Patents Examined by Christopher M. Keehan
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Patent number: 6737163Abstract: Low-cure powder coating compositions are disclosed. The compositions comprise a polyepoxide and a material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; R2 is an organic radical having 1 to 20 carbon atoms; R3 and R4 are independently alkyl or phenyl groups having 1 to 8 carbon atoms; Z is oxygen or nitrogen, and when Z is oxygen R5 is absent and when Z is nitrogen R5 is hydrogen or is and n is 1 to 4. The material can optionally be reacted with an acidic hydrogen-containing compound. The compositions are curable without the use of crosslinking agents or accelerators. Methods for coating a substrate using these compositions, and substrates coated thereby, are also disclosed, as are additional catalysts useful for the same purpose.Type: GrantFiled: May 31, 2002Date of Patent: May 18, 2004Assignee: PPG Industries Ohio, Inc.Inventors: Anthony M. Chasser, Shawn P. Duffy, Ronald R. Ambrose
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Patent number: 6706392Abstract: A solvent-free adhesive tape with a film based on polyolefins and an adhesive layer which is applied at between 10 and 45 g/m2 and is prepared with a mixture comprising an adhesive acrylic dispersion acquires improved adhesive properties and increased water insensitivity by virtue of the fact that the mixture comprises a second, special acrylic dispersion, the quantitative ratio between the first acrylic dispersion and the second acrylic dispersion being between 99:1 and 90:10 and the second acrylic dispersion comprising the following components: 65-84% by weight of ethyl acrylate units 15-34% by weight of methyl methacrylate units 0.5-2% by weight of acrylic acid units 0.1-1% by weight of propyleneimine units.Type: GrantFiled: September 30, 2002Date of Patent: March 16, 2004Assignee: tesa AGInventors: Wolfgang David, Stefan Röber
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Patent number: 6689460Abstract: An exemplary primer/membrane package system comprises (a) a membrane comprising a carrier sheet and a pressure-sensitive adhesive thereon; and (b) an aqueous dispersion primer composition operative to promote adhesion between a construction surface and the membrane. The primer composition comprises at least two of an acetate, maleate, and acrylate, and has a viscosity of 200-2000 cp and more preferably 400-800 cp (Brookfield/#5 spindle/50 rpm, 25° C).Type: GrantFiled: June 14, 2001Date of Patent: February 10, 2004Assignee: W. R. Grace & Co.-Conn.Inventors: Jianye Wen, Frederick M. Drauschke, Salvador Crespo
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Patent number: 6682818Abstract: A sealant material and articles incorporating the same. The sealant material includes up to about 80% of an epoxy resin; up to about 40% of an epoxy/elastomer hybrid; up to about 40% of a rheology modifier; up to about 5% of a blowing agent; up to about 7% of a curing agent; and about 40 to about 60% of a filler.Type: GrantFiled: August 24, 2001Date of Patent: January 27, 2004Assignee: L&L Products, Inc.Inventors: Michael J. Czaplicki, Renee Bradley, Jeff Bradley
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Patent number: 6680123Abstract: An embedding resin embeds an electronic part in an object and has a dielectric constant of about 5 or less and tan &dgr; of about 0.08 or less.Type: GrantFiled: December 21, 2001Date of Patent: January 20, 2004Assignee: NGK Spark Plug Co., Ltd.Inventors: Hiroki Takeuchi, Toshifumi Kojima, Kazushige Obayashi, Hisahito Kashima
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Patent number: 6673457Abstract: The invention discloses a novel radiation-curable silicone-based release coating composition capable of giving a cured release coating film on a substrate such as a plastic resin film exhibiting excellent adhesion to a variety of substrate materials and excellent releasability. The radiation-curable releasing silicone composition of the invention comprises (A) an aromatic compound having, in a molecule, at least two cationically polymerizable organopolysiloxanyl groups such as epoxy-substituted organopolysiloxanyl groups as the silicone ingredient and (B) a photopolymerization initiator which is an onium salt compound such as diaryliodonium salt compounds.Type: GrantFiled: December 12, 2001Date of Patent: January 6, 2004Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Masatoshi Takahashi, Masahiko Ogawa
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Patent number: 6673441Abstract: An adhesive which comprises (1) 100 parts by weight of an epoxy resin and a hardener therefor, (2) 75 to 300 parts by weight of an epoxidized acrylic copolymer having a glycidyl (meth)acrylate unit content of 0.5 to 6 wt. %, a glass transition temperature of −10° C. or higher and a weight average molecular weight of 100,000 or more and (3) 0.1 to 20 parts by weight of a latent curing accelerator; an adhesive member having a layer of the adhesive; an interconnecting substrate for semiconductor mounting having the adhesive member; and a semiconductor device containing the same.Type: GrantFiled: November 29, 2001Date of Patent: January 6, 2004Assignee: Hitachi Chemical Company, Ltd.Inventors: Yuko Tanaka, Yasushi Shimada, Teiichi Inada, Hiroyuki Kuriya, Kazunori Yamamoto, Yasushi Kumashiro, Keiji Sumiya
