Abstract: Electrical feedthroughs in printed circuit board support substrates for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide and one or more layers of glass, and then filling the remainder of the feedthroughs with a conductive metal via fill ink. After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate.
Type:
Grant
Filed:
January 27, 1995
Date of Patent:
October 15, 1996
Assignee:
David Sarnoff Research Center, Inc.
Inventors:
Thomas P. Azzaro, Barry J. Thaler, Edward J. Conlon, Ananda H. Kumar
Abstract: A coated material comprising (a) a solid dielectric or semi-conductive substrate which is (b) partially or completely coated on at least one surface with a silicate in which a crystalline charge transfer complex is incorporated.The material can be used as an antistatic or electrically conductive material, preferably in the form of screens or picture tubes provided with an antistatic finish.