Patents Examined by Claire E Rojohn, III
  • Patent number: 12359853
    Abstract: A heat exchanger includes: heat transfer tubes aligned in an up-down direction; a liquid header connected to ends of the heat transfer tubes; and connection tubes aligned in the up-down direction and connected to the liquid header. The heat transfer tubes include: a first heat transfer tube disposed at a lowermost position; and a second heat transfer tube disposed above and adjacent to the first heat transfer tube. The connection tubes include: a first connection tube disposed at a lowermost position; and a second connection tube disposed above the first connection tube. The liquid header includes: a first flow path connected to the first connection tube and the first heat transfer tube; and a second flow path connected to the second connection tube and the second heat transfer tube.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: July 15, 2025
    Assignee: DAIKIN INDUSTRIES, LTD.
    Inventors: Ken Satou, Tomohiko Sakamaki, Kengo Uchida, Yoshio Oritani
  • Patent number: 12352459
    Abstract: A composite exchange membrane is made by combining ionomer with porous polyolefin, such as polyethylene or polypropylene. The composite ion exchange membrane may be used in the core of an energy recovery ventilator. The core of the energy recovery ventilator may comprise corrugated or pleated supports for supporting the composite ion exchange membrane. The air flow into the energy recovery ventilator may be modified to actively create non-laminar flow.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: July 8, 2025
    Assignee: FFI IONIX IP, INC.
    Inventors: Bamdad Bahar, Jack Saltwick
  • Patent number: 12342502
    Abstract: A two-phase immersion cooling apparatus may include an immersion tank with a primary condenser in thermal communication with an interior volume of the immersion tank and a vapor management system fluidically connected to the immersion tank. The vapor management system may enable the apparatus to effectively manage periods of high vapor production by removing vapor and other gases from a headspace of the immersion tank, condensing the vapor to liquid, and returning the liquid to the immersion tank.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: June 24, 2025
    Assignee: LIQUIDSTACK HOLDING B.V.
    Inventor: Kar-Wing Lau
  • Patent number: 12337676
    Abstract: The disclosure relates to an air guide control system with a flap arrangement including flaps which can be rotatably inserted into a joining partner. An actuator drives a damper and a coupling rod transmits the torque of this driven damper to the remaining dampers of the damper arrangement. In the event of a flap fracture of at least one flap, a spring, locks the flap arrangement against further movement, so that error information is reported to the actuator via the coupling rod.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: June 24, 2025
    Assignee: MONTAPLAST GMBH
    Inventor: Johannes Müller
  • Patent number: 12331999
    Abstract: A thermal module includes a radiating fin unit having a plurality of superposed radiating fin assemblies, and a plurality of groups of heat pipes. The heat pipes respectively have a heat absorbing section and a heat dissipating section formed at two opposite ends thereof. The heat absorbing sections in each heat pipe group is in contact with a heat source, and the heat dissipating sections in the same heat pipe group is sandwiched between two adjacent ones of the radiating fin assemblies. The thermal module is characterized in that the heat dissipating sections are horizontally extended through the radiating fin assemblies from one of two opposite shorter sides to another shorter side along two parallel longer sides thereof, such that the heat dissipating sections not only have a maximum contact area with the radiating fin assemblies, but also give the radiating fin unit an enhanced structural strength.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: June 17, 2025
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Sheng-Huang Lin
  • Patent number: 12327849
    Abstract: A battery cooling device, including a plurality of coolers to cool a battery using insulating oil, includes: a communication pipe to connect the plurality of coolers to each other, the communication pipe allowing the insulating oil to flow therethrough; a water level sensor provided in a vertical portion of the communication pipe, the vertical portion extending in a vertical direction, and detects a water level in the vertical portion; a shutdown valve provided in the communication pipe; and a control device configured to control the shutdown valve. Further, the control device closes the shutdown valve when the water level sensor detects a water level rise equal to or greater than a predetermined value.
    Type: Grant
    Filed: July 14, 2023
    Date of Patent: June 10, 2025
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Hajime Shimizu
  • Patent number: 12326306
    Abstract: The invention relates to a crimping tool for creating at least one connection through which coolant can be conducted between a tube connector and a tube. The invention also relates to a heat exchanger that has the connections formed using the crimping tool. The invention also relates to a method for creating the connections between the tube connectors and the tubes using the crimping tool.