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Patent number: 6667103Abstract: There is provided a wet friction material excellent in heat resistance and durability, high in friction coefficient, small in initial fluctuation of the friction coefficient, excellent in heat spot resistance and superior in physical strength to a wet friction material using a phenol resin as a binder. In the wet friction material composed of a fiber base material, a filler, a friction adjustor, and a binder, the binder is a hardened substance of a hydrolyzed solution of a silane coupling agent represented by the following formula (1) (R1)(R2)nSi(OR3)3−n (1) in which R1 represents an alkylamino group containing primary amine at a terminal, each of R2 and R3 represents an alkyl group containing 1 to 3 carbon atoms, and n represents an integer of 0 or 1.Type: GrantFiled: May 12, 2000Date of Patent: December 23, 2003Assignee: NSK-Warner Kabushiki KaishaInventors: Masahiro Mori, Hirokazu Yagi
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Patent number: 6667104Abstract: A phenol resin composition for wet friction material comprising a curable resin composition obtained by mixing a resol-type phenol resin and a hydrolysis solution of an alkoxysilane or a condensate thereof, wherein the ratio by weight of the nonvolatile components of the resol-type phenol resin (R) and the nonvolatile components of the hydrolysis solution of the alkoxysilane or the condensate thereof (S), obtained after heat-treatment at 135° C. for one hour, is in the range of 64/36 to 10/90.Type: GrantFiled: June 4, 2002Date of Patent: December 23, 2003Assignees: Sumitomo Bakelite Company Limited, NSK-Warner K.K.Inventors: Hiroshi Aiba, Masahiro Mori
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Patent number: 6663957Abstract: To provide a transparent resin which is suitable in the process of producing a coating for electronic materials, a glass having both of the scattering-preventing function and the antireflective function, an adhesive agent, a shock-absorbing material, an ultraviolet-cutting sheet for televisions, a filter for VDTs and a high refractive index primer composition as well as the process for the production of primer-coated lenses using the primer composition, is excellent in a coatability, adhesive property, storage stability, durability, shock resistance and the like, and is particularly excellent in a transparency and adhesive property after curing of the same. A transparent resin having an adhesive property characterized by comprising a cured product of the polymerizing composition which comprises at least one of diallyl phthalate, diallyl isophthalate and diallyl terephthalate, and pentaerydiritol tetra(3-mercaptopropionate).Type: GrantFiled: September 6, 2000Date of Patent: December 16, 2003Assignee: Pentax CorporationInventors: Hidenori Takushima, Riichiro Takeshita
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Patent number: 6663970Abstract: The instant invention relates to an epoxy/alkylation-type hydrocarbon resin alloy comprising an epoxy resin, an alkylation-type hydrocarbon resin, and a curative. The alkylation-type hydrocarbon resin is characterized as a product formed by an alkylation reaction between a cyclic diolefin and aromatic solvent. A particularly effective alkylation-type hydrocarbon resin in this invention is the alkylation resin formed by the reaction of dicyclopentadiene (DCPD) with alkylnaphthalene solvent. The alkylation-type hydrocarbon resin can be readily dissolved into various epoxy resins and easily processed into resin impregnated glass cloth prepreg for ultimate conversion into electronic laminate products. These epoxy/alkylation-type hydrocarbon resin alloys retain high Tg values with minimal increase in thermal expansion.Type: GrantFiled: January 31, 1997Date of Patent: December 16, 2003Assignee: Eastman Chemical Resins Inc.Inventor: Daniel W. Klosiewicz
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Patent number: 6663969Abstract: A heat conductive adhesive film, wherein a magnetic field is applied to a film composition comprising boron nitride powder for orientating and solidifying the boron nitride powder in the composition in a given direction, an manufacturing method thereof, and an electronic component, characterized by that a heat radiating element and a heat conductive member are adhered by a heat conductive adhesive film wherein boron nitride powder is orientated in a given direction, presenting a high heat conductivity, an excellent heat radiation, and a good electric insulation and a high peeling-off strength.Type: GrantFiled: August 2, 2001Date of Patent: December 16, 2003Assignee: Polymatech Co., Ltd.Inventors: Tobita Masayuki, Shinya Tateda, Tsuneh isa Kimura, Masahumi Yamato
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Patent number: 6660384Abstract: Compound tile with natural stone visible side, preferably marble, of the type comprising a plate of natural stone having a reduced thickness and firmly fixed by adhesive means to a rigidification supporting sheet, said support having a particular composition which is adapted to the physical characteristics of the natural stone plate.Type: GrantFiled: August 2, 2001Date of Patent: December 9, 2003Assignee: Uralita de Productos Y Servicios, S.A.Inventors: Juan J. Pastor Segura, Kepa Ceara Apraiz, Jose Maria Martinez Tejera
