Patents Examined by Christopher C Pillow
  • Patent number: 11885518
    Abstract: An air-conditioning apparatus includes a refrigerant circuit, an air-conditioning load state detection unit, an operation-state detection unit, and a controller. The refrigerant circuit includes a main circuit and a bypass circuit. The air-conditioning apparatus has a simultaneous heating and defrosting operation mode. In the simultaneous heating and defrosting operation mode, the controller controls a compressor, a pressure reducing device, and a defrosting refrigerant pressure-reducing device such that control amounts of the compressor, the pressure reducing device, and the defrosting refrigerant pressure-reducing device reach respective normal-time control target values that are set based on an air-conditioning load state and an operation state.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: January 30, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koji Fukui, Kosuke Tanaka, Kazuya Watanabe
  • Patent number: 11867424
    Abstract: A thermal control system includes a housing defining an intake flow path for travel of intake airflow and an exhaust flow path for travel of exhaust airflow. An intake door is disposed along the intake flow path and has first and second positions blocking and allowing intake airflow through the intake door. An exhaust door is disposed along the exhaust flow path and has first and second positions blocking and allowing exhaust airflow through the exhaust door. A mode door is disposed in the housing between the intake flow path and the exhaust flow path with a first position blocking the intake airflow and allowing the exhaust airflow to pass through a heat exchanger, a second position blocking the exhaust airflow and allowing the intake airflow to pass through the heat exchanger, and a third position allowing the intake airflow and the exhaust airflow to pass through the heat exchanger.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: January 9, 2024
    Assignee: APPLE INC.
    Inventors: Scott Wujek, Kegan J. Connick, Paul D. Yeomans
  • Patent number: 11808521
    Abstract: A loop heat pipe includes two outermost metal layers, an intermediate metal layer provided between the outermost metal layers, an evaporator, a condenser, and liquid and vapor pipes connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, a porous body provided between the pair of walls, and a strut penetrating the porous body and bonding the outermost metal layers, and one or more metal layers. Each of the one or more metal layers includes a first part forming a part of the pair of walls, a second part connected to the first part and forming a part of the porous body, and a third part connected to the second part and forming a part of the strut.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: November 7, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11788801
    Abstract: A heat exchanger body includes at least a first channel wall portion, a second channel wall portion, and a third channel wall portion. A first channel for a first fluid, and a second channel for a second fluid are provided such that heat is allowed to be transferred between the first channel and the second channel via the second channel wall portion. A plurality of first support structures are arranged in the first channel and extend from the first channel wall portion to the second channel wall portion. A plurality of second support structures are arranged in the second channel and extending from the second channel wall portion to the third channel wall portion. The support structures are configured to support the second and third channel wall portions during manufacturing of the heat exchanger.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: October 17, 2023
    Assignee: VOLVO TRUCK CORPORATION
    Inventor: Yannick Sailler
  • Patent number: 11781939
    Abstract: An electrified vehicle powered by a traction battery includes a coolant loop arranged to convey coolant through at least a radiator, a chiller, and the traction battery to transfer heat from the battery. The vehicle also includes a refrigerant loop in fluid communication with the chiller to selectively circulate refrigerant through the chiller to provide supplemental heat transfer from coolant conveyed through the chiller. The vehicle further includes a vision system having at least one camera with a field of view including a vicinity of the radiator and a controller programmed to detect a radiator coolant leak based on image data output from the vision system. The controller is also programmed to cause a bypass of the radiator within the coolant loop to stop conveyance of coolant through the radiator in response to detecting a coolant leak.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: October 10, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Kenneth Yesh, Raymond C. Siciak, Theodore John Borromeo, Mathew Alan Boesch
  • Patent number: 11781814
    Abstract: A tapered groove width heat pipe is disclosed, including a tube having an internal surface, a first end, a second end, and a central axis. A plurality of groove walls on the internal surface define a plurality of trapezoidal grooves. Each groove wall has a proximal width closest to the central axis and a distal width furthest from the central axis, the proximal width of a portion of each groove wall tapering gradually between the first end and the second end.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: October 10, 2023
    Assignee: The Boeing Company
    Inventor: Kawthar Kasim
  • Patent number: 11774182
    Abstract: A loop heat pipe includes a pair of outermost metal layers, an intermediate metal layer provided between the pair of outermost metal layers, an evaporator, a condenser, a liquid pipe and a vapor pipe connecting the evaporator and the condenser and forming a loop shaped passage. The intermediate metal layer includes a pair of walls forming a part of a pipe wall of the evaporator, the condenser, the liquid pipe, and the vapor pipe, and a porous body provided between the pair of walls. The intermediate metal layer includes a first surface opposing one of the pair of outermost metal layers, and a plurality of first cavities, and a first projection between mutually adjacent first cavities, respectively famed at the first surface between the pair of walls. A first gap is famed between the first projection and the one of the pair of outermost metal layers.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: October 3, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yoshihiro Machida
  • Patent number: 11761668
    Abstract: The cooling system may dehumidify and cool the indoor air by using the ejector, the ejector membrane, the evaporation chamber, and the indoor dehumidifying membrane. In addition, the coefficient of performance of the cooling system may be improved by cooling the refrigerant using evaporation latent heat generated in the evaporation chamber by the suction force of the ejector and cooling the indoor air using the refrigerant. In addition, by using solar heat to generate high-temperature and high-pressure steam and supply the generated steam to the ejector, energy use efficiency may be improved. In addition, since the temperature of the steam generated in the steam generating portion may be lowered by arranging and using the two first and second ejectors in multiple stages, energy efficiency may be further improved by reducing the consumption of the heat source required for steam generation.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: September 19, 2023
    Assignee: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Beom Joon Lee, Gil-bong Lee, Chulwoo Roh, Young-jin Baik, Hyung-ki Shin, Jong Jae Cho
  • Patent number: 11719489
    Abstract: A heat exchanger 100, including: an inner cylinder 10 through which a first fluid can flow, the inner cylinder 10 being configured to house a heat recovery member 30; and an outer cylinder 20 disposed so as to be spaced on a radially outer side of the inner cylinder 10 such that a second fluid can flow between the outer cylinder 20 and the inner cylinder 10. In the heat exchanger 100, at least a part of the outer cylinder 20 and/or the inner cylinder 10 has at least one continuous irregular structure 40.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: August 8, 2023
    Assignee: NGK INSULATORS, LTD.
