Patents Examined by Christopher Keehan
  • Patent number: 6800373
    Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone resin, (B) at least one epoxy resin, (C) at least one anhydride curing agent, (D) at least one siloxane surfactant, and (E) at least one ancillary curing catalyst. Also disclosed are a packaged solid state devices comprising a package, a chip, and an encapsulant comprising a composition of the invention. A method of encapsulating a solid state device is also provided.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: October 5, 2004
    Assignee: General Electric Company
    Inventor: Thomas Bert Gorczyca
  • Patent number: 6800366
    Abstract: The present invention provides an acrylic pressure sensitive adhesive composition having an element with a positive stress optical coefficient for a polarizing film and a polarizing film using the same.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: October 5, 2004
    Assignee: LG Chem, Ltd.
    Inventors: Suk-Ky Chang, In-Seok Hwang, In-Cheon Han, Hye-Won Sohn, Sang-Eon Han, Belyaev Sergey, Seung-Man Sohn, Malimonenko Nikolay
  • Patent number: 6800371
    Abstract: In one aspect, the invention provides a curable composition comprising a mixture of epoxy resin, catalyst and an epoxy reactive thioether-containing compound and the resulting adhesives. The resulting adhesives are water and/or solvent resistant and bond to plastics such as ABS, polycarbonate, and PMMA; polyimide; noble metals such as gold and palladium; and silicon-containing materials such as silicon wafer die and silicon dioxide.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: October 5, 2004
    Assignee: 3M Innovative Properties Company
    Inventors: Kathleen B. Gross, Susan C. Noe, Alphonsus V. Pocius, William J. Schultz, Wendy L. Thompson
  • Patent number: 6797390
    Abstract: An oxygen-quenching luminophore constituting part of a pressure-sensitive luminophore is directly bonded by a covalent bond to an organic polymer compound having trimethylsilyl groups, so the luminophore molecules are retained in the polymer and free aggregation is inhibited when the organic solvent is evaporated. It is therefore possible to prevent light response from being reduced by the aggregation of the luminophore molecules during evaporation of the organic solvent, which is a drawback of forming films from conventional mixed-type pressure-sensitive paints. A thin-film sensor with uniform characteristics can be formed by spraying or application from a pressure-sensitive paint obtained by mixing a functional polymer with a solvent. In addition, a coating solution that has high reproducibility and is suitable for spraying or application can be obtained merely by dissolving the functional polymer as a single component in a suitable solvent.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: September 28, 2004
    Assignee: National Aerospace Laboratory of Japan
    Inventors: Keisuke Asai, Hiroyuki Nishide
  • Patent number: 6794038
    Abstract: There is provided an adhesive which hardens under the condition of low temperature within short time and has a high preserving property. The latent hardener of the present invention has hardener particles mainly comprising metal chelate and capsules covering the surface of the hardener particles where, in the surface part of the hardener particles, substituent of the resin component constituting the capsule is bonded to the metal chelate. Accordingly, mechanical strength of the capsule is high whereby the capsule is not broken in a step of kneading the latent hardener with an epoxy resin.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: September 21, 2004
    Assignee: Sony Chemicals Corporation
    Inventor: Takayuki Matsushima
  • Patent number: 6790526
    Abstract: Novel appliqués comprising oxyhalopolymer-adhesive composites wherein the adhesive layer of the composite is chemically bonded to reactive sites on at least one side of the oxyhalopolymer layer, possess superior peel strengths, resistance to delamination and protective properties, including protection of surfaces from lightning strike to seamless protective liners for tanks. The appliques are suitable for printing architectural designs thereon. Multilayered specialty appliqués can be fabricated from the above fundamental oxyhalopolymer-adhesive composite structure, including layered adhesives for encapsulating tridimensional mechanical and electrical devices, such as RF, or microwave sensitive antennae for transmitting and receiving communications, providing protection from environmental electromagnetic effects (E3), shock and impact resistance, multidimensional deformable structures; housing for temperature control systems, etc.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: September 14, 2004
    Assignee: Integument Technologies, Inc.
