Abstract: A system and method for controlling a temperature of a device during testing with a thermal controller and a heat exchanger includes measuring an instantaneous power consumption of the device during testing. The heat exchanger is controlled with the thermal controller using the measured instantaneous power consumption by the device to regulate the temperature of the device during testing, wherein the heat exchanger is in conductive contact with the device.

Abstract: Method and apparatus for in-circuit socket testing that includes a module, a printed circuit board, and a test fixture. The module contains two or more switching devices. The module is electrically attachable to a socket. The printed circuit board contains a footprint for insertion of all pins of the socket. The test fixture is electrically connected to all pins of the socket through the printed circuit board. The test fixture supplies power and ground to power pins and ground pins of the socket. Open connections to pins of the socket are detected by monitoring the pins after connecting a signal pin to a ground pin through one switching devices or connecting the signal pin to a power pin through a second switching device.