Abstract: A metrology system includes a controller communicatively coupled to one or more metrology tools. In another embodiment, the controller includes one or more processors configured to execute program instructions causing the one or more processors to receive one or more overlay metrology measurements of one or more metrology targets of the metrology sample from the one or more metrology tools; determine tilt from the one or more measurement overlay measurements; and determine one or more correctables for at least one of one or more lithography tools or the one or more metrology tools to adjust for the tilt, where the one or more correctables are configured to reduce an amount of tilt in the sample or overlay inaccuracy of the one or more overlay metrology measurements. The program instructions further cause the one or more processors to predict tilt with a simulator based on at least the determined tilt.

Abstract: An illuminator includes a first facet mirror receiving and reflecting an exposure radiation, an adjustable shielding element disposed on the first facet mirror, the adjustable shielding element adjusting intensity uniformity of the exposure radiation reflected by the first facet mirror, and a second facet mirror receiving and reflecting the exposure radiation reflected by the first facet mirror.

Abstract: A substrate processing apparatus includes: a processing chamber configured to process a substrate; a light source chamber including a light source configured to irradiate vacuum ultraviolet light onto a surface of the substrate; a gas supply configured to supply an inert gas into the light source chamber; and a controller that controls the gas supply to maintain the light source chamber in an inert gas atmosphere.

Abstract: A maintenance management method for a lithography system according to a viewpoint of the present disclosure includes organizing and saving operating information for each of lithography cells that are each an apparatus group formed of a set of apparatuses and form the lithography system, organizing and saving maintenance information on consumables for each of the lithography cells, calculating a standard maintenance timing for each of the consumables for each of the lithography cells based on the operating information and the maintenance information on the consumable for each of the lithography cells, creating a maintenance schedule plan for each of the lithography cells or for each of manufacturing lines based on the standard maintenance timing, information on a downtime, and information on a loss cost due to the downtime for each of the lithography cells or for each of the manufacturing lines, and outputting the result of the creation of the maintenance schedule plan.

Abstract: An optical apparatus, which illuminates a first area with light from a light source while the first area is longer in a second direction intersecting a first direction than in the first direction, includes a collector optical member which is arranged in an optical path between the light source and the first area, and condenses the light from the light source to form a second area in a predetermined plane, the second area being longer in a fourth direction intersecting a third direction than in the third direction; and a first fly's eye optical member which is provided within the predetermined plane including the second area, and has a plurality of first optical elements guiding the light of the collector optical member to the first area.

Abstract: Degradation of the reflectivity of one or more reflective optical elements in a system (SO) for generating EUV radiation is reduced by the controlled introduction of a gas into a vacuum chamber (26) containing the optical element. The gas may be added to the flow of another gas such as hydrogen or alternated with the introduction of hydrogen radicals.

Abstract: A method for estimating a parameter across a region on a substrate, the region being divided into a plurality of sub-regions, the method including: obtaining values of the parameter for at least two sub-regions out of the plurality of sub-regions; and estimating the parameter for a position on the region by evaluation of a function having said values of the parameter as input values, wherein the function: a) has piecewise defined base functions, wherein a single base function is defined across a sub-region; and b) is continuous between one or more adjacent sub-regions of the at least two sub-regions within the region.

Abstract: An immersion lithography apparatus is disclosed in which liquid is supplied to a space between a projection system and a substrate, and a plate structure is provided to divide the space into two parts. The plate structure has an aperture to allow transmission of the projection beam, has through holes in it to reduce the damping effect of the presence of the plate and optionally has one or more inlets and outlets to provide various flows around the aperture in the plate. An embodiment of the invention may reduce the transportation of contaminants, stray light, temperature gradients, and/or the effect of bubbles on the imaging quality.

Abstract: Disclosed is a method of measuring focus performance of a lithographic apparatus, and corresponding patterning device and lithographic apparatus. The method comprises using the lithographic apparatus to print one or more first printed structures and second printed structures. The first printed structures are printed by illumination having a first non-telecentricity and the second printed structures being printed by illumination having a second non-telecentricity, different to said first non-telecentricity. A focus dependent parameter related to a focus-dependent positional shift between the first printed structures and the second printed structures on said substrate is measured and a measurement of focus performance based at least in part on the focus dependent parameter is derived therefrom.

Abstract: An optical arrangement for use in an optical imaging device includes an optical element unit and a detection device and/or an actuating device. The optical element unit includes at least one optical element. The detection device determines in a plurality of M degrees of freedom in each case a detection value which is representative of a relative position or orientation of an element reference of the optical element in relation to a primary reference of the detection device in the respective degree of freedom. The detection device includes a plurality of N detection units, each of which outputs a detection signal which is representative of a distance and/or a displacement of the detection unit in relation to a secondary reference assigned to the optical element and the respective detection unit.

