Patents Examined by Chanda Chaudhari
  • Method of manufacturing a semiconductor device using a mold
    Patent number: 6723583
    Abstract: The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: April 20, 2004
    Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co. Ltd., Hitachi Yonezawa Electronics Co., Ltd.
    Inventors: Noriyuki Takahashi, Masayuki Suzuki, Kouji Tsuchiya, Takao Matsuura, Takanori Hashizume, Masahiro Ichitani, Kazunari Suzuki, Takafumi Nishita, Kenichi Imura, Takashi Miwa