    Inventors: Terrence G. Vargo, Timothy S. Koloski, John M. Brupbacher, Andrew W. Dalgleish, Garner S. Holdsworth
  • Patent number: 6787237
    Abstract: Uncured composite materials (prepreg) are provided that are stable at room temperature over relatively long periods of time. The prepreg includes a solid epoxy resin matrix composed of a crystalline epoxy resin and a solid curing agent. The curing agent is preferably crystalline. The prepreg may include one or more property enhancement layers that increase the tackiness of the prepreg, increase the flexibility of the prepreg and/or reduce the amount of solid resin matrix that flakes from the prepreg during handling.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: September 7, 2004
    Assignee: Hexcel Corporation
    Inventors: Martin Simmons, John Cawse, John Ellis
  • Patent number: 6783850
    Abstract: An acrylic pressure sensitive adhesive composition comprising 5 to 75 parts by weight of an adherent polymer (a) comprising (meth)acrylic ester component units as principal structural units and having a weight average molecular weight of 50,000 or more; 5 to 40 parts by weight of a tackifier resin (b) comprising (meth)acrylic ester component units as principal structural units and having a weight average molecular weight of 20,000 or less; and 20 to 90 parts by weight of monomers (c) whose principal component is a (meth)acrylic ester, wherein substantially no solvent is contained is provided. Further, a pressure sensitive adhesive tape having a pressure sensitive adhesive layer superimposed on a support surface is provided by coating the support surface with the above acrylic pressure sensitive adhesive composition, which contain a partial polymerizate, and carrying out a polymerization reaction on the support surface.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: August 31, 2004
    Assignee: Soken Chemical & Engineering Co., Ltd.
    Inventors: Youichi Takizawa, Mitsuhiko Nakazawa
  • Patent number: 6783859
    Abstract: An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: August 31, 2004
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shoichi Osada, Shingo Ando, Hiroyuki Takenaka, Kazutoshi Tomiyoshi, Toshio Shiobara
  • Patent number: 6783864
    Abstract: Film for the manufacture of self-adhesive, especially label films laminates, which may be stamped, consisting of at least three layers, by which the inner layer contains polyolefine and/or olefin-copolymers and at least one additional layer each is present on both sides of the inner layer. This additional layer should contain a mixture of styrene-butadiene-styrene-blockcopolymers and polystyrene-homopolymers. The invention also refers to a process for the manufacture and the use of such a film.
    Type: Grant
    Filed: September 27, 2002
    Date of Patent: August 31, 2004
    Assignee: Nordenia Deutschland Gronau GmbH
    Inventor: Markus Hamulski
  • Patent number: 6780510
    Abstract: Novel adhesive compositions are described that include an epoxyamine and, preferably, a curing agent. The adhesive composition can be used in surgical settings such as implanting bioprostheses and/or in manufacturing of bioprostheses. Biocompatible substrates can be adhered together by an adhesive bond formed by curing of the epoxyamine adhesive composition.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: August 24, 2004
    Assignee: St. Jude Medical, Inc.
    Inventors: Matthew F. Ogle, Andrea L. McConico
  • Patent number: 6777094
    Abstract: A method, a composition and a method for making the composition for increasing the corrosion resistance of a magnesium or magnesium alloy surface is disclosed. The composition is a water/organic solution of one or more hydrolyzed silanes. By binding silane moieties to the magnesium surface, an anti-corrosion coating on a magnesium workpiece is produced. A complementary method, composition and method for preparing the composition for treating a metal surface to increase corrosion resistance is disclosed. The composition is an aqueous hydrogen fluoride solution with a non-ionic surfactant.
    Type: Grant
    Filed: June 26, 2002
    Date of Patent: August 17, 2004
    Assignee: Alonim Holding Agricultural Cooperative Society Ltd.
    Inventor: Ilya Ostrovsky
  • Patent number: 6773809
    Abstract: There is provided a copper foil with an insulating adhesive which is excellent in that an insulating adhesive layer has low dieletric constant, low dieletric loss tangent and high adhering force at a normal temperature and a high temperature, and steps for manufacturing a multilayer printed circuit board can be shortened due to the presence of a copper foil on which a circuit can be formed by etching or the like. An insulating adhesive composition containing as an essential component an organic compound having at least two alkenyl groups having the reactivity with a SiH group in one molecule, and a silicon compound containing at least two SiH groups in one molecule and a copper foil are incorporated.
