Patents Examined by Darrell L. Clay
  • Patent number: 4000054
    Abstract: This invention is a structure of, and method of forming, a thin film conductor which crosses either a thin film or thick film glazed circuit underlying structure. A selected low temperature curing insulative dielectric is disposed over a conductor which is to be crossed, and a thin film conductor passes over the dielectric and is in contact with ends of two other conductors, providing a conductive bridge over, and insulated from the underlying conductor.
    Type: Grant
    Filed: March 2, 1972
    Date of Patent: December 28, 1976
    Assignee: Microsystems International Limited
    Inventor: Gabriel Marcantonio
  • Patent number: 3975581
    Abstract: Transmission lines using tubular extendible elements in which two such elements are combined to form a coaxial type transmission line or a two-wire transmission line and in which a single element is constructed as a two-wire transmission line and tubular extendible elements and other structures using materials having various temperature coefficients.
    Type: Grant
    Filed: September 24, 1973
    Date of Patent: August 17, 1976
    Inventor: Herman Lowenhar
  • Patent number: 3969572
    Abstract: A low-cost electromagnetic interference (EMI) gasket for light-weight equipment enclosures. A pliable strip of electrically conductive material is wrapped spirally about a flexible laminar core structure comprising foam and permanent magnet elements. The gasket is emplaced between two conductive surfaces forming portions of an EMI shield, one of which surfaces is attractive to the magnetic element of the gasket.
    Type: Grant
    Filed: March 5, 1975
    Date of Patent: July 13, 1976
    Assignee: NCR Corporation
    Inventor: Paul M. Rostek
  • Patent number: 3967371
    Abstract: A method of manufacturing multilayer interconnections for interconnecting veral mutually insulated groups of contact zones formed on an integrated circuit semiconductor chip is provided.The adjacent superimposed interconnection films are separated by an insulating film of a metal oxide produced by the total oxidation of a metal film deposited on the chip prior to the formation of the top layer of interconnections. The metal deposited at the locations of the contact zones is protected against oxidation so that the contact zones are all times accessible at the surface.
    Type: Grant
    Filed: August 21, 1973
    Date of Patent: July 6, 1976
    Assignee: Sescosem- Societe Europeenne des Semi-Conducteurs et de Microelectronique
    Inventors: Michel Croset, Noel Nouailles
  • Patent number: 3967049
    Abstract: A mounting strap for mounting an electrical wiring device, such as a switch, having apertures at both ends for receiving mounting screws. The apertures have resilient lips which engage the threaded portion of the screws to prevent the free movement thereof. The mounting strap is adapted to fit on a mounting box with the electrical wiring device located within the mounting box.
    Type: Grant
    Filed: February 27, 1975
    Date of Patent: June 29, 1976
    Assignee: Sola Basic Industries, Inc.
    Inventor: Burkhard A. Brandt
  • Patent number: 3962550
    Abstract: Joints in electromagnetic wave shields, such as between access doors and the door frames of the shield housings or jackets are electrically bridged by means of contact springs which are generally V-cross-section having base portions clamped at one side of the joint and provide contact edges which engage in efficient electrical contact with the opposite side of the joint. Advantageous construction, insulation and attachment of the clamps for the springs are provided for. Improved functioning of the sealing spring system is attained by use of soft magnetic material in the clamps, in association with the clamps, or in connection with the joint profile structure.
    Type: Grant
    Filed: July 12, 1973
    Date of Patent: June 8, 1976
    Assignee: Siemens Aktiengesellschaft
    Inventor: Hans-Peter Kaiserswerth
  • Patent number: 3959876
    Abstract: A method enabling the improving of the connections of printed circuits or the like by preventing the accumulation of droplets of metal alloy at selected connection points of conductive strips disposed on at least one surface of insulating insualting planar support member of the printed circuit. The method includes forming sharp appendages of the strips at selected connection points of the strips which appendages point in substantially the same direction and are located proximate to the selected connection points. Upon applying a film of metal alloy over the conductive strips, the sharp appendages serve for driving the excess metal alloy away from the selected connection points under the action of surface-tension during the formation of the film of metal alloy on the strip.
    Type: Grant
    Filed: July 14, 1975
    Date of Patent: June 1, 1976
    Assignee: Compagnie Industrielle des Telecommunications Cit-Alcatel
    Inventor: Jean-Pierre Jouanneault
  • Patent number: 3959579
    Abstract: An apertured wafer of semi-conductive material having at least one circuit thereon is mounted on a substrate having alternating layers of insulating and conductive material. Wiring connections between the circuit and the layers of conductive material extend through the aperture as well as over the periphery to shorten the length of the wiring connections.
