Abstract: A fluid flow control for use with a process chamber. In the disclosed embodiment, the process chamber is for ion implantation of a workpiece and the fluid flow control is to assure the flow rates are maintained at values which are efficient in evacuating and pressurizing the chamber but are not high enough to dislodge particulate contaminants from the process chamber walls. In the disclosed design, the invention has utility both in instances in which wafers are directly inserted into the process chamber for ion implantation and in which the wafers are inserted into the chamber by use of a load-lock which avoids the requirement that the process chamber be cyclicly pressurized and depressurized.

Abstract: An improved filling system for containers of mixtures of liquid and solid material where the liquid/solid ratio is critical is disclosed. A prior art problem was that sticky solid material would adhere to the receptacle or bucket in which it was delivered to a filling chute or funnel and it would also stick to the funnel. This problem is solved by putting the sticky solid in the buckets and by using the liquid to flush the funnel and by using an air jet to remove any remaining particles from the buckets which are upturned over the funnel. Alternately, a part of the liquid may be placed in the delivery bucket and when it is tilted or turned upside down to fill the container the remaining part of the liquid is used to rinse the receptacle. The filling system is especially useful for soups containing noodles or other pasta products.