Patents Examined by Claire E Rojohn, III
  • Patent number: 11963330
    Abstract: A liquid-cooling block, a liquid-cooling block assembly, and a liquid-cooling heat dissipation device are disclosed. The liquid-cooling block includes a reservoir and a thermally conductive sheet. The reservoir has a liquid inlet, a first liquid outlet, a second liquid outlet, and a flow-dividing channel located inside the reservoir. A liquid inlet end of the flow-dividing channel is in communication with the liquid inlet. A liquid outlet end of the flow-dividing channel has a first flow-dividing opening and a second flow-dividing opening. The thermally conductive sheet is hermetically fixed to the reservoir to form a closed accommodating chamber therebetween. The thermally conductive sheet is integrally formed with a plurality of fins located in the accommodating chamber.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: April 16, 2024
    Assignee: DONGGUAN HANXU HARDWARE PLASTIC TECHNOLOGY CO., LTD.
    Inventor: Tsung-Hsien Huang
  • Patent number: 11952140
    Abstract: A cooling system for an aircraft, including a heat exchanger for cooling a hot fluid with cooling air, an air intake for the supply of cooling air and a Coand?-effect air amplifier for the creation of a flow of cooling air.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: April 9, 2024
    Assignee: Airbus Operations S.L.U.
    Inventors: Carlos Casado-Montero, Alberto Molina Parga
  • Patent number: 11946701
    Abstract: A heat transfer system (e.g., a heat pump) can include at least a first fin array and at least a first pump disposed in fluid communication with the first fin array and configured to cause a first fluid to flow through the first fin array. The system can include at least a first heat transfer layer attached to and/or in thermal communication with the first fin array. The first heat transfer layer can define a second fluid flow path therein for a second fluid to flow fluidly isolated from the first fluid. The first heat transfer layer and the first fin array can be configured to cause heat transfer between the first fluid and the second fluid.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: April 2, 2024
    Assignee: B/E Aerospace, Inc.
    Inventors: Kimberly Rae Saviers, Matthew Robert Pearson, Brian St. Rock
  • Patent number: 11933548
    Abstract: A cooler has individual cooling elements (1) of stacked construction having ducts (25) extending in parallel to one another, Each duct delimits a flow chamber (29) for the throughflow of a liquid medium to be cooled. Between each pair of ducts. at least two layers (3, 5) of individual rows of meandering fins (34) extend for the throughflow of air and jointly delimit a further flow chamber (26, 28) each. The respective one flow chamber (29), free of obstacles, permits a laminar flow of the liquid medium through the assignable duct (25) in one throughflow direction. The height (H1) of each fin (34), viewed transversely to the direction of throughflow of the liquid medium, has at least the same height as the free throughflow cross section of the flow chamber (29) of the adjacently arranged duct (25), viewed in parallel to the extension of the respective fin (34).
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: March 19, 2024
    Assignee: HYDAC COOLING GMBH
    Inventor: Thomas Wolfanger
  • Patent number: 11924995
    Abstract: A water cooling head with sparse and dense fins, including a main body, a first fin set and a second fin set. Wherein a chamber is formed inside the main body, the main body has a first plate and a second plate, the main body forms an inlet channel and an outlet channel, so that the cooling water passes through the chamber. The first fin set and the second fin set are arranged in the chamber, and the first fin set and the second fin set are connected to the first plate respectively. The first fin set comprises several first fins spaced apart, the first fins divide the chamber to form several first channels. The second fin set comprises several second fins spaced apart, the second fins divide the chamber to form several second channels. The water cooling head can increase the overall heat sinking efficiency.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: March 5, 2024
    Inventors: Chi-Chuan Wang, Cheng-Chen Cheng, Chuan-Chan Huang, Jen-Chieh Huang
  • Patent number: 11913734
    Abstract: A receiver includes a large diameter main body portion, and an intermediate member side small diameter portion. A wall thickness of the intermediate member side small diameter portion is smaller than a wall thickness of the main body portion. As a result, heat capacity of the intermediate member side small diameter portion is reduced. As a result, it is possible to complete brazing between the intermediate member side small diameter portion and the intermediate member, at the same time as brazing among tanks, tubes, and fins. A desiccant enclosed in a flexible bag can be taken in and out through the intermediate member side small diameter portion.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: February 27, 2024
    Assignees: DENSO AIRCOOL CORPORATION, DENSO CORPORATION
    Inventors: Michihiro Yamakoshi, Hiroki Matsuo, Masanobu Iio
  • Patent number: 11917795
    Abstract: A heat sink structure includes a base seat and at least one heat dissipation unit. The base seat has a first face and a second face. At least one extension column extends from the second face of the base seat. The heat dissipation unit is disposed above the base seat and spaced from the base seat by a gap. The extension column serves to restrict or secure the heat dissipation unit in horizontal and vertical directions. The heat dissipation unit with different structures provides multiple heat dissipation features to enhance the entire heat dissipation performance.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: February 27, 2024
