Patents Examined by Dameon E. Levi
  • Patent number: 8988306
    Abstract: A multi-feed antenna is disclosed. The multi-feed antenna includes a first feed terminal, a second feed terminal, a first ground terminal, a second ground terminal, a radiator and a control circuit. The radiator is coupled to the first feed terminal, the second feed terminal, the first ground terminal and the second ground terminal. The control circuit is coupled to the first feed terminal and the second feed terminal and used for switching a radio frequency (RF) signal between the first feed terminal to the first ground terminal and the second feed terminal to the second ground terminal.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: March 24, 2015
    Assignee: HTC Corporation
    Inventors: Yen-Liang Kuo, Wan-Ming Chen
  • Patent number: 7532486
    Abstract: A cam handle assembly for use with a modular information handling system components includes a latch with first protrusion and a second protrusion. The first protrusion is sloped such that when the sloped portion of the first protrusion contacts a portion of a rack or chassis, the latch is urged to a recessed position that will allow the cam handle to move between its closed and open position. The second protrusion on the latch is formed to engage an interface aperture that is formed in the cam handle. The interaction between the latch protrusions, the cam handle and the rack encourage proper operation of the cam handle to install an information handling system component within a rack.
    Type: Grant
    Filed: April 23, 2007
    Date of Patent: May 12, 2009
    Assignee: Dell Products L.P.
    Inventors: Bernard Strmiska, Keith J. Kasprzak
  • Patent number: 7525806
    Abstract: A combination current sensor and relay has an improved housing. In one aspect, the housing includes light emitting diodes on an upper surface that indicate open circuit and short circuit conditions. In another aspect, the housing includes a securement structure for a circuit board that includes the transformer and switches for device operation, together with aligned openings therein for routing wires to external devices. In another aspect, a multiple position switch is included on the upper surface that indicates multiple modes of operation of the device. In another aspect, the housing may be assembled in multiple parts by affixing a first portion to a support, a circuit board to the first portion, and a second portion to the first portion. In another aspect, the housing is suitable for engagement to alternatively a junction box and a duplex box. In another aspect, the configuration of the upper surface provides usability advantages.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: April 28, 2009
    Assignee: Veris Industries, LLC
    Inventors: Kent Holce, Frank Morey, Matt Rupert, Mark Bowman
  • Patent number: 7489522
    Abstract: A case for electronic equipment includes: a chassis that includes at least a bottom plate of an enclosure having a box-shaped outer shell; a stay that holds a motherboard perpendicularly with respect to the bottom plate; guide members that are provided with slots for guiding a substrate unit to be perpendicularly plugged into the motherboard by way of a connector, the guide members being disposed on both sides for guiding the substrate unit, and being configured to pull out integrally with the motherboard towards a plug-in side from which the substrate unit is plugged in; and a cover that includes at least a top cover side of the enclosure except for a portion corresponding to the bottom plate and a portion corresponding to the plug-in side.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: February 10, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tsutomu Hoshino, Akira Sugiyama
  • Patent number: 7466556
    Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is mounted into a swivel casing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The swivel casing includes a holder that is pivotably mounted into an external housing by way of a pivot pin. The pivot pin is either a separate structure that is inserted into holes formed in the holder and housing, or is integrally formed on the holder.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: December 16, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Siew S. Hiew, Jin Kyu Kim, Abraham C. Ma, Ming-Shiang Shen
  • Patent number: 7443695
    Abstract: A system having a removable protective enclosure for an electronic component. The protective enclosure may have a base and a circuit board that may be captured by the base without use of a tool or a separate fastener. A memory module may be disposed on the circuit board. The protective enclosure may be adapted to be mechanically and electrically coupleable to an enclosure.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: October 28, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brett D. Roscoe, George D. Megason, Christian H. Post
  • Patent number: 7443694
    Abstract: An expansion card bracket for a computer server has an expansion card support attachable to a motherboard and an expansion card accepting portion disposed near a top of the support. The expansion card accepting portion is configured to support an expansion card at an acute angle of inclination with respect to the motherboard. The acute angle of inclination is substantially equal to an angle of inclination of a connector for receiving the expansion card.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: October 28, 2008
    Assignee: Sun Microsystems, Inc.