    Type: Grant
    Filed: November 8, 2000
    Date of Patent: August 10, 2004
    Assignee: Kaneka Corporation
    Inventors: Takashi Itoh, Shoji Hara, Hirosaku Nagano
  • Patent number: 6773815
    Abstract: The present invention relates to a coated metal surface comprising, successively: a layer (1) of epoxy primer placed next to the metal, a layer (2) of binder comprising 98 to 50 parts by weight of at least one fluoropolymer L3 per 2 to 50 parts, respectively, of at least one polymer chosen from acrylic polymers L1 and polymers L2 which are fluoropolymers chemically modified by a partial dehydrofluorination followed by an oxidation, a layer (3) of fluoropolymer. According to a first variant, the coating does not comprise the layer (3). However, it is recommended that the layer (2) which becomes the outer layer should be thicker than in the structure of the main invention. According to a second variant, the coating does not comprise the layer of primer (1), the layer of binder necessarily contains the polymer L2 and the surface is necessarily the outer surface of tubes.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: August 10, 2004
    Assignee: Atofina
    Inventor: Nicolas Amouroux
  • Patent number: 6773758
    Abstract: This invention provides a primer composition comprising the following (A), (B), (C) and (D) components: (A) a saturated hydrocarbon polymer having at least one alkenyl group per molecule, (B) a silane coupling agent, (C) a polyvalent alkoxysilane and/or a condensation product thereof, and (D) an organoaluminum compound and/or an organotitanium compound.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: August 10, 2004
    Assignee: Kaneka Corporation
    Inventor: Yoshimichi Yamanaka
  • Patent number: 6770371
    Abstract: A water-based oligomer adhesion promoter material that promotes adhesion of paste adhesives used for structural bonding of metal components. The water-based system provides a convenient, one-step ambient cure process that minimizes the use of hazardous solvents. Reinforced metal substrates using the adhesion promoter material in conjunction to an ambiently cured paste adhesive offer significant improvement in terms of fatigue resistance. When used in repairing metal substrates having fatigue cracks, the adhesion promoter in conjunction with an ambiently cured paste adhesive minimizes fatigue crack propagation, thereby increasing the usable life of the metal substrate in strength bearing applications.
    Type: Grant
    Filed: July 8, 2002
    Date of Patent: August 3, 2004
    Assignee: The Boeing Company
    Inventors: Ronald R. Stephenson, Kay Blohowiak, Joseph H. Osborne
  • Patent number: 6767937
    Abstract: Polymer film, coating, and molded article elements for use in a display device are described which comprise a polymer phase having molecularly dispersed therein an acid scavenger compound, a hindered amine light stabilizer compound and a hindered phenol antioxidant compound, wherein the hindered amine light stabilizer compound and the hindered phenol antioxidant compound are present at a weight ratio of from 20:1 to 1:20, and the weight ratio of the acid scavenger compound to the total concentration of hindered amine light stabilizer compound and hindered phenol antioxidant compound is from 10:1 to 1:10. Use of a combination of an acid scavenger and a combination of two radical scavenger antioxidants dispersed in a polymer phase in accordance with the invention enables enhanced stabilization of the polymer when exposed to high heat and/or humidity condition, which has been found to be especially desirable when applied to polymer layers laminated into displays (e.g., polarizers in liquid crystal displays).
    Type: Grant
    Filed: May 17, 2002
    Date of Patent: July 27, 2004
    Assignee: Eastman Kodak Company
    Inventors: Timothy C. Schunk, Kurt M. Schroeder, Charles H. Appell, Daniel T. Linehan
  • Patent number: 6767631
    Abstract: The present invention aims to provide an adhesive composition showing high adhesion and cohesion as well as good heat resistance. Adhesive compositions of the present invention include an imide (meth)acrylate, a monomer having a glass transition temperature of −50° C. or less when it is homopolymerized, and a photoinitiator, wherein the content of the imide (meth)acrylate is 1-20 parts by weight per 100 parts by weight of the monomer.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: July 27, 2004
    Assignee: Sony Chemicals Corp.
    Inventors: Manabu Ono, Toshifumi Kobayashi
  • Patent number: 6756129
    Abstract: This invention relates to polymer blend compositions and the process for preparing the same. In particular, the invention relates to novel blends of cationic polymers and anionic polymers which exhibit properties that make them useful as coatings for various substrates.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: June 29, 2004
    Assignee: MeadWestvaco Corporation
    Inventor: Jean Caprice St. Arnauld
  • Patent number: 6756126
    Abstract: An aircraft window of synthetic resin has a hard coated film and either at least a double-pane or single-pane construction, the hard coated film comprises siloxane bonds and/or silazane bonds obtained obtained by coating a coating composition containing perhydropolysilazane or its condensation polymer which is substantially soluble in organic solvent on the surface of the synthetic resin aircraft window and heat-treating at approximately ambient temperature to 100° C. in air or humidified air.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: June 29, 2004
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Kazuyuki Oguri, Takahiro Sekigawa