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Yuan-Yi Lin, Fu-Kuei Chang
  • Patent number: 11910570
    Abstract: A heat sink structure that is used for audio equipment includes a base and a plurality of heat dissipation fins. The heat dissipation fins extend from a predetermined surface of the base in a first direction orthogonal to the predetermined surface. The heat dissipation fins are arranged side by side in a second direction orthogonal to the first direction. In a cross-section in a plane parallel to the first and second directions, (i) each of the heat dissipation fins has a first side surface and a second side surface, the first and second surfaces facing oppositely from each other in the second direction, and (ii) inclinations, relative to the predetermined surface, of the first and second side surfaces of adjacent ones of the heat dissipation fins are different from each other.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: February 20, 2024
    Assignee: DENSO TEN Limited
    Inventor: Noboru Hidaka
  • Patent number: 11910569
    Abstract: A heat sink is provided. The heat sink includes a cylindrical body and a plurality of fins. The fins are connected to and protruding from the cylindrical body. At least a part of the plurality of fins each include a first protrusion portion and a second protrusion portion, a distal edge of the first protrusion portion is located farther away from a central axis of the cylindrical body than a distal edge of the second protrusion portion. In addition, the disclosure also provides a heat dissipation device having the heat sink.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: February 20, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Yan-Sian Jheng
  • Patent number: 11906199
    Abstract: A heat and humidity exchanger comprises panels made up of membrane sheets attached on either side of a separator. Channels extend across each panel between the separator and the membrane sheets. The panels are much stiffer than the membrane sheets. Panels are stacked in a spaced apart relationship to provide an ERV core. Spacing between adjacent panels may be smaller than a thickness of the panels.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: February 20, 2024
    Assignee: CORE ENERGY RECOVERY SOLULTIONS INC.
    Inventors: Curtis Warren Mullen, David Erwin Kadylak, Christopher Robert Barr, James Franklin Dean, Guy Timothy Pearson
  • Patent number: 11892218
    Abstract: An air-conditioning apparatus includes: a heat-source-side device that heats or cools a heat medium; a pump that sucks and transfers the heat medium; use-side heat exchangers; a heat medium circuit; flow rate control devices; indoor-side pressure sensors; a pump inlet-side pressure sensor and/or a pump outlet-side pressure sensor; a flow rate detection device that detects a pump flow rate; and a controller that performs a first operation in which the flow rate control devices are individually opened or closed and data regarding a flow passage resistance at a path related to each of the heat exchangers is obtained, and a second operation in which heat is supplied to indoor air, and calculates calculate flow rates of the heat medium that flows through the heat exchangers in the second operation, from pump flow rates and pressures detected by the pressure sensors in the first and second operations.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: February 6, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Jun Nishio, Soshi Ikeda, Naofumi Takenaka, Yuji Motomura, Katsuhiro Ishimura
  • Patent number: 11879664
    Abstract: A system for obtaining energy consumptions, savings and cost reduction in structures adapted for human habitation which includes the utilization of a plurality of mats including phase change material encapsulated within first and second layers of plastic material having heat transfer capability disposed within the plenum area above a ceiling of a room within a building with the amount of phase change material contained within each mat being between 0.5 lbs. and 0.67 lbs. per square foot.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: January 23, 2024
    Assignee: STASIS ENERGY GROUP, LLC
    Inventors: Jose Radzinsky, Robert Morton, Michael Cecchini
  • Patent number: 11882671
    Abstract: A heat dissipating device includes a power distribution assembly and two convergence delivery assemblies. The power distribution assembly includes a first cooling reservoir, a second cooling reservoir, multiple cooling pumps disposed on the first cooling reservoir, and a serial pipeline and a cooling head corresponding to each of the cooling pumps respectively. The two convergence delivery assemblies separately communicate with first cooling reservoir and the second cooling reservoir, and are separately arranged on two sides of the power distribution assembly. The serial pipeline is connected with the cooling head to communicate between the first cooling reservoir and the second cooling reservoir.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: January 23, 2024
    Assignee: NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION
    Inventor: Yao-Tsung Chiu
  • Patent number: 11874076