    Type: Grant
    Filed: October 6, 2023
    Date of Patent: June 10, 2025
    Assignee: MAHLE INTERNATIONAL GMBH
    Inventors: Christian Merkle, Frank Nastoll
  • Patent number: 12319496
    Abstract: A refuse vehicle includes a chassis, a body assembly coupled to the chassis, and a thermal stress mitigation system. The body assembly defines a refuse compartment. The thermal stress mitigation system is configured to mitigate against a thermal stress on the refuse vehicle. The thermal stress mitigation system includes a thermal stress mitigation substance, at least one of a container and a tank, one or more nozzles, a controller, one or more thermal sensors. The controller is structured to receive thermal stress data from the sensors, determine whether the thermal stress is greater than a threshold thermal stress based on the thermal stress data from the sensors, and operate the nozzles to deploy the thermal stress mitigation substance on the refuse vehicle responsive to determining that the thermal stress is greater than the threshold thermal stress.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: June 3, 2025
    Assignee: OSHKOSH CORPORATION
    Inventors: Jeffrey Koga, Emily Davis, Clinton T. Weckwerth, Vincent Hoover, Zachary L. Klein, Jerrod Kappers, Derek A. Wente, Logan Gary, Joshua D. Rocholl, Chad K. Smith
  • Patent number: 12320597
    Abstract: The purpose of the present invention is to provide a plate-type heat exchanger in which the formation of burrs and chips during fin processing may be eliminated by eliminating fin processing work for stacking and bonding fins and plates. In order to achieve the above purpose, a plate-type heat exchanger according to the present invention is characterized by comprising: plates which include an inlet formed on one side in the longitudinal direction, an outlet formed on the other side in the longitudinal direction, and a flow surface formed between the inlet and the outlet; and a fin part which is inserted into a plate part formed by bonding a pair of the plates and rests on the flow surface.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: June 3, 2025
    Assignee: HANON SYSTEMS
    Inventors: Sangyong Rhee, Hyunkeun Shin, Sang Ok Lee
  • Patent number: 12313342
    Abstract: An evaporative cooling system includes an indirect cooling coil containing a cooling fluid to be circulated and a blower assembly configured to generate an inlet air stream through the indirect cooling coil. The cooling fluid in the indirect cooling coil is a slurry of water and phase change material.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: May 27, 2025
    Assignee: MESTEK, INC.
    Inventor: George Michael Kaler, Jr.
  • Patent number: 12295124
    Abstract: The invention discloses a dual liquid pump liquid cooling radiator and a liquid cooling heat dissipation device. The dual liquid pump liquid cooling radiator includes two liquid boxes and a plurality of radiator pipe sets arranged side by side between the two liquid boxes. The interior of one liquid box is divided into a hot liquid chamber and a cold liquid chamber by an air heat insulation space, and a first liquid pump is installed therein. The interior of the other liquid box is divided into a hot liquid chamber and a cold liquid chamber by a liquid barrier, and a second liquid pump is installed therein.
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: May 6, 2025
    Inventor: Tsung-Hsien Huang
  • Patent number: 12289863
    Abstract: A manifold assembly includes a liquid inlet pipe, a plurality of transparent windows and a liquid return pipe. The liquid inlet pipe has a first accommodating space, a first liquid inlet, a plurality of first liquid outlets and a plurality of openings. The first accommodating space is configured to accommodate a cooling liquid, and is in fluid communication with the first liquid inlet, the first liquid outlets and the openings. The transparent windows cover the openings. The cooling liquid is visible from outside via the transparent windows. The liquid return pipe has a second accommodating space, a plurality of second liquid inlets and a second liquid outlet. The second accommodating space is configured to accommodate a cooling liquid, and is in fluid communication with the second liquid inlets and the second liquid outlet.
    Type: Grant
    Filed: June 14, 2023
    Date of Patent: April 29, 2025
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Biao Li, Lei Zhou, Lian-Fei Zhang
  • Patent number: 12287151
    Abstract: An example apparatus is for contacting a device to change a temperature of the device. The apparatus includes a plate configured to contact the device and a channel within the plate configured to enable flow of fluid between an input port and an output port. The plate includes a thermally conductive material to conduct heat between the device and the fluid. The channel includes multiple islands arranged in series. An island among the multiple islands is arranged to receive the fluid at a first side. The island is for splitting the fluid into a first flow and a second flow and for causing the first flow and the second flow to merge at a second side of the island that is downstream of the first side of the island.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: April 29, 2025
    Assignee: Teradyne, Inc.
