Abstract: The application concerns a support structure for power electronics, comprising a holder for the insertion of at least one power electronics module and an electrically conductive external geometry which surrounds the holder and has rounded corners and edges with a radius of curvature which is greater than a predetermined minimum radius.

Abstract: An electronic device includes a chassis having a recess and a fan assembly captured by the recess, wherein the fan assembly is moveable out of the recess to rotate such that airflow through the fan assembly moves in different directions to cool the electronic device as a function of such rotation.

Abstract: An electrical connection module system includes a first connection plate with a first connection end and at least one first foot section, a first screw nut, and a dielectric holder. The dielectric holder has a first reception region for receiving the first screw nut. The first connection plate can, when the first screw nut is placed in the first reception region, be pushed onto the dielectric holder and be brought into a first target position such that the first screw nut is arranged between the dielectric holder and the first connection end and is held by the first connection end in the first reception region in such a way that the first screw nut cannot fall out.

Abstract: A display device is disclosed. In one aspect, the display device includes a panel including a plurality of wiring patterns and a flexible printed circuit board formed over and at least partially overlapping an edge of the panel. The flexible printed circuit board includes a connection portion electrically connected to the panel and the connection portion includes first and second surfaces opposing each other. The wiring patterns include a plurality of first wiring patterns connected to the first surface of the connection portion and a plurality of second wiring patterns connected to the second surface of the connection portion.

Abstract: The present invention relates to a lightweight liquid-cooling-plate assembly having a plastic frame and a heat dissipation system using the same. The liquid-cooling-plate assembly includes a plastic frame and at least one coolant chamber unit. The plastic frame includes a plurality of lateral walls, at least one accommodation opening, and a plurality of fastening elements. The lateral walls are connected with each other to form and define the at least one accommodation opening. The fastening elements are disposed on a part of the lateral walls. The coolant chamber unit is connected with the plastic frame and embedded in the at least one accommodation opening, and includes at least one surface exposed.

Abstract: In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extends away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires.

Abstract: Various embodiments include a power connection clip to electrically couple a power distribution board of an information technology (IT) equipment shelf to a plurality of power rails/buses in a server rack. The power connection clip can include a clip body having an inner portion and an outer portion, a shelf coupler, and an electrical conductor pair. The outer portion can include at least two clip fins separated from a central stump to form at least two cavities. The shelf coupler can couple the clip body to the IT equipment shelf. The electrical conductor pair can sandwich at least the inner portion of the clip body. The electrical conductor pair is adapted to carry high-voltage direct current (HVDC) voltage. The cavities can be covered with electrical conductors. The electrical conductors in the cavities can be adapted to carry IT-usable direct current (DC) voltage.

Abstract: A power conversion apparatus includes a first power converter, second power converter, a case, and partitioning portion. The first power converter performs power conversion. The second power converter performs power conversion. The case houses the first power converter and the second power converter. The partitioning portion partitions the first power converter and the second power converter housed in the case, and forms a coolant flow passage through which a coolant flows. The first power converter includes a first heat-generating component. The second power converter includes a second heat-generating component. The first heat-generating component and the second heat-generating component are each joined to the partitioning portion at a position at which the first heat-generating component and the second heat-generating component do not overlap each other in a perpendicular direction perpendicular to a coolant flow direction of the coolant flow passage.

Abstract: In order to reduce service procedure time and labor costs, while increasing overall uptime, the electrical equipment cabinet of the invention includes a main service door that is integrated with the dead front. The dead front panel is fixed to and movable with the main service door, and therefore access to high voltage equipment situated behind the dead front is achieved by simply opening the main service door, without the need to first unlock and open the main service door and then unlock, open, and/or remove the dead front panel. Controls on the front side of the dead front are easily and safely accessible, when the main service door is closed, through a dead front control access door positioned within an opening of the main service door.

Abstract: An integrated circuit is provided. The integrated circuit includes a control circuitry, a plurality of pins, and a plurality of driving units coupled to the pins. The control circuitry provides a plurality of control signals according to data to be transmitted. The pins are coupled to a device via a plurality of conductive traces of a printed circuit board (PCB). The control signals control each of the driving units to selectively provide the data or one specific shielding pattern via the corresponding pin and the corresponding conductive trace of PCB to the device.

Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff. The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

Abstract: In an embodiment, a method includes arranging a first carrier on a first major surface of a circuit board such that an electronic component arranged on the first carrier is positioned in an aperture in the circuit board and spaced apart from side walls of the aperture, and arranging a second carrier on a second major surface of the circuit board such that the second carrier covers the electronic component and the aperture, the second major surface of the circuit board opposing the first major surface of the circuit board. The electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact pad arranged on a first major surface of the dielectric core layer.

Abstract: A modular high voltage supply system has a mobile adapter transformer with a high-voltage output side and a low-voltage input side, electrical connecting input-terminals being foreseen at the mobile adapter transformer outer surface, a mobile container with a low voltage supply system, mounted stationarily therein, having a high current busbar and at least one electrical frequency converter connected thereto, electrical connecting output-terminals for the high current busbar being foreseen at an accessible the mobile container edge; and a modular interim busbar system, for temporary electrical connection of input- and output-terminals, having at least one interim busbar with at least one elongated busbar basic module mounted on a frame structure and respective resilient electrical connections on both busbar basic module ends forming an electrical connection to the input- and/or output-terminals and arranged such that a transmission of vibrations from the mobile adapter transformer to the mobile container is s

Abstract: A locking system is disclosed. The locking system comprises a locking bar rotatable between a locked position and an unlocked position. A locking feature on the locking bar engages a tab when the locking bar is rotated into the locked position.

Abstract: A server capable of rotating and accessing storage devices accommodated therein includes a server chassis, a motherboard, a power supply module, two racks, and a system cooling module. The server chassis includes two side plates and an accommodating space between the two side plates. The power supply module is disposed in the accommodating space and arranged corresponding to the motherboard. The racks are arranged parallel to each other and detachably connected to the server chassis. A pivot structure and a handle for operating the rack are disposed at the rack near the motherboard. The rack is rotatable with respect to the server chassis by means of the pivot structure. The system cooling module is disposed adjacent to the rack. At least one cord passage is provided between the system cooling module and each of the side plates.

Abstract: A connecting device configured to rotatably connect a first main body and a second main body of electronic apparatus includes a rotating mechanism rotatably connecting the first main body and the second main body; a coating mechanism covering at least a part of the rotating mechanism; and a magnetic mechanism magnetically coupling the coating mechanism and the rotating mechanism together. The connecting device disclosed in the present disclosure improves man-machine interaction, and enables the user to enjoy a better experience.

Abstract: A circuit board assembly includes a circuit board, at least one metal sheet, at least one bus and at least one fixed member. The circuit board has at least one electrical connecting area. The metal sheet is adapted to solder to the electrical connecting area and has at least one metal sheet hole. The bus has a connecting portion. The connecting portion is corresponding to the metal sheet. The bus has at least one fixed screwing hole. The fixed screwing hole is corresponding to the metal sheet hole. The circuit board and the bus is locked by the fixed member.

Abstract: A heat dissipation structure for an external apparatus is a heat dissipation structure for an external apparatus in an electronic apparatus including a housing section configured to removably house an external apparatus. The heat dissipation structure for an external apparatus includes a heat dissipation portion, which is removably attached to the external apparatus and which has thermal conductivity for transferring heat generated by the external apparatus to the housing section.

Abstract: Techniques for operating a data center include providing at least one fan coil unit operable to circulate a cooling airflow to a human-occupiable workspace of the data center; providing a plurality of computer racks arranged in one or more rows in the human-occupiable workspace; forming one or more warm air aisles between the one or more rows of the plurality of computer racks that are in fluid communication with an inlet of the fan coil unit through a warm air plenum, and also with an outlet of the fan coil unit through the human-occupiable workspace and the plurality of computer racks arranged in one or more rows; adjusting the associated electrical power density of one or more of the plurality of computer racks; and based on the adjustment, adjusting a characteristic of the data center.

Abstract: A hinge includes connection members, a first fixing member, a second fixing member, a first axle, a second axle, and a third axle. Each connection member includes a first slide block, a second arc surface, a first arc surface, and a second slide block. A first circular hole penetrates through the first slide block. A first arc hole penetrates through the second slide block. The first fixing member includes a third arc surface and a third slide block with a second arc hole. The second fixing member includes a fourth slide block with a second circular hole and a fourth arc surface. The first axle passes through the second arc hole and the first circular hole. The second axle passes through the second circular hole and the first arc hole. The third axle passes through the first circular hole and the first arc hole.