    Inventors: Mark H. Chen, David W. Hartwell, Stephen E. Lindquist, Brett C. Ong
  • Patent number: 7440287
    Abstract: An extended Universal-Serial-Bus (USB) connector plug and socket each have a pin substrate with one surface that supports the four metal contact pins for the standard USB interface. An extension of the pin substrate carries another 8 extension metal contact pins that mate when both the connector plug and socket are extended. The extension can be an increased length of the plug's and socket's pin substrate or a reverse side of the substrate. Standard USB connectors do not make contact with the extension metal contacts that are recessed, retracted by a mechanical switch, or on the extension of the socket's pin substrate that a standard USB connector cannot reach. Standard USB sockets do not make contact with the extension metal contacts because the extended connector's extension contacts are recessed, or on the extension of the connector pin substrate that does not fit inside a standard USB socket.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: October 21, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, David Q. Chow, Frank I-Kang Yu, Abraham C. Ma, Ming-Shiang Shen
  • Patent number: 7436677
    Abstract: Provided is an electronic device which does not require difficult machining operation to reduce a wall thickness of a case by cutting, which helps to secure a satisfactory operational efficiency for the mounting of a connector to the case, and which allows the wall thickness of the case to be set at an appropriate level. An electronic device according to the present invention includes: a case which has a dish-shaped sectional configuration and an opening and which has a recess formed in a side wall by notching from an end surface of the opening; a connector fit-engaged with the recess; and an electronic circuit board provided in the case. In the electronic device, the case, which is formed by molding, diverges toward the opening, and the connector is fitted into the recess in an axial direction of the side wall to be mounted perpendicularly to the side wall.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: October 14, 2008
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hiroyuki Noritsune, Hisanori Nobe
  • Patent number: 7426118
    Abstract: To cancel a magnetic field in an interconnection pattern of a printed wiring board. A first interconnection pattern 3a is formed on a surface 1a of an insulating substrate 1. A second interconnection pattern 5a is formed on a bottom surface 1b of the insulating substrate 1 so as to be superposed on a meandering part of the first interconnection pattern 3a when viewed from the upper surface side. An end part 5b of the second interconnection pattern 5a is electrically connected to an end part 3d of the first interconnection pattern 3a via through holes 7a. The first interconnection pattern 3a and the second interconnection pattern 5a form a single interconnection line via the through holes 7a. Accordingly, the first interconnection pattern 3a and the second interconnection pattern 5a are 180° different from each other in the direction in which current flows.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: September 16, 2008
    Assignee: Ricoh Company, Ltd
    Inventor: Kunihiro Tan
  • Patent number: 7423886
    Abstract: An electronic member capable of reducing a loss of light until reaching the end of an operation shaft and enhancing the illumination intensity at the end of the operation shaft, and a rotary electronic component constituting the electronic member. The electronic member includes a rotary electronic component having a hollow hole penetrating in a direction of a shaft, a wiring board on which the rotary electronic component is mounted, an illuminating device mounted on the wiring board at one end of the hollow hole, and a light guide body being inserted in the hollow hole and guiding light emitted from the illuminating device to another end of the hollow hole.
    Type: Grant
    Filed: February 9, 2006
    Date of Patent: September 9, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takumi Nishimoto, Jun Sugahara
  • Patent number: 7420814
    Abstract: A package stack may include a first package and a second package. The first package may have an IC chip with an active surface and a back surface. The active surface may be connected to a first major surface of a first circuit substrate. The second package may include a second IC chip with an active surface and a back surface. The back surface of the second IC chip may be attached to a first major surface of a second circuit substrate and the active surface of the second IC chip may be electrically connected to the first major surface of the second circuit substrate. The first package may be stacked on the second package so that the active surface of the second package may be electrically connected to a second major surface of the first circuit substrate of the first package. A method may involve providing a first package having a first IC chip and a first circuit substrate and providing a second package having a second IC chip and a second circuit substrate.
    Type: Grant
    Filed: April 7, 2005
    Date of Patent: September 2, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Hong Kim, Heui-Seog Kim, Wha-Su Sin, Jong-Keun Jeon
  • Patent number: 7417867
    Abstract: A printed wiring board includes a glass substrate provided with through-holes, conductive patterns provided on both surfaces of said glass substrate in such a manner as to be made conductive to each other via said through-holes, and a sealing member composed of a silver paste containing an epoxy resin as a binder provided to fill said through-holes. This printed wiring board is advantageous in that circuit parts can be connected to each other without use of any planar special region and moisture does not reach the circuit parts through the printed wiring board. A display apparatus capable of stably displaying pictures for a long-period of time is provided by using the printed wiring board.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: August 26, 2008
    Assignee: Sony Corporation
    Inventors: Yoshinari Matsuda, Yoshio Suzuki, Ryota Odake, Nobutoshi Asai
  • Patent number: 7405943
    Abstract: An electronic appliance is especially easy to assemble and includes a housing and a circuit carrier which is held in the housing. The circuit carrier is guided in the housing in a displaceable manner and is applied by at least one spring element against a housing abutment which accurately centres the circuit carrier.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: July 29, 2008
    Assignee: Siemens Aktiengesellschaft
    Inventors: Walter Apfelbacher, Annemarie Lehmeier, Johann Seitz
  • Patent number: 7391619
    Abstract: A structure of a latch for an interface card is provided. The latch has a base plate including a plurality of pins formed on two sides thereof, a horn and a spring portion. The spring portion has a supporting portion with an inclined face at a frontal side thereof, and a wing and a block respectively formed at two sides thereof. The wing and the supporting portion are bent towards opposite sides, and said spring portion has a protrusion.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: June 24, 2008
    Inventor: Ching-Yao Lee
  • Patent number: 7362586
    Abstract: Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each including a pair of opposed first side surfaces with catching grooves and a pair of second side surfaces without catching grooves when it is divided. The shielding cases are mounted on the motherboard such that the intervals A between the second surfaces of two adjacent shielding cases are equal to or less than the widths B of cutting allowances for cutting the motherboard. The motherboard is cut from the opposite side of a surface of the motherboard on which the shielding cases are mounted at predetermined positions where the second side surfaces are formed on each substrate. In this manner, the motherboard is divided into electronic components with shielding cases.
    Type: Grant
    Filed: February 2, 2005
    Date of Patent: April 22, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yoshiyuki Mashimo, Masao Uno, Toru Yaoeda
  • Patent number: 7359218
    Abstract: A cable management apparatus includes a first cable management member. A second cable management member is pivotally coupled to the first cable management member such that the first cable management member and the second cable management member are moveable between an extended position and a retracted position, whereby the second cable management member is positioned in a vertically stacked orientation above the first cable management member in the retracted position. The cable management apparatus may be coupled to an information handling system rack in order to manage the cables for an information handling system while using a minimal amount of space behind the information handling system.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: April 15, 2008
    Assignee: Dell Products L.P.
    Inventor: Allison McGrew
  • Patent number: 7355860
    Abstract: Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A cover that is hinged to the card to normally cover one set of contacts can be rotated out of the way by hand when that set of contacts is being used.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: April 8, 2008
    Assignee: SanDisk Corporation
    Inventors: Robert C. Miller, Hem P. Takiar, Joel Jacobs, Robert Howard, Motohide Hatanaka, Robert F. Wallace, Edwin J. Cuellar, Eliyahou Harari
  • Patent number: 7345892
    Abstract: In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.
    Type: Grant
    Filed: May 20, 2005
    Date of Patent: March 18, 2008
    Assignees: NEC Corporation, Renesas Eastern Japan Semiconductor, Inc., Elpida Memory, Inc.
    Inventors: Masaharu Imazato, Atsushi Nakamura, Takayuki Watanabe, Kensuke Tsuneda, Mitsuaki Katagiri, Hiroya Shimizu, Tatsuya Nagata
  • Patent number: 7336500
    Abstract: A demonstration tool for a programmable logic device is provided. The demonstration tool includes a circuit board partially disposed within a transparent block. A collar having an opening defined therein is disposed between the transparent clock and a base of the demonstration tool. The base is designed to enable access to a bottom portion of the circuit board that extends outside of the transparent block and the collar. The bottom portion of the circuit board includes connection ports to power and configure the programmable logic device. A method for embedding a printed circuit board into a housing is also provided.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: February 26, 2008
    Assignee: Altera Corporation
    Inventors: Marcus Negron, Michael Phipps