Abstract: The present disclosure relates to a vacuum processing apparatus. The vacuum processing apparatus includes a processing container capable of maintaining an inside thereof in a vacuum atmosphere, a stage provided in the processing container and on which a substrate is placed, a support member passing through an opening formed at a bottom of the processing container to support the stage from below, a holder part located outside the processing container, a flange part arranged around the opening on the outside of the processing container, and a sealing part configured to be expandable and contractible and provided inside the spherical bearing along the circumferential direction of the opening so as to airtightly seal at least a space between the flange part and the holder part.

Abstract: An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.

Abstract: A semiconductor manufacturing apparatus includes a heating part, a first electrode, a first insulating part, a gas supply part, a second electrode, and a second insulating part. The heating part is arranged to be in one surface side of a substrate. The first electrode is arranged around the heating part. The gas supply part is arranged to be in another surface side of the substrate. The second electrode is arranged around the gas supply part. The first electrode and the second electrode are arranged to overlap with an outer edge portion of the substrate, which is a region existing from an outer peripheral end of the substrate to a position inside by a predetermined length, in a direction in which the first electrode and the second electrode face each other. The first electrode is arranged to be in contact with part of the outer edge portion on the one surface side.

Abstract: A method comprises processing a substrate in a gas enclosure to form a film on one or more portions of the substrate. The method further comprises, while processing the substrate, circulating gas along a circulation path through the gas enclosure. Circulating the gas may comprise flowing gas through an exhaust housing enclosing a printhead assembly housed in the gas enclosure and filtering the gas flowing downstream of the printhead assembly from the exhaust housing.

Abstract: An electrode manufacturing system includes: a doping unit; a cleaning unit: and a conveyor unit. The doping unit performs a process of doping an active material in a strip-shaped electrode with an alkali metal, the strip-shaped electrode including an active material layer formed portion in which an active material layer including the active material is formed, and an active material layer unformed portion in which the active material layer is not formed. The cleaning unit cleans the active material layer unformed portion that is adjacent to the active material layer formed portion. The conveyor unit conveys the electrode from the doping unit to the cleaning unit.

Abstract: Metrology slot plates, processing chamber lids and processing chambers having metrology slot plates are described. Each of the metrology slot plates independently comprises one or more of a plate blank, a reflectometer, a capacitance sensor, a gas flow meter, a manometer, a pyrometer, a distance sensor (laser) or an emissometer.

Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

Abstract: A multi-slot die coater which can improve a problem of structural vulnerability to deformation and torsion. The multi-slot die coater including a lower slot and an upper slot includes a lower die block; an intermediate die block disposed on the lower die block to form the lower slot therebetween; and an upper die block disposed on the intermediate die block to form the upper slot therebetween, wherein at least one of the lower die block, the intermediate die block, and the upper die block includes a metal coating layer on a ceramic body.

Abstract: A temperature-controlled shield for an evaporation source is described. The temperature-controlled shield is configured to provide a pre-heating zone or a post-cooling zone.

Abstract: A method and system for treating calcium-based stone having a surface to be treated for corrosion and stain resistance is provided. The system comprises a sanding unit to sand the surface of the calcium-based stone with a grit size of 40 to 100 to promote coating adhesion. The system further comprises a coating unit to coat the surface of the calcium-based stone with a predetermined amount of a coating material for corrosion and stain resistance defining an uncured coating on the surface. The system further comprises a curing unit to cure the uncured coating on the surface with a photo-initiator defining a cured coating on the surface. The system further comprises a polishing unit to polish the cured coating on the surface with a grit size of 1000 to 3000. The system further comprises a buffing unit to buff the cured coating on the surface with a fabric defining a treated surface of the calcium-based stone.

Abstract: The present application provides mask plate, fabrication method thereof, and mask plate assembly. The mask plate includes two opening areas being respectively on different sides of mask pattern area along first direction, and two welding areas. One welding area is on a side of one opening area away from the mask pattern area along first direction, and the other welding area is on a side of the other opening area away from mask pattern area along first direction. Evaporation holes are arranged in mask unit, buffer holes are arranged in each opening area, and ratio of maximum dimension of buffer hole in any direction in plane where the mask plate is located to maximum dimension of evaporation hole in the direction is greater than 100. Buffer holes are distributed at equal intervals along a second direction, and second direction is in the plane and is perpendicular to first direction.

