Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.
Type:
Grant
Filed:
February 19, 2014
Date of Patent:
August 1, 2017
Assignee:
STMicroelectronics Pte Ltd
Inventors:
Loic Pierre Louis Renard, Wee Chin Judy Lim
Abstract: The image sensor includes a plurality of column lines, a plurality of active road circuits and a selection circuit. The plurality of column lines are each connected to a corresponding one of a plurality of pixels. The plurality of active road circuits are each connected to a corresponding one of the plurality of column lines. The selection circuit is configured to enable a portion of the plurality of active road circuits based on a plurality of column selection signals.
Type:
Grant
Filed:
March 25, 2014
Date of Patent:
September 29, 2015
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
Inventors:
Byung-Jo Kim, Tae-Chan Kim, Kyoung Min Koh, Kyung-Min Kim