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Patent number: 6660394Abstract: Disclosed are a coating composition comprising a polymer dispersed in an aqueous medium, the polymer containing (a) a hydrolysate of an organosilane and/or a condensation product thereof and (b) a vinyl polymer containing a silyl group having a silicon atom bound to a hydrolytic group and/or a hydroxyl group, and further comprising (c) an oxazoline derivative as a crosslinking agent and a hardened film obtained therefrom. The above coating composition completes the hardening reaction of a coating film at low temperature for a short period of time, high in hardness immediately after hardening, and having water resistance, weather resistance, organic chemical resistance, acid resistance, alkali resistance, wear resistance and durable adhesion.Type: GrantFiled: November 14, 2000Date of Patent: December 9, 2003Assignee: JSR CorporationInventors: Kenji Ishizuki, Tatsuya Shimizu, Michiaki Ando, Mibuko Shimada, Hiroshi Shiho
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Patent number: 6652976Abstract: Conductive, highly abrasion-resistant coatings on mouldings, consisting of at least one conductive layer and at least one highly abrasion-resistant layer, a process for their production and their use.Type: GrantFiled: July 3, 2001Date of Patent: November 25, 2003Assignee: Bayer AktiengesellschaftInventors: Michael Mager, Klaus Wussow, Udo Guntermann
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Patent number: 6652963Abstract: A pressure sensitive adhesive based on block copolymers which have at least one unit composed of a series of three alternating polymer blocks P(A) and P(B), wherein P(A) represents a homopolymer or copolymer block formed from a component A which itself comprises at least one acrylated macromonomer of general formula CH2═CH(RI)(COORII) (I) in which RI′=H or CH3 and R″ is an aliphatic linear, branched or cyclic, unsubstituted or substituted, saturated or unsaturated, alkyl radical having more than 30 carbon atoms, and the average molecular weight Mn of said at least one macromonomer being between 492 g/mol and 30 000 g/mol, P(B) represents a homopolymer or copolymer block formed from a monomeric component B which itself comprises at least one monomer B1, the polymer block P(B) having a softening temperature of from −80° C. to +20° C., and the polymer blocks P(A) being immiscible with the polymer blocks P(B).Type: GrantFiled: May 21, 2002Date of Patent: November 25, 2003Assignee: tesa AktiengesellschaftInventors: Marc Husemann, Stephan Zöllner
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Patent number: 6652975Abstract: A process for forming a composition includes providing a liquid mixture that includes silicone oligomers and silsesquioxane oligomers and curing the liquid mixture to form a composition of first and second polymers. The first polymer includes the silsesquioxane oligomers cross-linked by siloxane bonds. The second polymer includes a cross-linked network formed in part of the silicone oligomers.Type: GrantFiled: March 2, 2001Date of Patent: November 25, 2003Assignee: Lucent Technologies Inc.Inventors: Valerie Jeanne Kuck, Richard T Olsson
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Patent number: 6649271Abstract: The present invention provides an anti-static anti-reflective film which exhibits not only superior optical properties and physical properties, but also superior anti-static properties, and which is suitable for use in displays. A low reflective layer is provided by coating a silicon compound containing at least a cation-modified silicon compound on the surface of a transparent substrate directly or via another layer and by curing, and therefore an anti-static anti-reflective film is produced.Type: GrantFiled: July 26, 2001Date of Patent: November 18, 2003Assignee: Tomoegawa Paper Co., Ltd.Inventor: Tomohiro Taruishi
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Patent number: 6645886Abstract: A corona shielding band having reproducible qualities and allowing only a small increase in dielectric losses in a winding of an insulation of electrical machine is made by impregnating a woven-type support material with an active resin solution containing an inorganic filler with a coating composed of antimony-doped tin oxide and then removing the solvent by a thermal processing to produce the corona shielding band.Type: GrantFiled: July 2, 2001Date of Patent: November 11, 2003Assignee: Siemens AktiengesellschaftInventors: Volker Muhrer, Wolfgang Rogler, Klaus Schaefer
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Patent number: 6645630Abstract: An epoxy resin composition, which comprises, as an essential component, a phosphorus compound having an average of not less than 1.8 and less than 3 of phenolic hydroxy groups reactive with an epoxy resin and an average of not less than 0.8 of a phosphorus element in the molecule, an inorganic filler having an average particle diameter of not greater than 30 &mgr;m, a bifunctional epoxy resin having an average of not less than 1.8 and less than 2.6 of epoxy groups in the molecule and a hardener, wherein the bifunctional epoxy resin is contained at an amount of not less than 51% by mass relative to the whole epoxy resin, at least one of dicyandiamide and a polyfunctional phenol system compound having an average of not less than 3 of phenolic hydroxy groups in the molecule is used as the hardener and a ratio (a/c) of equivalent (a) of a phenolic hydroxy group of the phosphorus compound and equivalent (c) of an epoxy group of the bifunctional epoxy resin is not less than 0.3 and less than 0.Type: GrantFiled: November 27, 2000Date of Patent: November 11, 2003Assignee: Matsushita Electric Works, Ltd.Inventors: Yoshihiko Nakamura, Takuya Asano, Kenji Ogasawara, Naoki Ito