Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than ?40° C.

Abstract: The present invention relates to a liquid adhesive composition comprising a partly hydrolyzed protein component, having a degree of hydrolysis (DH) in the range 0.2-2; a metal silicate component; optionally, an exogenic protein hydrolyzing component; and wherein the liquid adhesive composition has a solid content in the range 15-80% by weight.

Abstract: A method for making a pet urinal pad having deammoniation function and high saline water absorption ability comprising the following steps: (A) milling and sieving natural zeolites to obtain zeolite powder having a particle size smaller than 100 microns; (B) immersing the zeolite powder into 1 mol/L sulfuric acid to process for 10-60 minutes under a processing temperature of 50-80° C.; performing vacuum filtration and drying on the processed zeolite powder to obtain acidulated zeolite; (C) adding 2-10 parts of acidulated zeolite into 100 parts of super absorbent resin, thoroughly and uniformly mixing to obtain a mixture; (D) attaching the mixture formed in step (C) to wood pulp paper to form a deodorization water absorption layer; and (E) covering the deodorization water absorption layer with a PE film as the backsheet and a non-woven fabric as the topsheet to form the pet urinal pad having the deammoniation function and the high saline water absorption ability.

Abstract: Adhesive compositions using modified diphenylmethane diisocyanate are disclosed along with methods and articles using the adhesive compositions. The adhesive compositions are especially suited for making flexible laminates for use in food packaging.

Abstract: A crystal oscillator fabrication method includes depositing mounting cement onto first and second mounting pads on a substrate to thereby define first and second electrode adhesion bumps. First and second electrodes of a crystal oscillator are electrically connected to the first and second mounting pads by contacting the first and second electrodes to the first and second electrode adhesion bumps and then curing the adhesion bumps. Next, mounting cement is deposited onto the first electrode and onto a portion of the first electrode adhesion bump to thereby define a top electrode adhesion extension. The top electrode adhesion extension is then cured.

Abstract: The present disclosure relates to silane reactive hot melt adhesive compositions including acid functional wax and basic functional wax; the production of such adhesives; and the use of such adhesives. The silane reactive hot melt adhesive compositions have improved green strength as compared to silane reactive hot melt adhesive compositions without the acid functional wax and basic functional wax.

Abstract: A composition comprising: a one part adhesive composition comprising a) one or more isocyanate functional components; b) one or more catalysts for the reaction of isocyanate groups with active hydrogen containing groups; c) one or more fillers which do not enhance the formation of voids during curing; d) one or more fillers having basic character; and a cure accelerator comprising: e) one or more liquid carriers; f) water; and g) one or more paste forming agents. The one part adhesive composition may be used alone where ambient temperature and humidities afford reasonably rapid cure rates. The cure accelerator may be used when temperatures and/or humidities are sufficiently low such that the cure rate of the adhesive alone is not acceptable for a particular use.

Abstract: The invention relates to a process for bonding a silicone or silicone based material to a polyurethane and use of the bonded silicone-polyurethane in the manufacture of biomaterials, devices, articles or implants, in particular long term implantable medical devices in the fields of cardiology, orthopedics, plastic surgery and gastroenterology. The process involves the steps of (a) flame treating a surface of the silicone or silicone based material and (b) bonding the polyurethane to the flame treated surface of the silicone or silicone based material.

Abstract: A composition comprising: a) one or more isocyanate functional components; b) one or more compounds containing a cycloaliphatic tertiary amine: c) one or more low functional acrylate containing components having about 1 to 4 acrylate groups per molecule; d) one or more high functional acrylate containing components having 5 to about 10 acrylate groups per molecule; and e) one or more compounds containing a peroxide group; wherein the composition is a two component composition and components a) and b) are kept separate from component e) until cure is desired. The composition may be utilized as an adhesive.

Abstract: A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

Abstract: A sealing liquid for sealing mail pieces contains water and a penetration agent. The sealing liquid is applied by letter-closing devices and franking machines containing such a sealing liquid. Once sealed, the opening of the letter produces a pronounced pattern so that it is clear that the letter has been opened. Therefore any attempts to reseal the once opened enveloped are easily detected.

Abstract: A solid dry to the touch at ambient temperature structural adhesive which can be cured at elevated temperature and which can be molded at an intermediate temperature is provided as well as the use of the adhesive for bonding metals.

Abstract: The use of an aqueous polyurethane dispersion adhesive is described for producing biodisintegratable composite foils where at least two substrates are adhesive-bonded to one another with use of the polyurethane dispersion adhesive, where at least one of the substrates is a biodisintegrable polymer foil. At least 60% by weight of the polyurethane is composed of diisocyanates, polyesterdiols, and at least one bifunctional carboxylic acid selected from dihydroxycarboxylic acids and diaminocarboxylic acids.

Abstract: The present invention relates to a process for producing a solar module comprising one or more solar cell(s) encapsulated in a polymer matrix, wherein the process comprises applying a matrix composition to one or more solar cell(s) such that the one or more solar cell(s) is/are surrounded by a continuous layer of matrix composition and polymerizing the matrix composition in order to form a polymer matrix encapsulating the one or more solar cell(s), wherein the matrix composition is a structurally viscous liquid which comprises a polymerizable compound for forming the matrix and has a yield point, and to the thus obtainable solar modules.

Abstract: Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.

Abstract: Adhesive for adhering synthetic and/or metal substrates, selected from liquid or thermoplastic adhesives which have urethane groups in the polymer chain, wherein the adhesive is selected from NCO-reactive adhesives, silane-reactive adhesives or thermoplastic polyurethanes (TPU) and include as a constituent 0.01 to 10 wt. % of at least one compound (H) having a molecular weight of less than 500 g/mol, which compound has at least one sulphonamide group having an SO2—NH—C(O) structure or at least one amidosulphonate group.

Abstract: Adhesives having high tensile strength are prepared from moisture-curable alkoxysilyl-terminated polyurethanes.

Abstract: The invention provides for an adhesive composition that can both be used as melt adhesive composition and as drying adhesive composition. Such an adhesive composition comprises a thermoreversible gelling starch, a bonding starch and a plasticizer.

Abstract: A method of forming a bonded part with a press-fit, vulcanized rubber member residing in compression between two rigid members and bonded thereto. The rubber member is a laminate with a core layer between two self-bonding rubber layers. The bonded part may be, for example, a vibration damper, isolator or absorber. The core layer and the self-bonding layers may have the same primary elastomer and cure system type, and the self-bonding layers have an adhesion promoter not present in the core layer. The adhesive layers may be from 0.05 to 1 mm thick or from 5% to 10% of the laminate thickness. The method includes forming a rubber core layer, curing it, applying a rubber adhesive layer on each side to form a laminate, inserting the laminate between two rigid members under compression, and post-curing to form a bonded part. The adhesive layers may be partially cured before inserting.

Abstract: The present invention relates to a process for providing an extended tubular article or one or more sections of the extended tubular article with a corrosion protecting system, wherein (a) a layer of an adhesive composition is applied to the surface of the extended tubular article or the one or more sections of the extended tubular article, and (b) a corrosion protecting layer is applied to the layer of the adhesive composition, the adhesive composition comprising a polyolefin blend, wherein the polyolefin blend comprises 30% to 100% by weight of a polyisobutene and 0% to 70% by weight of an olefin polymer, based on the total weight of the polyolefin blend, wherein said polyisobutene is has a glass transition temperature of lower than ?40° C. and a number average molecular weight Mn of 1300 to 1.000.000.