Patents Examined by Chris Fiorilla
  • Patent number: 6827780
    Abstract: An apparatus for applying powder to at least an interior surface of a hollow object includes a powder discharge device adapted to receive powder and discharge the powder through an outlet. An object holder is configured to hold the object such that the outlet is positioned within the hollow object adjacent the interior surface. A rotating mechanism is configured to engage and rotate the hollow object such that the powder discharged from the outlet coats the interior surface as the interior surface rotates past the outlet. The powder discharge device may be a powder fluidizing bed unit including a chamber with a powder discharge opening in the form of an elongate slot.
    Type: Grant
    Filed: March 4, 2002
    Date of Patent: December 7, 2004
    Assignee: Nordson Corporation
    Inventor: Christopher P. Bertellotti
  • Patent number: 6824613
    Abstract: A substrate processing apparatus can efficiently form, e.g. by electroless plating, an interconnects-protective layer on the surface of a substrate at a low initial cost for the apparatus and a low running cost without the need for a wide installation space. The substrate processing apparatus includes a loading/unloading and cleaning area accommodating a first transfer robot which has a hand adapted for handling a dry substrate and a hand adapted for handling a wet substrate, a loading port which loads a substrate cassette that houses a substrate, and a cleaning unit for cleaning a substrate. A plating treatment area accommodates a second transfer robot which has a back surface-attracting type of hand provided with a reversing mechanism, a pretreatment unit for carrying out pretreatment of a substrate before plating, and a plating treatment unit for carrying out plating treatment of the substrate.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: November 30, 2004
    Assignee: Ebara Corporation
    Inventors: Naoki Dai, Masaya Seki, Akihiro Yazawa, Toshio Yokoyama, Akira Owatari
  • Patent number: 6823919
    Abstract: A lamination system comprises; a film transfer means for transferring along a film transfer path a laminate film in which small windows are provided, a film detection sensor for detecting the laminate film, a cutting means for cutting the laminate film into a predetermined length. The film transfer means further transfers the cut laminate film along the film transfer path, the lamination system further comprises a card transfer means for transferring a card on the surface of which a terminal of an IC tip is provided along a card transfer path, a positioning mean for making the terminal and the small window into a predetermined positional relation, a thermocompression bonding means for laminating laminate film with the card.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: November 30, 2004
    Assignee: Japan Servo Co., Ltd.
    Inventor: Naotaka Sasaki
  • Patent number: 6814807
    Abstract: An apparatus for applying metered fluid such as sizing to an advancing individual yarn in a uniform manner. An elongated member includes at least one slot for receiving the advancing yarn and to bring the advancing yarn into contact with the metered fluid. The slot is defined by a width, a height and a length for affecting the distribution of the fluid on the advancing yarn. The length of the slot is dependent on the speed of the advancing yarn. The advancing yarn has a predetermined residence time in the slot as a function of the length of the slot and the speeding of the advancing yarn in the slot.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: November 9, 2004
    Assignee: Georgia Tech Research Corp.
    Inventors: Wallace W. Carr, Hyunyoung Ok, Joseph D. Brooks, Heungsup Park