    Inventor: Jack Michael Thompson
  • Patent number: 12278116
    Abstract: A chip cooler with high pressure bearing capacity installed on a chip it cools. The chip cooler has a cooler body having a refrigerant channel formed corresponding to the internal construction of the cooler body and configured to guide the flow of a refrigerant, and two liquid inlet and outlet channels formed corresponding to the construction at an edge of the cooler body, connected to the refrigerant channel and configured to transversely communicate the inside and outside of the cooler body; and a reinforced connecting piece is disposed in at least one of the two liquid inlet and outlet channels, the reinforced connecting piece at least connects opposite upper and lower wall surfaces of the liquid inlet and outlet channel, and a flow gap exists between the reinforced connecting piece and the liquid inlet and outlet channel.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: April 15, 2025
    Assignee: NINGBO HALLEY HEAT EXCHANGE EQUIPMENT CO., LTD
    Inventors: Dingjun Dai, Hongqiang Zhuo, Xuguang Sun, Aibin Yan, Tinghui Chen
  • Patent number: 12279398
    Abstract: The present invention discloses a water-cooled radiator with built-in pump spraying waterway structure. A slot formed in the body bottom shell is separated into a water storage tank and a heat sink; a water inlet is formed in the heat sink, a water outlet is formed in the water storage tank, a through hole is formed in the water-stop plate, the radiating fin fixedly covers an opening of the heat sink; one end of the water inlet pipe is communicated with a water outlet end of the water-cooled box while the other end thereof is communicated with the water inlet, one end of the water outlet pipe is communicated with the water outlet while the other end thereof is communicated with a water inlet end of the water-cooled box, and the water pumping mechanism is arranged in the water storage tank. The present invention improves the water cooling efficiency.
    Type: Grant
    Filed: March 27, 2023
    Date of Patent: April 15, 2025
    Assignee: DONGGUAN BINGDIAN INTELLIGENT SCIENCE & TECHNOLOGY CO., LTD.
    Inventor: Fengqi Zhang
  • Patent number: 12274032
    Abstract: A two-phase immersion-type heat dissipation structure having high density heat dissipation fins is provided. The two-phase immersion-type heat dissipation structure having high density heat dissipation fins includes a heat dissipation substrate, a plurality of sheet-like heat dissipation fins, and a reinforcement structure. A bottom surface of the heat dissipation substrate is in contact with a heating element immersed in a two-phase coolant. The plurality of sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. An angle between at least one of the sheet-like heat dissipation fins and the upper surface of the heat dissipation substrate is from 60° to 120°. At least one of the sheet-like heat dissipation fins has a length from 50 mm to 120 mm, a width from 0.1 mm to 0.35 mm, and a height from 2 mm to 8 mm.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: April 8, 2025
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Tze-Yang Yeh, Ching-Ming Yang, Chun-Te Wu
  • Patent number: 12264842
    Abstract: A zoning system for a heating, ventilation, and/or air conditioning (HVAC) system includes a temperature control device configured to monitor a temperature in a zone of a structure for conditioning by the HVAC system and configured to send a wireless control signal including data based on the temperature, and a damper actuator configured to be associated with the zone and configured to adjust a position of a damper to control an airflow into the zone, where the damper actuator is configured to receive the wireless control signal from the temperature control device and configured to adjust the position of the damper based on the data.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 1, 2025
    Assignee: Tyco Fire & Security GmbH
    Inventor: Shaun B. Atchison
  • Patent number: 12257880
    Abstract: A refrigeration cycle device includes a refrigeration cycle, an outdoor heat exchanger, a cooling necessity determination unit, a determination reference setting unit, and a cooling control unit. The cooling necessity determination unit determines whether or not to cool a battery depending on whether or not a physical quantity that correlates with a temperature of the battery is equal to or more than a predetermined reference physical quantity. The determination reference setting unit sets the reference physical quantity for the cooling necessity determination unit according to the outdoor heat exchanger functioning as a heat absorber or radiator. When the outdoor heat exchanger functions as heat absorber, the determination reference setting unit sets a second reference physical quantity smaller than a first reference physical quantity set when the outdoor heat exchanger functions as radiator.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: March 25, 2025
    Assignee: DENSO CORPORATION
    Inventors: Satoshi Suzuki, Satoshi Itoh, Kengo Sugimura
  • Patent number: 12247792
    Abstract: Disclosed is a heat exchanger. An end cover is assembled and fixed to a port of a first header in a lengthwise direction or a port of a second header in a lengthwise direction, and the end cover includes a body and a first opening formed in the body. The body includes a second cavity and a first recess. The first recess includes a first bottom wall close to the first opening, the first bottom wall is provided with a third opening, the third opening is in communication with the first opening and the second cavity, and the first opening is farther away from an inner cavity of the first header or an inner cavity of the second header than the second cavity. The open area of the first recess is larger than that of the third opening.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: March 11, 2025
    Assignee: Hangzhou Sanhua Research Institute Co., Ltd.
    Inventors: Weiwei Zhang, Junqi Dong, Xin Shi
  • Patent number: 12241689
    Abstract: A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 4, 2025
    Assignee: Analog Devices, Inc.
    Inventors: Marc T. Dunham, Baoxing Chen