Abstract: In one aspect, the invention includes: a) forming a first opening into a substrate surface; b) forming a polysilicon layer over the substrate surface and within the first opening to a thickness which less than completely fills the first opening to leave a second opening within the first opening; c) forming a coating layer over the polysilicon layer and within the second opening; d) etching the coating layer and the polysilicon layer to remove the coating layer and the polysilicon layer from over the substrate surface and leave the coating layer and the polysilicon layer within the opening; and e) after the etching, removing the coating layer from within the opening.