    Type: Grant
    Filed: August 19, 1974
    Date of Patent: May 25, 1976
    Assignee: International Business Machines Corporation
    Inventor: Alfred H. Johnson
  • Patent number: 3953664
    Abstract: An improved printed circuit board has an electrically insulating board which is made of a base containing synthetic resin, and has at least two conductors, one conductor being on one surface of said circuit board and the other conductor being on the opposite surface of the circuit board. At least one hole extends therethrough, and a conductive layer extends through the hole and covers at least part of the surface of the conductors for connecting the conductors on both surfaces of the circuit board through said hole. A filler composed of electrically insulating resin fills the hole and covers the surface of the layer for providing a highly reliable electrical connection between the two conductors on both surfaces of the circuit board.
    Type: Grant
    Filed: October 25, 1974
    Date of Patent: April 27, 1976
    Assignee: Matsushita Electric, Wireless Research Laboratory
    Inventor: Eiichi Tsunashima
  • Patent number: 3953662
    Abstract: A container for a mechanical filter is provided in which the internal pressure is reduced to prevent propagation in the air of sound waves to thereby prevent deterioration of the filter characteristics. A recess with an aperture therethrough is formed in one of the walls of a metal casing which constitutes the container. Further, an adhesive tape-like member is disposed on the surface of the recess in such a manner as to cover the aperture. After the casing has been evacuated through the aperture, hermetic sealing means is provided on the adhesive tape-like member within the recess.
    Type: Grant
    Filed: December 30, 1974
    Date of Patent: April 27, 1976
    Assignee: Kokusai Electric Co., Ltd.
    Inventors: Toshio Nagashima, Ichiro Imaguchi, Shigeo Igarashi
  • Patent number: 3953663
    Abstract: Relates to printed circuit boards which are devoid of electrical discontinuities likely to arise in the production of two-sided circuit boards having plated-through-holes and solder fillets therein for improving the electrical interconnections. Research disclosed that the cause of these discontinuities lay in the material of the boards surrounding the holes which either included entrapped gas or matter vaporizable under the high temperatures of the liquid solder applied to fill the holes and which impaired the attainment of reliable plated-through-hole connections. A vacuum evaporation operation is incorporated in the fabrication of printed circuit boards and the like and found highly useful and efficient in the production of reliable hole connections in the boards substantially reducing if not completely eliminating any need to apply solder touch-ups to the boards thereafter. Specifically, the boards are treated prior to the soldering of the plated-through-holes to a temperature of approximately
    Type: Grant
    Filed: January 2, 1973
    Date of Patent: April 27, 1976
    Assignee: Burroughs Corporation
    Inventor: William G. Kelhm, Jr.
  • Patent number: 3950603
    Abstract: An enclosed modular circuit component is immobilized against deleterious movement due to high impact, shock and vibration movement. A two-piece enclosure case for securely immobilizing a wide variety of readily available modular circuit components is easy to fabricate and utilize with the components. The enclosure case comprises two halves each of which has a top and a bottom, respectively, with two oppositely disposed side walls projecting therefrom. At least one half of the case has a ledge upon which the circuit component header, such as an element support board or a printed circuit board, may be supported. The other half of the case is then provided with means to urge the board against the ledge so that when the two halves are placed together the component is sandwiched between them in a secured immobile relationship. The component elements may be maintained spaced from contact with the enclosure interior surfaces.
    Type: Grant
    Filed: January 23, 1975
    Date of Patent: April 13, 1976
    Assignee: Analog Devices, Incorporated
    Inventor: Paul C. Brefka
  • Patent number: 3949274
    Abstract: A three dimensional micro electronic module packaged for reduced signal propagation delay times includes a plurality of circuit carrying means, which may comprise unbacked chips, with integrated superconductive circuitry thereon. The circuit carrying means are supported on their edges and have contact lands in the vicinity of, or at, the edges to provide for interconnecting circuitry. The circuit carrying means are supported by supporting means which include slots to provide a path for interconnection wiring to contact the lands of the circuit carrying means. Further interconnecting wiring may take the form of integrated circuit wiring on the reverse side of the supporting means. The low heat dissipation of the superconductive circuitry allows the circuit carrying means to be spaced approximately no less than 30 mils apart. The three dimensional arrangement provides lower random propagation delays than would a planar array of circuits.
    Type: Grant
    Filed: May 30, 1974
    Date of Patent: April 6, 1976
    Assignee: International Business Machines Corporation
    Inventor: Wilhelm Anacker
  • Patent number: 3946144
    Abstract: A cable junction has a longitudinally subdivided housing having two connected shell sections which together surround an interior splicing chamber. A pair of shell inserts of fluid-impermeable material is accommodated in the housing about the splicing chamber and they have respective outwardly projecting juxtaposed marginal flanges which are jointly formed with a longitudinal channel bounded at its opposite lateral sides by respective juxtaposed surface portions of the flanges. A strand of sealing material is accommodated in compressed state in this channel.