Abstract: A technique for improving cold spray deposition conditions for cold spray additive manufacture of parts involves providing an in-situ temperature feedback controller with a remote instantaneous temperature sensor supplying surface temperature measurements of the deposition surface, and a (preferably long pulse) laser for heating. Temperature feedback allows for control over deposition conditions yielding predictable deposition properties.

Abstract: Provided is an apparatus for cooling a hot-dip plated steel sheet, the apparatus being capable of reducing comb-pattern surface defects occurring on the edge portion of the hot-dip plated steel sheet. The apparatus includes: a gas knife for spraying wiping gas to a steel sheet that has passed through a plating bath, thereby adjusting the plating thickness thereof; a defect prevention portion installed downstream of the gas knife so as to spray cooling gas to the steel sheet, thereby cooling same; and a moving portion for driving the defect prevention portion such that same moves.

Abstract: The present invention discloses a process and device for preparing laser PVC. The device includes an upper transmission roller, a support mechanism, a spraying mechanism, an impurity removal mechanism, and a lower transmission roller; the upper transmission roller is disposed above the lower transmission roller, and the two are configured to implement delivery of a PVC film at a station for preparing a laser layer by spraying; the support mechanism is disposed between the upper transmission roller and the lower transmission roller and is in contact with a back surface of the PVC film, and the spraying mechanism is disposed opposite to the support mechanism; and a curing mechanism is disposed in a fitting manner at the coating position; and the impurity removal mechanism is disposed at a front end of the spraying mechanism.

Abstract: Disclosed is a method and apparatus for making a lithium-ion electrochemical cell component by advancing a substrate for a lithium ion cell between opposing first and second calendering rolls, depositing by atmospheric plasma deposition particles of electrode material comprising an active electrode material and a metal into a gap between a first side of the substrate and the first calendering roll, wherein the metal is surface-activated by the atmospheric plasma; and pressing the deposited particles of the active electrode material and the metal particles between the first and second calendering rolls into an electrode layer on the first side of the substrate.

Abstract: A coating shim and a coating device, for applying a first slurry and a second slurry to an object to be coated are provided. The coating shim includes: a first flow channel for applying the first slurry to the object to be coated to form a first coating layer; and a second flow channel for applying the second slurry to the object to be coated to form a second coating layer. The first flow channel has a first slurry outlet at a first end face of the shim facing the object to be coated, the second flow channel has a second slurry outlet at the first end face, and the first slurry outlet and the second slurry outlet are configured to partially overlap in a thickness direction of the shim, such that the first coating layer and the second coating layer partially overlap in the thickness direction of the shim.

Abstract: A substrate holding apparatus is used for a substrate processing apparatus for supplying the processing liquid to a substrate. The substrate holding apparatus includes a holding member, a ring member, and a rotation mechanism. The holding member holds the substrate in a horizontal attitude. The ring member is in a shape of a ring surrounding a peripheral edge of the substrate held by the holding member, and has an upper surface level with or positioned below a front surface of the substrate. The rotation mechanism rotates the holding member and the ring member about a rotation axis at rotation speeds different from each other and/or in rotational directions different from each other, the rotation axis being a vertical axis passing through the substrate held by the holding member.

Abstract: The present technology relates to an electrode slurry-discharging shim, and a coating die comprising same, the present technology allowing superbly even coating to be assured even when the electrode slurry coating is at a high load level. In one example, the present technology provides a coating shim for electrode slurry discharge according to the present invention having a step portion configured to be formed at an end of an electrode slurry discharge flow path and to increase a width of the discharge flow path, and the step portion is formed at opposite sides in a width direction of the electrode slurry discharge flow path.

Abstract: The present disclosure provides a sputtering reaction chamber and a process assembly of the sputtering reaction chamber. The process assembly includes a liner, and the liner includes an integrally formed body member and a cover member. The cover member may extend from a bottom of the body member to an inner side of the body member and may be configured to press an edge of a to-be-processed workpiece when a process is performed. A cooling channel may be arranged in the cover member and the body member and may be configured to cool the cover member and the body member by transferring coolant. The process assembly of the sputtering reaction chamber and the sputtering reaction chamber provided by the present disclosure can reduce heat radiation of the process assembly to the to-be-processed workpiece and released gases and impurities to effectively reduce a whisker defect and improve a product yield.

Abstract: A fluid spraying system includes a fluid applicator having a tip that atomizes a fluid. The fluid spraying system also includes a pump configure to pump the fluid from a fluid source to the tip and a control system. The control system identifies at least one characteristic of the tip or the fluid and communicatively couples to the pump. The control system also controls an operating characteristic of the fluid spraying system based on a characteristic of the tip or the fluid.