Abstract: To provide an exposure method and an exposure apparatus, using a complementary divided mask, designed to enable alignment of a complementary divided mask at a high precision over the entire region of a semiconductor wafer. Further, to provide a semiconductor device fabricated by the exposure method and a method of producing a semiconductor device using the exposure method.
Type:
Grant
Filed:
November 29, 2002
Date of Patent:
November 29, 2005
Assignee:
Sony Corporation
Inventors:
Shinichiro Noudo, Kumiko Oguni, Hiroyuki Nakano, Hiroki Hane