    Type: Grant
    Filed: June 26, 1974
    Date of Patent: March 23, 1976
    Assignee: Wilhelm Quante Spezialmaschinenfabrik fur Apparate der Fernmeldetechnik
    Inventor: Hermann Quante
  • Patent number: 3946145
    Abstract: A system for electrically terminating two or more insulated or uninsulated wires comprising forming a terminal about the wires with a ram and die cavity such that the terminal and wire configuration cross sectional profile is elongated in one direction, withdrawing the ram and die and engaging the terminal with a pair of electrodes to fuse the same under pressure and heat such that the terminal and wire configuration cross sectional profile becomes elongated in a direction generally perpendicular to said first direction.
    Type: Grant
    Filed: December 10, 1973
    Date of Patent: March 23, 1976
    Inventor: Samuel Warner
  • Patent number: 3946143
    Abstract: A heat recoverable article for shielding junctions in cables or conduits comprised of a corrugated sheath capable of radial deformation disposed within a member of heat-recoverable material. A sheath made of conductive material may function to protect the junction from radio frequency interference. The end of the member may be provided with adhesive to render the junction impermeable to water, gases, etc.
    Type: Grant
    Filed: September 9, 1974
    Date of Patent: March 23, 1976
    Assignee: Raychem Limited
    Inventor: Robert H. McLoughlin
  • Patent number: 3944721
    Abstract: A device for splicing multiconductor wires is provided to achieve splices of balanced length whereby each conductor of the wire carries a substantially equal tensile load. First and second crimp barrels are mounted in a frame having shoulders at opposite ends. Stripped wire conductors are respectively inserted at each end and the conductors are crimped in the barrels. The frame is dimensioned to provide substantially equal tensile loading on each conductor of the wire.
    Type: Grant
    Filed: July 16, 1974
    Date of Patent: March 16, 1976
    Assignee: Raychem Corporation
    Inventor: Larry R. Reeder
  • Patent number: 3944317
    Abstract: An adapter for converting a non-repairable electrical cable connection into one which is repairable. The cable connection is the type in which a wire bundle is enclosed within a braided shield which is permanently terminated to a backshell, the backshell being threadedly secured by a coupling nut to a connector to which the wire bundle is terminated. The adapter comprises a pair of semi-circular adapter sections which combine to form a cylindrical adapter which fits around an unshielded portion of the wire bundle between the backshell and connector. The adapter has external threading at one end for connection to the backshell. A second coupling nut slidably mounted around the adapter connects the opposite end of the adapter to the connector. The second coupling nut is removable from around the adapter to permit the adapter sections to be separated and removed from around the unshielded portion of the wire bundle.
    Type: Grant
    Filed: January 13, 1975
    Date of Patent: March 16, 1976
    Assignee: Amex Systems, Inc.
    Inventor: Robert C. Oberdiear
  • Patent number: 3944719
    Abstract: Wire routing guides are used on circuit boards employing solder pads plated onto the reverse side of an insulative board in an orthogonal array and connected to aligned conductive areas on the obverse side by plated-through holes. The wire routing guides, having upstanding fingers, are mounted on the reverse side of the board with conductive pins from electrical components extending through the holes in the board from the obverse side to the reverse side. Insulated wire is threaded around the wire routing guides and pins of the electrical components and guided in accordance with a predetermined pattern of component interconnections. For interconnections between points on the board, wire is threaded substantially orthogonally.
    Type: Grant
    Filed: January 25, 1974
    Date of Patent: March 16, 1976
    Assignee: United Wiring and Manufacturing Co.
    Inventor: Ulyss Ray Rubey
  • Patent number: 3943272
    Abstract: The fitting is mountable on a cellular steel floor or deck prior to pouring of the concrete of a completed floor and comprises a separable flat base plate, a box-like housing, and a cover plate. Two self-grommeted openings in the base plate are axially aligned with respective openings of substantially equal size leading to adjacent cells of the deck, and a tab on the base plate at one of the grommeted openings interlocks with the deck to hold the base plate in position. Horizontally directed slots formed in the base plate along one longitudinal edge thereof cooperate selectively with tabs on the lower longitudinal edges of the housing to lock the housing on the base plate selectively in either of two positions. Screws or rivets may be used as additional fastening means for the base plate and housing.
    Type: Grant
    Filed: March 5, 1975
    Date of Patent: March 9, 1976
    Assignee: Square D Company
    Inventors: James C. Carroll, Johnny R. Curry, George N. Jorgensen, Frank D. King, Gilbert A. McGoldrick