Abstract: A workpiece is held at a welding station by several clamps during welding. After welding, the workpiece is transferred to a checking station where a determination is made of the actual location of critical points on the workpiece. The actual critical point locations are compared with ideal critical point locations to determine if there is any error in the manner in which the workpiece was held by the clamps. If an error is determined, one or more of the clamps are adjusted to compensate for the error when holding a subsequent workpiece for welding. Apparatus is also provided for carrying out the method of this invention.

Abstract: A method of brazing a Ti-15 Mo-3 Nb-3 Al-0.2 Si base material includes the steps of coating a braze material onto a base material. The braze material comprises substantially only a Ti--Cu--Ni--Zr mixture, with the mixture comprising about 40 wt % Ti. In particular, the braze material may comprise 40Ti-20 Cu-20 Ni-20 Zr. A following step includes heating the braze material and then forming a braze joint between the braze and base materials. The heating step can occur from about 760 to 932.degree. C. and over 15 to 90 minutes.

Abstract: A method of welding two tubular members (1, 2) in end to end relationship includes providing the end of each tubular member (1, 2) to be joined with a shaped portion (3, 4). The shaped portion (3, 4) has a surface (10) which is substantially perpendicular to the radius of the tubular member (1, 2) and a second surface (13) at an obtuse angle to the radius of the tubular member (1, 2). Hence, when the ends to be joined are brought into contact with each other, shaped portions (3, 4) define a three-sided channel (13, 10, 13). A ring-shaped member (6) having a quadrilateral cross section is located in the channel. The ring-shaped member (6) has a radius which is greater than the radius of the first surface and less than the radius of the external wall of the tubular member (1, 2).

Abstract: In a method of making a wire connection of predetermined shape between a first connecting point located on a semiconductor chip and a second connecting point a capillary is moved along a predetermined trajectory. After attaching the wire at the first connecting point the capillary is moved up to a first point for the performing of one or two kinks and for the pulling out of the wire as far as the required total length of the wire connection. From the first point, the capillary is moved along a circular arc up to a second point, at which the wire is locked in the capillary. The circular arc is centered in the first connecting point or in the immediate vicinity of the first connecting point. The method is suitable for the wiring of CSPs (Chip Scale Packages). The movement along the circular arc prevents the wire from being pushed back through the capillary. As soon as the wire is locked in the capillary, the second connecting point can be approached without difficulty.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: The present invention provides an efficient method for attaching computer system components which greatly reduces or eliminates damage to the PC board or components. The method for attaching the computer component includes the steps of: positioning the component on the PC board so that the component leads are aligned with the corresponding pads on the PC board; attaching the anchoring leads to its corresponding pads on the PC board; and heating the attachment media with a heated air jet so that the heated air jet heats the attachment media to a temperature between the melting point of the attachment media and the vaporization point of the attachment media, wherein the heated air jet is moved back and forth along the edge of the component being attached.

Abstract: A wire bonding method for joining a metal wire with a bonding pad disposed on a semiconductor element by using a load and supersonic wave vibration, comprising: during interval of time from contact of the metal wire with the bonding pad to application of the supersonic wave vibration, continuously applying a first bonding load and a second bonding load which is lower than the first bonding load; and after application of the supersonic wave vibration, continuously applying a third bonding load of a size of about 50% of the load of the second bonding load and a fourth bonding load which is lower than the first bonding load and higher than the third bonding load. The reliability of the fine wire bonding joint is improved remarkably, whereby a high quality semiconductor device cna be produced at a low cost.

Abstract: A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm.

Abstract: Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the terminal pin after removing the coating. In contrast, in the case of conventional soldering method, when a terminal pin, which is provided on a terminal base and has an end portion of a coil wound therearound, is dipped in molten solder contained in a solder bath, there is caused no relative displacement between the pin and the molten solder. Thus, sometimes, the coating formed on the coil still remains, so that the soldering connection between the terminal pin and the coil is not sufficiently achieved. However, in accordance with the method and apparatus of the present invention, the firm connection therebetween is achieved. Consequently, the reliability thereof is enhanced.

Abstract: A big scale (500 cc) golf club head fabrication method includes the step of preparing molds for making a top cover panel, a bottom cover panel and a face panel, the step of preparing metal alloy plate materials and then cutting the metal alloy plate materials into the desired sizes and then using the molds thus obtained to forge the metal alloy plate materials into the desired top cover panel, bottom panel and face panel respectively, and the step of welding the obtained top cover panel, bottom panel and face panel in a vacuum tank to form a golf club head and then polishing the golf club head into a finished product.

Abstract: Method and apparatus, by which the relative displacement between molten solder and a terminal pin is caused and further, a coating formed on an end portion of a coil is removed by molten solder and thus the terminal portion is firmly soldered to the terminal pin after removing the coating. In contrast, in the case of conventional soldering method, when a terminal pin, which is provided on a terminal base and has an end portion of a coil wound therearound, is dipped in molten solder contained in a solder bath, there is caused no relative displacement between the pin and the molten solder. Thus, sometimes, the coating formed on the coil still remains, so that the soldering connection between the terminal pin and the coil is not sufficiently achieved. However, in accordance with the method and apparatus of the present invention, the firm connection therebetween is achieved. Consequently, the reliability thereof is enhanced.

Abstract: So that the brazing of aluminium parts with the use of a flux can be made effectively without employment of a corrodible metallic muffle, furnace inner walls made of carbonaceous refractory sheets are utilized as a brazing space, and an inert atmosphere supplied into this space is protected from the air by furnace outer walls which are made of steel sheets to form a furnace shell and which are made hermetical against the air.

Abstract: The present invention provides a friction stir welding device for optimizing the depth of a friction stir welding tool in a workpiece. The welding device includes a spindle and a welding tool in rotatable communication with the spindle. The welding device also includes an inner housing defining an aperture through which the welding tool at least partially extends. Preferably, the inner housing has a plurality of cam followers. The device also includes an outer housing defining an aperture for at least partially receiving the inner housing. The outer housing has a base member and a riser that is rotatably mounted to the base member and that defines a plurality of inclined surfaces upon which the plurality of cam followers ride. The welding device includes a sensor in electrical communication with a controller for measuring the magnitude of force exerted by the welding tool upon the workpiece.

Abstract: In a spot welding gun which is made up of a gun main body which is operated for equalization by a driving source, a stationary electrode tip which is immovable relative to the gun main body, and a movable electrode tip which is connected to a pressing source, both electrode tips are pressed to a workpiece with an even force, to thereby perform a high quality spot welding. The driving source is controlled such that the electrode force of the stationary electrode tip, by the driving source, to the workpiece becomes substantially zero. In this manner, there occurs no difference in the electrode forces by both the electrode tips to the workpiece.