    Abstract: A heat exchanger core according to an embodiment includes: a first header space; a plurality of first layered header passages; a plurality of first communication port rows; and a plurality of first passages. The plurality of first layered header passages are stacked in a perpendicular direction to a reference plane so as to each extend along the reference plane. Each first layered header passage has an open end at a first edge adjacent to the first header space and communicates with the first header space through the open end. The plurality of first communication port rows are arranged in the perpendicular direction so as to correspond to the plurality of first layered header passages, respectively. Each first communication port row is formed by a plurality of first communication ports arranged along the reference plane. The plurality of first passages communicate with any of the first layered header passages through the plurality of first communication ports.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: January 16, 2024
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Shunsaku Eguchi, Minemasa Omura, Yoichi Uefuji, Hiroyuki Nakaharai, Koichi Tanimoto, Masaya Hatanaka, Nobuhide Hara, Takuo Oda
  • Patent number: 11871545
    Abstract: A cooling cabinet is configured to cool a to-be-cooled device and includes a cabinet body, a first diversion assembly, and a second diversion assembly. The cabinet body can contain a cooling medium for at least partially immersing the to-be-cooled device, and the cabinet body has a first diversion inlet for introducing the cooling medium and also has a first diversion outlet for discharging the cooling medium. The first diversion assembly is coupled to the first diversion inlet, and the first diversion assembly has a second diversion outlet for discharging the cooling medium into the cabinet body. The second diversion assembly is coupled to the first diversion outlet, and the second diversion assembly has a second diversion inlet for introducing the cooling medium to flow through the to-be-cooled device.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: January 9, 2024
    Assignee: Alibaba Group Holding Limited
    Inventor: Yangfan Zhong
  • Patent number: 11871538
    Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: January 9, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shun-Yu Shih, Shui-Fa Tsai
  • Patent number: 11844541
    Abstract: A cooling tower for evaporative cooling of water is contained within an ISO-compliant shipping container frame, permitting stacking of cooling towers for transport and for certain industrial applications. A volume of fill media is contained within the frame. Spaced apart troughs underlie the fill media, running substantially the length of the fill media and connecting to a basin. Baffles are connected to one upper edge of the troughs, while an air flow space is positioned over the other upper trough edge. A water distribution system, with variable flow nozzles positioned closely above the fill media, sprays water over the upper surface of the fill media, where it moves by gravity down into the troughs. Fans atop the fill media move air vertically upward through the fill media.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: December 19, 2023
    Assignee: AGGREKO, LLC
    Inventors: Billy Wayne Childers, Jr., Atul Amar Kumar Swamy
  • Patent number: 11825629
    Abstract: A liquid cooling heat exchange apparatus for memory modules comprising a thermal conduction assembly, fastening assembly, and first and second working fluid splitters is provided. The thermal conduction assembly, mounted on the memory nodules via the fastening assembly, comprises a pair of flat flexible conduits, each having at least one fluid passageway communicating with the first and second working fluid splitters, and a pair of cooling spreaders. The pair of flat flexible conduits is in thermal contact with heat producing chips of the memory modules, thermally coupling the first and second working fluid splitters together for transferring heat from the heat producing chips. The pair of cooling spreaders is in thermal contact with the pair of flat flexible conduits for transferring heat from the heat producing chips to the thermal conduction assembly. Each of the at least one fluid passageway is expandable.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: November 21, 2023
    Assignee: Cooler Master Co., Ltd.
    Inventor: Ting-jui Chang
  • Patent number: 11802908
    Abstract: An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
    Type: Grant
    Filed: May 4, 2020
    Date of Patent: October 31, 2023
    Assignee: DELTA DESIGN, INC.
    Inventors: Jerry Ihor Tustaniwskyj, James Wittman Babcock
  • Patent number: 11796260
    Abstract: Embodiments are disclosed of an apparatus including a cooling loop and a heating loop. The cooling loop includes a temperature control plate having a fluid inlet and a fluid outlet, the temperature control plate being adapted to be thermally coupled to one or more heat-generating electronic components. An inlet control is fluidly coupled to the fluid inlet of the temperature control plate and an outlet control fluidly coupled to the fluid outlet of the temperature control plate. A cooling fluid source is fluidly coupled the inlet control and a cooling fluid return fluidly coupled to the outlet control. The heating loop contains less fluid than the cooling loop and includes a heating fluid source fluidly coupled the inlet control and a heating fluid return fluidly coupled to the outlet control. A pump can circulate heating fluid through at least the heating fluid supply, the temperature control plate, and the heating fluid return.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: October 24, 2023
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao