Abstract: A circuit includes a memory array including memory bit cells arranged in rows and columns. A row includes differential reference bit cells and single-ended bit cells, and the reference bit cells include a first set configured to store a first binary value and a second set configured to store a second binary value different from the first binary value. The circuit also includes a control module configured to generate a first reference current and to select the given row for a read operation. The circuit additionally includes an input/output module configured to compare a sensed current of a respective single-ended bit cell of the single-ended bit cells for the read operation to a second reference current. The second reference current is based on the first reference current and respective currents of the first set of reference bit cells and the second set of reference bit cells.

Abstract: A storage device includes at least one nonvolatile memory device, and a controller configured to control the at least one nonvolatile memory device, wherein the controller includes a nonvolatile memory interface circuit configured to communicate with the at least one nonvolatile memory device through at least one channel, wherein the nonvolatile memory interface circuit includes a margin collector configured to collect margin information by comparing read data with sampling data, an on-chip margin search logic configured to track a valid window margin by adjusting an offset value based on the margin information, and a compensation calculator configured to determine off-chip variation corresponding to the offset value when the valid window margin is in a margin lock state.

Abstract: Apparatuses and techniques for logging a memory address associated with faulty usage-based disturbance data are described. In an example aspect, a memory device can detect, at a local-bank level, a fault associated with usage-based disturbance data. This detection enables the memory device to log a row address associated with the faulty usage-based disturbance data. To avoid increasing a complexity and/or a size of the memory device, some implementations of the memory device can perform the address logging at the multi-bank level with the assistance of an engine, such as a test engine. The memory device stores the logged address in at least one mode register to communicate the fault to a memory controller. With the logged address, the memory controller can initiate a repair procedure to fix the faulty usage-based disturbance data.

Abstract: A semiconductor device according to an embodiment includes a plurality of sampler circuits configured to receive a plurality of offset clock signals or a plurality of divided clock signals and to sample a data signal in response to each of a plurality of divided clock signals. A calibration circuit applies a first offset clock signal to a first sampler circuit, applies a second offset clock signal having an opposite phase to the first offset clock signal to a second sampler circuit, and generates a first offset adjustment signal for adjusting an offset of the first sampler circuit based on an output of the first sampler circuit that is output in response to the first offset clock signal.

Abstract: A semiconductor system may include a semiconductor device, a controller configured to control the semiconductor device through an in-band interface, and a baseboard management controller configured to control the semiconductor device through a side-band interface, wherein the semiconductor device is configured to control a training operation for in-band signals that are received through the in-band interface based on side-band signals that are received through the side-band interface.

Abstract: The present disclosure relates to a synapse circuit (202) for a Bayesian neural network, the synapse circuit comprising: a first resistive memory device (302) coupling a first voltage rail (Vread) to a first terminal of a capacitor (308), the first terminal of the capacitor (308) being coupled to a second voltage rail via a variable conductance (306); and a second resistive memory device (304) coupling a second voltage rail (Vdata) to an output line (312) of the synapse circuit (202), wherein a second terminal of the capacitor (306) is coupled to a terminal of the second resistive memory device (304).

Abstract: The memory device includes a memory block with an array of memory cells that are arranged in edge word lines and non-edge word lines. Some of the word lines are in a first group to be erased in a first pulse and the others are in a second group to be erased in a second pulse. Circuitry is configured to erase the memory cells. In the first erase pulse, the circuitry applies a first inhibit voltage to the non-edge word lines of the second group and applies a higher second inhibit voltage to the edge word lines of the second group. In the second erase pulse, the circuitry applies the first inhibit voltage to the non-edge word lines of the first group and applies the higher second inhibit voltage to the edge word lines of the second group.

Abstract: Examples of the present disclosure disclose a memory device, a memory system, a memory controller and an operating method, the memory device includes: a preset number of the memory cells form one code word, and the multiple storage bits correspond to multiple pages respectively; at least one page corresponds to multiple stages, the multiple stages include a first stage and a second stage, and the read voltage corresponding to the second stage is less than the read voltage in the first stage; peripheral circuit coupled to the array of memory cells and configured to: obtain the target valley voltage in the first target stage; take the target valley voltage as a read voltage at which a read operation is performed on the at least one code word; and obtain the predicted valley voltage in the second target stage in accordance with the target valley voltage in the first target stage.

Abstract: A semiconductor device includes a memory cell array and a peripheral circuit. The memory cell array is coupled to a plurality of word lines and a plurality of bit lines. The peripheral circuit performs a deep-erase verification operation to determine whether a target memory cell has a threshold voltage that is lower than a first negative reference voltage by applying a second negative reference voltage that is lower than the first negative reference voltage to the target memory cell.

Abstract: Technology for in-memory computing. NAND memory cells are organized into calculation cell units based on one or more physical and/or operational characteristics of the NAND memory cells. Variances in physical and/or operational characteristics of the NAND memory cells in a calculation cell unit can negatively impact accuracy of the in-memory compute. NAND memory cell transistors that are similar to each other in the one or more physical and/or operational characteristics are placed into a calculation cell unit even if those memory cells are not adjacent to each other. Two memory cell transistors of one calculation cell unit may be separated by at least one memory cell transistor of a different calculation cell unit. Organizing NAND memory cell transistors into calculation cell units based on one or more physical and/or operational characteristics improves accuracy of NAND in-memory compute.

Abstract: Control logic in a memory device initiates a program operation including a first phase including applying a ramping voltage level to a set of wordlines of a memory device to boost a set of pillar voltages and a second phase including applying a set of programming pulses to a wordline associated with one or more memory cells of the memory device to be programmed to a set of programming levels, wherein each programming level of the set of programming levels is programmed by each programming pulse. During the first phase of the program operation, a first voltage applied to a drain-side select line (SGD) is adjusted from a first SGD voltage level to a second SGD voltage level.

Abstract: A non-volatile memory device includes a plurality of cell strings in a vertical direction, each of the plurality of cell strings including a plurality of memory cells respectively connected to a plurality of word lines, and an erase control transistor having a first end connected to at least one of both ends of plurality of memory cells and a second end connected to at least one of both ends of each of the plurality of cell strings, and a row decoder configured to apply a first bias voltage to the plurality of word lines in a first period in which an erase voltage applied to the second end of the erase control transistor increases to a target level and to apply a second bias voltage higher than the first bias voltage to at least some of the plurality of word lines in a second period after the first period.

Abstract: A device includes a first current mirror circuit including a plurality of first transistors, the plurality of first transistors including a common gate configured to receive a decoding signal according to a number of fail bits that are program-failed, a second current mirror circuit including a plurality of second transistors including a common gate configured to receive a reference current signal and a plurality of resistors respectively electrically connected to respective first terminals of the second transistors, and a comparison circuit configured to determine a compared result by comparing a first voltage corresponding to the decoding signal with respective ones of a plurality of second voltages output from the second current mirror circuit and configured to output a count signal corresponding to the compared result.

Abstract: Examples of programming circuits and methods are provided. In one example, an adjustable programming circuit comprises a first adjustable voltage divider; a second adjustable voltage divider; a first operational amplifier, wherein an output terminal of the first operational amplifier provides a first programming voltage; and a second operational amplifier, wherein the first input terminal of the second operational amplifier is coupled to the output terminal of the second operational amplifier and the first input terminal of the second operational amplifier is coupled to the second output terminal of the first adjustable voltage divider.

Abstract: The present disclosure relates to storage devices. An example storage device includes a nonvolatile memory device that includes a plurality of memory blocks, and a memory controller that controls the nonvolatile memory device. The memory controller performs a soft erase operation on a first memory block among the plurality of memory blocks, measures a first cell count by applying a first reference voltage to a plurality of first memory cells selected in advance from a plurality of memory cells of the first memory block after performing the soft erase operation, generates a first health index associated with a retention characteristic of the first memory block based on the first cell count, and performs a reliability management operation on the first memory block based on the first health index.

Abstract: A method for partial block read compensation can include receiving a read request that specifies a memory cell connected to a string of series-connected memory cells in an array of memory cells on a memory device, the string located at an intersection of a wordline and a bitline, and causing a first voltage applied to the wordline to which the specified memory cell is connected to ramp to a first predetermined value. The method can include causing a second voltage applied to the bitline to which the specified memory cell is connected to ramp to a second predetermined value, and can include comparing, using a current comparator, a current along the string with a reference current to generate an analog output signal. It can also include causing a voltage offset, based on the analog output signal, to be applied to a read voltage level during a sensing operation.

Abstract: Disclosed herein is a semiconductor memory device. Provided is the semiconductor memory device includes a first device layer storing thermal energy and a second device layer being made of a material whose electrical properties are changed by the thermal energy, wherein the first device layer stores thermal energy if a voltage is applied to the second device layer. Since the device is composed of a material that is changed electrical characteristics by heat and a material that stores heat, it may be read as a current applied to the read voltage without applying other refresh voltage. In addition, there is no leakage current flowing through the device depending on the characteristics of the device, so additional circuit elements such as transistors and selectors are not required. The device has a fast-switching mechanism but does not cause leakage current thereby not showing resistance drift due to repetitive switching.

Abstract: A circuit including: a memory cell connected to a first power supply configured to supply a first power supply voltage; a first bleeder transistor coupled between a first node of the memory cell and ground; and a second circuit coupled to a gate electrode of the first bleeder transistor and configured to supply a bleeder signal to control the first bleeder transistor in response to a drop in the first power supply voltage, wherein the first bleeder transistor is configured to discharge the memory cell in response to receiving the bleeder signal.

Abstract: Methods, systems, and devices for techniques for parallel memory cell access are described. A memory device may include multiple tiers of memory cells. During a first duration, a first voltage may be applied to a set of word lines coupled with a tier of memory cells to threshold one or more memory cells included in a first subset of memory cells of the tier. During a second duration, a second voltage may be applied to the set of word lines to write a first logic state to the one or more memory cells of the first subset and to threshold one or more memory cells included in a second subset of memory cells of the tier. During a third duration, a third voltage may be applied to the set of word lines to write a second logic state to the one or more memory cells of the second subset.

Abstract: A circuit is provided. The circuit includes an array of memory cells including a plurality of bit lines and a plurality of word lines, sensing circuits configured to sense a difference between first and second currents on respective bit lines in selected bit lines and to produce outputs for the selected bit lines as a function of the difference, and a global counter configured to continuously provide a count value to each of the sensing circuits in dependence on a clock signal. Each sensing circuit, of the sensing circuits, can produce an output in dependence on (i) the difference between the first and second currents and (ii) a stored count value received from the global counter, the count value being stored in dependence on a value of the difference between the first and second currents.