    Inventors: Yutaro Fumoto, Tatsuo Kawaguchi, Daisuke Kimura
  • Patent number: 11713889
    Abstract: A window air conditioner includes a casing and a positioning member provided at the casing and configured to be switchable between a storage state and a working state. In the storage state, the positioning member is stored at the casing. In the working state, the positioning member is at least partially outside the casing for connecting and positioning the casing with a window frame.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: August 1, 2023
    Assignees: GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Kangwen Zhang, Zhigang Xing, Zhisheng Lei, Yu Liu, Hui Yu, Yuhang Tang, Wenjun Shen, Ali Zhao
  • Patent number: 11635264
    Abstract: A heat exchanger mounting assembly for use in an HVAC system includes a frame for mounting a heat exchanger operably coupled to at least two sides of a heat exchanger housing, the frame having at least two mounting rails, each mounting rail having a first mounting rail side, and second mounting rail side, a proximate end and a distal end; and at least two coil support members extending from the first mounting rail side; and at least one connection member located on the second mounting rail side; and at least one support rail configured to engage the second mounting rail side of the at least two mounting rails; and at least two cross rails operably coupled to each of the at least two coil support members; and a heat exchanger, comprising at least one coil header operably coupled to at least two coil support members.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: April 25, 2023
    Assignee: Carrier Corporation
    Inventors: Charlie Christensen Phillips, Jorge A. Solis Chavez, Fred V. Pouyi Mamona
  • Patent number: 11592245
    Abstract: A baffle for a block-type heat exchanger comprising a baffle plate. The baffle plate comprises a first surface and a second surface being parallel to a baffle plane located between the first surface and the second surface. The baffle plate comprises a first longitudinal edge, a second longitudinal edge, a first transverse edge and a second transverse edge. The baffle comprises a resilient member at the second longitudinal edge. The baffle comprises a reinforcement extending away from the baffle plane.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: February 28, 2023
    Assignees: ALFA LAVAL CORPORATE AB, ALFA LAVAL VICARB SAS
    Inventor: Olivier Noël-Baron
  • Patent number: 11589481
    Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: February 21, 2023
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Rohit Dev Gupta, Robert Gregory Twiss
  • Patent number: 11415372
    Abstract: An energy-saving loop heat pipe apparatus and an application are provided. The loop heat pipe apparatus comprises a capillary pump component and an evaporation unit component. The loop heat pipe apparatus further comprises at least one heat exchanger disposed between the capillary pump component and the evaporation unit component for heating, by using heat of a circulating working medium in the loop heat pipe, the circulating working medium about to enter the evaporation unit component.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: August 16, 2022
    Assignee: Beijing Institute of Space Mechanics & Electricity
    Inventors: Teng Gao, Tao Yang, Shilei Zhao, Zhenming Zhao, Chunlin Li, Shikui Luo, Pan Lu, Yinxue Yan, Feng Yu, Qingliang Meng
  • Patent number: 11347284
    Abstract: The present application provides a novel water cooling radiator with a detachable water pump and a built-in fan, which enables outside air to enter a cooling housing from air inlet holes in an upper end of the cooling housing and be discharged from air outlet holes in a lower end of the cooling housing, so that the air discharged from the air outlet holes can dissipate heat from and cool down various electronic components such as MOS tubes and memory chips around the motherboard and CPU, thereby improving the heat dissipation efficiency and prolonging the service life of the motherboard. A pump is connected externally to the radiator, which makes the installation and connection more convenient and the performance better.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: May 31, 2022
    Assignee: DONGGUAN BINGDIAN INTELLIGENT SCIENCE & TECHNOLOGY CO., LTD.
    Inventor: Fengqi Zhang
  • Patent number: 11333445
    Abstract: A radiator system uses an innovative passive control scheme in combination with dependable mechanical design features to meet or exceed the requirements for orbital applications. The disclosed radiator system is unique because we target an extremely high turndown ratio of 200:1 with an entirely passive two-phase pumped loop using ammonia as the working fluid. Sections of the radiator will selectively freeze to assist the turndown, and the mechanical design of the radiator can handle the high pressures experienced during such freezing and thawing events.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: May 17, 2022
    Assignee: Mainstream Engineering Corporation
    Inventors: Jeffrey A. Milkie, Ian S. Wright