Abstract: A mask, a mask assembly, an exposure machine, a method for testing shadowing effect on a window, and a photolithography method are provided. The mask includes a light transmission area; a functional window provided at a side of the light transmission area; and at least one of a first detection mark and a second detection mark; wherein the first detection mark is flushed with a border of the functional window adjacent to an interior of the mask; and the second detection mark is disposed between the profile of the light transmission area and the functional window.

Abstract: An FEL includes a feedback device for feeding back emitted illumination radiation.

Abstract: A method for correcting values of one or more feed-forward parameters used in a process of patterning substrates, the method including: obtaining measured overlay and/or alignment error data of a patterned substrate; and calculating one or more correction values for the one or more feed-forward parameters in dependence on the measured overlay and/or alignment error data.

Abstract: Extreme ultraviolet light source systems may include a chamber including a condensing mirror and having an intermediate focus, by which extreme ultraviolet light reflected from the condensing mirror is emitted along a first optical path, a blocking plate that may be on the chamber so as to intersect the first optical path and may include an opening through which the extreme ultraviolet light is emitted, a transparent cover on the blocking plate so as to cover the opening, a nozzle that may be between the chamber and the blocking plate so that an end portion faces the intermediate focus and may spray a first gas in a direction intersecting the first optical path, and an exhaust pipe between the chamber and the blocking plate so as to face the end portion of the nozzle.

Abstract: Reflected light from the measurement object is received by a plurality of pixel columns arranged in an X2 direction in a light receiving unit 121, and a plurality of light receiving amount distributions is output. One or a plurality of peak candidate positions of light receiving amounts in a Z2 direction is detected by a peak detection unit 1 for each pixel column based on the plurality of light receiving amount distributions. A peak position to be adopted to a profile is selected from the peak candidate positions detected for each pixel column based on a relative positional relationship with a peak position of another pixel column adjacent to the pixel column, and profile data indicating the profile is generated by the profile generation unit 3 based on the selected peak position.

Abstract: Semiconductor processing apparatuses and methods are provided in which a semiconductor wafer is flipped and then rotated between patterning of front and back sides of the semiconductor wafer by first and second reticles, respectively. In some embodiments, a method includes patterning, by a first reticle, a first layer on a first side of a semiconductor wafer while the first side of the semiconductor wafer is facing a first direction. The semiconductor wafer is then flipped. A second side of the semiconductor wafer that is opposite the first side faces the first direction after the flipping the semiconductor wafer. The semiconductor wafer is then rotated about a rotational axis extending along the first direction, and a second layer on the second side of the semiconductor wafer is patterned by a second reticle.

Abstract: A support structure having a vertical element supporting a set of cameras associated with a vehicle measurement or inspection system together with at least one target structure required for realignment or recalibration of onboard vehicle safety system sensors. A camera crossbeam carried by the support structure locates the set of cameras as required to view a vehicle undergoing measurement or inspection. The target structure is affixed to the vertical element of the support structure, at an elevation suitable for observation by at least one vehicle onboard sensors during a realignment or recalibration procedure. A set of rollers facilitates positioning of the target structure on a supporting floor surface during a realignment or recalibration procedure.

Abstract: A method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limiting pattern locations corresponding to the patterning device based on the patterning device substrate map, and based on the process window limiting pattern locations, guiding a patterning device inspection apparatus to the process window limiting pattern locations for defect inspection.

Abstract: A control system for controlling a laser, comprising a sensor for sensing a physical value indicative of a characteristic of a laser beam emitted by the laser, a switch, a first controller and a second controller. Each controller is configured, to receive a further sensor value from the sensor, adjust a received setpoint value based on the received further sensor value to give an output value and cause the laser to operate in accordance with the output value. The switch is configured to switch between the controllers such that output values are provided from each controller in a cyclic fashion.

Abstract: A projection exposure apparatus for semiconductor lithography having a projection optical unit. The projection optical unit includes a sensor frame, a carrying frame, and a module. The module includes an optical element and actuators for positioning and orienting the optical element. The module is on the carrying frame, and the sensor frame is a reference for the positioning of the optical element. The module includes an infrastructure which includes interfaces for separating a module from the projection optical unit. A method exchanges the module of a projection optical unit of a projection exposure apparatus for semiconductor lithography, wherein the module includes an optical element, while the reference remains in the projection exposure apparatus.