touch panel module firmly to the chassis.

Abstract: A game bird decoy is formed as a shell representative of the upper portion that is above the waterline of a floating game bird represented. There is an open cavity below the upper portion that terminates in a waterline rim. The head is formed folded out with two similar sides to be folded together and bonded to yield a realistic head. The head is attached to the body by inserting the neck into a hole provided in the body shell. A slit in the neck provides access to the cavity within for storage of line, weight, and the like. The decoy is formed from flat sheet stock of closed cellular foam, preferably, of polyethelene. The color and color patterns as desired on the final product are applied to the flat sheet stock before vacuum forming. Painting, printing and silk screen processes are used as dictated by batch quantity considerations.