Patents Examined by Colleen P. Cook
  • Ball bonding method on a chip
    Patent number: 6176417
    Abstract: A ball bonding method on a chip mainly comprises steps of: a wire is burned to form a ball on a capillary; the capillary is moved down to a second bonding point for ball bonding; and the capillary is moved up in a vertical direction thereby pulling the tip of the ball to be cut such that the ball has a uniformly body shape and tip height. Therefore, the ball provides uniform body shape and tip height for wire bonding at a second bonding point under lower variability conditions thus increasing the reliability of products.
    Type: Grant
    Filed: October 15, 1999
    Date of Patent: January 23, 2001
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventors: Yu-Fang Tsai, Su Tao, Simon Lee, Tao Yu Chen